型号
- 型号
- 关键词
EE PLD, 10ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20
厂商名称：AMD(超微)
厂商官网：http://www.amd.com
下载文档| 型号 | PALCE16V8H-10E5/BRA | 5962-8983902RA | 5962-89839022A | 5962-89839032A | 5962-8983901RA | 5962-8983903RA | 5962-89839012A | PALCE16V8H-10E5/B2A | PALCE16V8H-15E5/B2A | PALCE16V8H-15E5/BRA |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 10ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 | EE PLD, 20ns, CMOS, CDIP20, 0.250 X 1.166 INCH, CERAMIC, DIP-20 | EE PLD, 20ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 | EE PLD, 15ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 | EE PLD, 55ns, CMOS, CDIP20, 0.250 X 1.166 INCH, CERAMIC, DIP-20 | EE PLD, 15ns, CMOS, CDIP20, 0.250 X 1.166 INCH, CERAMIC, DIP-20 | EE PLD, 55ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 | EE PLD, 10ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 | EE PLD, 15ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 | EE PLD, 15ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 |
| 零件包装代码 | DIP | DIP | QLCC | QLCC | DIP | DIP | QLCC | QLCC | QLCC | DIP |
| 包装说明 | DIP, DIP20,.3 | DIP, | QCCN, | QCCN, | DIP, | DIP, | QCCN, | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DIP, DIP20,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
| 最大时钟频率 | 58.5 MHz | 33.3 MHz | 33.3 MHz | 41.6 MHz | 28.6 MHz | 41.6 MHz | 28.6 MHz | 58.5 MHz | 41.6 MHz | 41.6 MHz |
| JESD-30 代码 | R-GDIP-T20 | R-GDIP-T20 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 24.257 mm | 24.257 mm | 8.89 mm | 8.89 mm | 24.257 mm | 24.257 mm | 8.89 mm | 8.89 mm | 8.89 mm | 24.257 mm |
| 专用输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| I/O 线路数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | QCCN | QCCN | DIP | DIP | QCCN | QCCN | QCCN | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 10 ns | 20 ns | 20 ns | 15 ns | 55 ns | 15 ns | 55 ns | 10 ns | 15 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | 2.54 mm | 5.08 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | NO | NO | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |