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PC48F4400P0TB0EH

IC FLASH 512M PARALLEL 64EASYBGA

器件类别：存储    存储   

厂商名称：Micron Technology

厂商官网：http://www.mdtic.com.tw/

器件标准：

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参数 预览 参数对比
器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Micron Technology
包装说明
TBGA,
Reach Compliance Code
compliant
最长访问时间
95 ns
其他特性
BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE
启动块
BOTTOM
JESD-30 代码
R-PBGA-B64
JESD-609代码
e1
长度
13 mm
内存密度
536870912 bit
内存集成电路类型
FLASH
内存宽度
16
功能数量
1
端子数量
64
字数
33554432 words
字数代码
32000000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
32MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE
并行/串行
PARALLEL
峰值回流温度（摄氏度）
260
编程电压
3 V
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.3 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
10 mm
文档预览
256Mb and 512Mb (256Mb/256Mb),
P33-65nm
Features
Micron Parallel NOR Flash Embedded
Memory (P33-65nm)
RC28F256P33TFE, RC28F256P33BFE, RC28F256P33BFF,
PC28F256P33TFE, PC28F256P33BFE, PC28F256P33BFF,
PC28F256P33BFR, RC48F4400P0TB0EJ, PC48F4400P0TB0EE,
PC48F4400P0TB0EH, JS28F256P33TFE, JS28F256P33BFE
Features
• High performance
– 95ns initial access for Easy BGA
– 105ns initial access for TSOP
– 25ns 16-word asychronous page read mode
– 52 MHz (Easy BGA) with zero WAIT states and
17ns clock-to-data output synchronous burst
read mode
– 4-, 8-, 16-, and continuous word options for burst
mode
– Buffered enhanced factory programming (BEFP)
at 2 MB/s (TYP) using a 512-word buffer
– 3.0V buffered programming at 1.14 MB/s (TYP)
using a 512-word buffer
• Architecture
– MLC: highest density at lowest cost
– Asymmetrically blocked architecture
– Four 32KB parameter blocks: top or bottom con-
figuration
– 128KB main blocks
– Blank check to verify an erased block
• Voltage and power
– V
CC
(core) voltage: 2.3V to 3.6V
– V
CCQ
(I/O) voltage: 2.3V to 3.6V
– Standy current: 65µA (TYP) for 256Mb
– 52 MHz continuous synchronous read current:
21mA (TYP), 24mA (MAX)
• Security
– One-time programmable register: 64 OTP bits,
programmed with unique information from Mi-
cron; 2112 OTP bits available for customer pro-
gramming
– Absolute write protection: V
PP
= V
SS
– Power-transition erase/program lockout
– Individual zero-latency block locking
– Individual block lock-down
– Password access
• Software
– 25μs (TYP) program suspend
– 25μs (TYP) erase suspend
– Flash Data Integrator optimized
– Basic command set and extended function Inter-
face (EFI) command set compatible
– Common flash interface
• Density and Packaging
– 56-lead TSOP package (256Mb only)
– 64-ball Easy BGA package (256Mb, 512Mb)
– QUAD+ and SCSP packages (256Mb, 512Mb)
– 16-bit wide data bus
• Quality and reliabilty
– JESD47 compliant
– Operating temperature: –40°C to +85°C
– Minimum 100,000 ERASE cycles per block
– 65nm process technology
PDF: 09005aef845667ad
p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
256Mb and 512Mb (256Mb/256Mb),
P33-65nm
Features
Discrete and MCP Part Numbering Information
Devices are shipped from the factory with memory content bits erased to 1. For available options, such as pack-
ages or for further information, contact your Micron sales representative. Part numbers can be verified at www.mi-
cron.com. Feature and specification comparison by device type is available at www.micron.com/products. Con-
tact the factory for devices not found.
Note:
Not all part numbers listed here are available for ordering.
