OSD335x Family
Rev. 14 2/16/2018
Introduction
The OSD335x Family of System-In-
Package (SIP) products are building blocks
designed to allow easy and cost-effective
implementation of systems based on Texas
Instruments’ powerful Sitara™ AM335x line
of processors. The OSD335x integrates the
AM335x along with the TI TPS65217C
PMIC, the TI TL5209 LDO, up to 1 Gigabyte
of DDR3 Memory, and resistors, capacitors,
and inductors all into a single 27mm x
27mm design-in-ready package.
With this level of integration, the OSD335x
Family of SIPs allows designers to focus on
the key aspects of their system without
spending time on the complicated high-
speed design of the processor/DDR3
interface or the PMIC power distribution. It
also reduces the overall size and complexity
of the design and the supply chain. The
OSD335x can significantly decrease the
time to market for AM335x-based products.
OSD335x Block Diagram
•
•
PWR Out: 1.8V, 3.3V and SYS
AM335x I/O Voltage: 3.3V
Benefits
•
•
•
•
•
•
•
Integrates over 100 components into
one package
Compatible with AM335x
development tools and software
Wide BGA ball pitch allows for low-
cost assembly.
Significantly reduces design time
Decreases layout complexity
35% reduction in board space vs
discrete implementation
Increased reliability through reduced
number of components
Features
•
TI AM335x, TPS65217C, TL5209,
DDR3, and over 140 Passive
components integrated into a single
package
TI AM335x Features:
o
ARM® Cortex®-A8 up to 1GHz
o
8 channel 12-bit SAR ADC
o
Ethernet 10/100/1000 x2
o
USB 2.0 HS OTG + PHY x2
o
MMC, SD and SDIO x2
o
LCD Controller
o
SGX 3D Graphics Engine
o
PRU Subsystem
Access to All AM335x Peripherals:
CAN, SPI, UART, I2C, GPIO, etc.
Up to 1GB DDR3
PWR In: AC Adapter, USB or Single
cell (1S) Li-Ion / Li-Po Battery
•
Package
•
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400 Ball BGA (27mm X 27mm)
20 X 20 grid, 1.27mm pitch
Temp Range: 0 to 85°C, -40 to 85°C
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Copyright 2016-2018
2
OSD335x Family
Rev. 14 2/16/2018
Table of Contents
1
2
3
4
Revision History ....................................................................................... 4
Block Diagram ......................................................................................... 5
2.1
Passives ........................................................................................... 6
Product Number Information ........................................................................ 8
Reference Documents ............................................................................... 10
4.1
4.2
5
5.1
5.2
5.3
5.4
6
6.1
6.2
7
7.1
Data Sheets ...................................................................................... 10
Other Reference ................................................................................ 10
Ball Description ................................................................................. 17
AM335x Relocated Signals ..................................................................... 20
Not Connected Balls ............................................................................ 20
Reserved Signals ................................................................................ 21
AM335x Processor ............................................................................... 22
I/O Voltages ................................................................................ 22
DDR3 Memory.................................................................................... 22
Input Power...................................................................................... 24
VIN_AC ...................................................................................... 24
VIN_USB ..................................................................................... 24
VIN_BAT..................................................................................... 24
SYS_VOUT: Switched VIN_AC, VIN_USB, or VIN_BAT ................................. 24
SYS_VDD1_3P3V............................................................................ 25
SYS_VDD2_3P3V............................................................................ 25
SYS_RTC_1P8V ............................................................................. 25
SYS_VDD_1P8V ............................................................................. 25
SYS_ADC_1P8V ............................................................................. 25
VDDSHV_3P3V .............................................................................. 25
VDDS_DDR .................................................................................. 25
Octavo Systems LLC
Copyright 2016-2018
Ball Map ............................................................................................... 11
OSD335x Components ............................................................................... 22
6.1.1
Power Management .................................................................................. 24
7.1.1
7.1.2
7.1.3
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.3
7.3.1
7.3.2
Output Power ................................................................................... 24
Internal Power .................................................................................. 25
3
OSD335x Family
Rev. 14 2/16/2018
7.3.3
7.3.4
7.3.5
7.4
7.5
VDD_MPU ................................................................................... 26
VDD_CORE .................................................................................. 26
VDDS_PLL ................................................................................... 26
Total Current Consideration .................................................................. 26
Control and Status .............................................................................. 27
Minimum Processor-PMIC interface Connections ..................................... 27
Minimum RTC Power Connections....................................................... 29
7.5.1
7.5.2
8
9
Electrical & Thermal Characteristics .............................................................. 30
Packaging Information............................................................................... 31
9.1
9.2
9.3
Mechanical Dimensions ........................................................................ 31
Reflow Instructions ............................................................................. 32
Storage Recommendations .................................................................... 32
Octavo Systems LLC
Copyright 2016-2018
4
OSD335x Family
Rev. 14 2/16/2018
1 Revision History
Revision Number
1
2
3
4
Revision Date
5/6/2016
5/15/2016
5/19/2016
6/12/16
Changes
Initial Release
Updated Misprint on ADC Specs on
first page
Added Information on the MSL Rating
Added reference to TI Handling
Recommendations to Handling
Section. Fixed Link
Updated Electrical Characteristics add
Thermal information. Also changed
operating temperature from junction to
case
Updated Max Current and Voltage in
Output Power and Electrical & Thermal
Characterization Sections
Updated Block Diagram. Highlighted
that the processor I/Os are tied to 3.3V
Updated Block Diagrams. Updated
Bake Time in the Package Section.
Updated to include discussion around
the functionality of the TL5209 when
the OSD335x is powered from VBAT
Added Industrial Temperature.
Added requirements for input voltage
rise time and minimum interface
connections
Updated SYS_VDD2_3P3V current
limit
Updated page numbers to match PDF
page numbers
Updated voltage measurements
Author
Greg Sheridan,
Kevin Troy
Greg Sheridan
Greg Sheridan
Greg Sheridan
5
12/5/16
Neeraj Dantu,
Greg Sheridan
6
2/15/17
Neeraj Dantu
7
8
9
6/19/2017
6/30/2017
7/21/2017
Greg Sheridan
Greg Sheridan
Neeraj Dantu
10
11
08/23/2017
10/12/2017
Erik Welsh
Neeraj Dantu
12
13
14
11/21/2017
1/27/2018
02/16/2018
Greg Sheridan
Greg Sheridan
Neeraj Dantu
Octavo Systems LLC
Copyright 2016-2018
5
OSD335x Family
Rev. 14 2/16/2018
2 Block Diagram
The OSD335x family of devices consist of 4 main components serving 3 different functions.
The main processor is a Texas Instruments Sitara™ AM335x ARM® Cortex®-A8. The power
system has 2 devices from Texas Instruments, the TPS65217C Power Management IC (PMIC)
and the TL5209 LDO. The last main component is up to 1GB DDR3 system memory. Figure
2.1 shows a detailed block diagram of the OSD335x and breaks out the key functions of the
AM335x processor.
Figure 2.1. OSD335x Detailed Block Diagram
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