Table 1: Discrete Part Number Information
Part Number Category
Package
Category Details
JS = 56-lead TSOP, lead free
PC = 64-ball Easy BGA, lead-free
RC = 64-ball Easy BGA, leaded
Product Line
Density
Product Family
Parameter Location
Lithography
Features
Note:
28F = Micron Flash memory
256 = 256Mb
P33 (V
CC
= 2.3 to 3.6V; V
CCQ
= 2.3 to 3.6V)
B/T = Bottom/Top parameter
F = 65nm
*
1. The last digit is assigned randomly to cover packaging media, features, or other specific configuration infor-
mation. Sample part number: JS28F256P33BF*
PDF: 09005aef845667ad
p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
256Mb and 512Mb (256Mb/256Mb),
P33-65nm
Features
Table 2: MCP Part Number Information
Part Number Category
Package
Product Line
Density
Product Family
IO Voltage and Chip Configuration
Category Details
RC = 64-ball Easy BGA, leaded
PC = 64-ball Easy BGA, lead-free
48F = Micron Flash memory only
0 = No die
4 = 256Mb
P = Micron Flash memory (P33)
0 = No die
X = Individual Chip Enables
T = Virtual Chip Enables
V
CC
= 2.3 to 3.6V; V
CCQ
= 2.3 to 3.6V
Parameter Location
Ballout
Lithography
Features
Note:
B/T = Bottom/Top parameter
0 = Discrete
E = 65nm
*
1. The last digit is assigned randomly to cover packaging media, features, or other specific configuration infor-
mation. Sample part number: RC48F4400P0TB0E*
Table 3: Standard Part Numbers
Density
256Mb
Configuration
Bottom boot
Top boot
512Mb
(256Mb/256Mb)
Top/bottom boot
–
Medium
Tray
Tape and reel
Tray
Tape and reel
Tray
Tape and reel
JS
JS28F256P33BFE
–
JS28F256P33TFE
–
–
–
PC
PC28F256P33BFE
PC28F256P33BFF
PC28F256P33TFE
–
PC48F4400P0TB0EE
–
RC
RC28F256P33BFE
RC28F256P33BFF
RC28F256P33TFE
–
RC48F4400P0TB0EJ
–
Table 4: OTP Feature Part Numbers
Density
256Mb
Configuration
Bottom boot
Top boot
512Mb
(256Mb/256Mb)
Note:
Top/bottom boot
–
Medium
Tray
Tape and reel
Tray
Tape and reel
Tray
Tape and reel
PC
PC28F256P33BFR
–
–
–
PC48F4400P0TB0EH
–
1. This data sheet covers only standard parts. For OTP parts, contact your local Micron representative.
PDF: 09005aef845667ad
p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
256Mb and 512Mb (256Mb/256Mb),
P33-65nm
Features
Contents
Important Notes and Warnings ......................................................................................................................... 8
General Description ......................................................................................................................................... 9
Virtual Chip Enable Description ........................................................................................................................ 9
Memory Map ................................................................................................................................................. 11
Package Dimensions ....................................................................................................................................... 12
Pinouts and Ballouts ....................................................................................................................................... 14
Signal Descriptions ......................................................................................................................................... 16
Bus Operations ............................................................................................................................................... 18
Read .......................................................................................................................................................... 18
Write .......................................................................................................................................................... 18
Output Disable ........................................................................................................................................... 18
Standby ..................................................................................................................................................... 18
Reset .......................................................................................................................................................... 19
Device Command Codes ................................................................................................................................. 20
Device Command Bus Cycles .......................................................................................................................... 23
Read Operations ............................................................................................................................................. 25
Asynchronous Page Mode Read ................................................................................................................... 25
Asynchronous Single Word Read ................................................................................................................. 25
Synchronous Burst Mode Read ................................................................................................................... 26
Read CFI .................................................................................................................................................... 26
Read Device ID ........................................................................................................................................... 26
Device ID Codes ............................................................................................................................................. 27
Program Operations ....................................................................................................................................... 28
Word Programming (40h) ........................................................................................................................... 28
Buffered Programming (E8h, D0h) .............................................................................................................. 28
Buffered Enhanced Factory Programming (80h, D0h) ................................................................................... 29
Program Suspend ....................................................................................................................................... 31
Program Resume ........................................................................................................................................ 32
Program Protection .................................................................................................................................... 32
Erase Operations ............................................................................................................................................ 33
BLOCK ERASE Command ........................................................................................................................... 33
BLANK CHECK Command .......................................................................................................................... 33
ERASE SUSPEND Command ....................................................................................................................... 34
ERASE RESUME Command ........................................................................................................................ 34
Erase Protection ......................................................................................................................................... 34
Security Operations ........................................................................................................................................ 35
Block Locking ............................................................................................................................................. 35
BLOCK LOCK Command ............................................................................................................................ 35
BLOCK UNLOCK Command ....................................................................................................................... 35
BLOCK LOCK DOWN Command ................................................................................................................. 35
Block Lock Status ....................................................................................................................................... 35
Block Locking During Suspend ................................................................................................................... 36
Selectable OTP Blocks ................................................................................................................................. 37
Password Access ......................................................................................................................................... 37
Status Register ................................................................................................................................................ 38
Read Status Register ................................................................................................................................... 38
Clear Status Register ................................................................................................................................... 39
Configuration Register .................................................................................................................................... 40
Read Configuration Register ....................................................................................................................... 40
Read Mode ................................................................................................................................................. 40
PDF: 09005aef845667ad
p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
256Mb and 512Mb (256Mb/256Mb),
P33-65nm
Features
Latency Count ............................................................................................................................................
End of Wordline Considerations ..................................................................................................................
WAIT Signal Polarity and Functionality ........................................................................................................
WAIT Delay ................................................................................................................................................
Burst Sequence ..........................................................................................................................................
Clock Edge .................................................................................................................................................
Burst Wrap .................................................................................................................................................
Burst Length ..............................................................................................................................................
One-Time Programmable Registers .................................................................................................................
Read OTP Registers .....................................................................................................................................
Program OTP Registers ...............................................................................................................................
Lock OTP Registers .....................................................................................................................................
Common Flash Interface ................................................................................................................................
READ CFI Structure Output ........................................................................................................................
Flowcharts .....................................................................................................................................................
Power and Reset Specifications .......................................................................................................................
Power Supply Decoupling ...........................................................................................................................
Maximum Ratings and Operating Conditions ..................................................................................................
AC Test Conditions and Capacitance ...............................................................................................................
DC Electrical Specifications ............................................................................................................................
AC Read Specifications ...................................................................................................................................
AC Write Specifications ...................................................................................................................................
Program and Erase Characteristics ..................................................................................................................
Revision History .............................................................................................................................................
Rev. D – 2/18 ..............................................................................................................................................
Rev. C – 9/15 ...............................................................................................................................................
Rev. B – 12/13 .............................................................................................................................................
Rev. A – 8/13 ...............................................................................................................................................
41
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44
44
45
45
45
46
46
47
47
49
49
62
71
72
73
74
76
78
85
91
92
92
92
92
92
PDF: 09005aef845667ad
p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
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参数对比
与PC48F4400P0TB0EH相近的元器件有：PC48F4400P0TB0EE、JS28F256P33BFE、JS28F256P33TFE、PC28F256P33BFE、PC28F256P33BFR、PC28F256P33TFE、RC28F256P33BFE、RC28F256P33TFE、PC28F256P33BFF TR。描述及对比如下：
型号 PC48F4400P0TB0EH PC48F4400P0TB0EE JS28F256P33BFE JS28F256P33TFE PC28F256P33BFE PC28F256P33BFR PC28F256P33TFE RC28F256P33BFE RC28F256P33TFE PC28F256P33BFF TR
描述 IC FLASH 512M PARALLEL 64EASYBGA IC FLASH 512M PARALLEL 64EASYBGA IC FLASH 256M PARALLEL 56TSOP IC FLASH 256M PARALLEL 56TSOP IC FLASH 256M PARALLEL 64EASYBGA IC FLASH 256M PARALLEL 64EASYBGA IC FLASH 256M PARALLEL 64EASYBGA IC FLASH 256M PARALLEL 64EASYBGA IC FLASH 256M PARALLEL 64EASYBGA IC FLASH 256M PARALLEL 64EASYBGA
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS FLASH - NOR
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 不符合 不符合 -
厂商名称 Micron Technology Micron Technology Micron Technology Micron Technology - - Micron Technology - Micron Technology -
包装说明 TBGA, TBGA, TSSOP, TSSOP56,.8,20 TSSOP, TSSOP56,.8,20 TBGA, BGA64,8X8,40 TBGA, BGA64,8X8,40 TBGA, BGA64,8X8,40 BGA-64 BGA-64 -
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant not_compliant unknown -
最长访问时间 95 ns 95 ns 105 ns 105 ns 95 ns 95 ns 95 ns 95 ns 95 ns -
其他特性 BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE -
启动块 BOTTOM BOTTOM BOTTOM TOP BOTTOM BOTTOM TOP BOTTOM TOP -
JESD-30 代码 R-PBGA-B64 R-PBGA-B64 R-PDSO-G56 R-PDSO-G56 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 -
JESD-609代码 e1 e1 e3 e3 e1 e1 e1 e1 e1 -
长度 13 mm 13 mm 18.4 mm 18.4 mm 13 mm 13 mm 13 mm 13 mm 13 mm -
内存密度 536870912 bit 536870912 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit -
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH -
内存宽度 16 16 16 16 16 16 16 16 16 -
功能数量 1 1 1 1 1 1 1 1 1 -
端子数量 64 64 56 56 64 64 64 64 64 -
字数 33554432 words 33554432 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words -
字数代码 32000000 32000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000 -
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS -
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C -
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -
组织 32MX16 32MX16 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16 -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 TBGA TBGA TSSOP TSSOP TBGA TBGA TBGA TBGA TBGA -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE -
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL -
峰值回流温度（摄氏度） 260 260 NOT SPECIFIED 260 NOT SPECIFIED 260 NOT SPECIFIED 260 NOT SPECIFIED -
编程电压 3 V 3 V 2.7 V 3 V 3 V 3 V 3 V 2.7 V 3 V -
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm -
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V -
最小供电电压 (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V -
标称供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V -
表面贴装 YES YES YES YES YES YES YES YES YES -
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER TIN SILVER COPPER -
端子形式 BALL BALL GULL WING GULL WING BALL BALL BALL BALL BALL -
端子节距 1 mm 1 mm 0.5 mm 0.5 mm 1 mm 1 mm 1 mm 1 mm 1 mm -
端子位置 BOTTOM BOTTOM DUAL DUAL BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM -
处于峰值回流温度下的最长时间 30 30 NOT SPECIFIED 30 NOT SPECIFIED 30 NOT SPECIFIED 30 NOT SPECIFIED -
宽度 10 mm 10 mm 14 mm 14 mm 10 mm 10 mm 10 mm 10 mm 10 mm -
命令用户界面 - - YES YES YES YES YES YES YES -
通用闪存接口 - - YES YES YES YES YES YES YES -
数据轮询 - - NO NO NO NO NO NO NO -
部门数/规模 - - 4,255 4,255 4,255 4,255 4,255 4,255 4,255 -
封装等效代码 - - TSSOP56,.8,20 TSSOP56,.8,20 BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40 -
电源 - - 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V -
认证状态 - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
部门规模 - - 16K,64K 16K,64K 16K,64K 16K,64K 16K,64K 16K,64K 16K,64K -
最大待机电流 - - 0.00021 A 0.00021 A 0.00021 A 0.00021 A 0.00021 A 0.00021 A 0.00021 A -
最大压摆率 - - 0.031 mA 0.031 mA 0.031 mA 0.031 mA 0.031 mA 0.031 mA 0.031 mA -
切换位 - - NO NO NO NO NO NO NO -
类型 - - NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE -
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器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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