型号 | PC8280MTPUDA | PC8280MTPUQA | PC8280MTPULA | PCX8270MTPUQLDA | PC8280MTPUQLDA | PCX8280MTPUQLDA | PC8270MTPUQLDA |
---|---|---|---|---|---|---|---|
描述 | Micro Peripheral IC, | Micro Peripheral IC, | Micro Peripheral IC, | RISC Microprocessor, 32-Bit, 333MHz, CMOS, PBGA480, 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 | RISC Microprocessor, 32-Bit, 333MHz, CMOS, PBGA480, 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 | RISC Microprocessor, 32-Bit, 333MHz, CMOS, PBGA480, 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 | RISC Microprocessor, 32-Bit, 333MHz, CMOS, PBGA480, 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 |
包装说明 | , | , | , | LBGA, | 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 | LBGA, | LBGA, |
Reach Compliance Code | compli | compli | compli | compliant | compliant | compliant | compliant |
Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
零件包装代码 | - | - | - | BGA | BGA | BGA | BGA |
针数 | - | - | - | 480 | 480 | 480 | 480 |
ECCN代码 | - | - | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
其他特性 | - | - | - | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | - | - | - | 32 | 32 | 32 | 32 |
位大小 | - | - | - | 32 | 32 | 32 | 32 |
边界扫描 | - | - | - | YES | YES | YES | YES |
最大时钟频率 | - | - | - | 83.33 MHz | 83.33 MHz | 83.33 MHz | 83.33 MHz |
外部数据总线宽度 | - | - | - | 64 | 64 | 64 | 64 |
格式 | - | - | - | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
集成缓存 | - | - | - | YES | YES | YES | YES |
JESD-30 代码 | - | - | - | S-PBGA-B480 | S-PBGA-B480 | S-PBGA-B480 | S-PBGA-B480 |
长度 | - | - | - | 37.5 mm | 37.5 mm | 37.5 mm | 37.5 mm |
低功率模式 | - | - | - | NO | NO | NO | NO |
端子数量 | - | - | - | 480 | 480 | 480 | 480 |
最高工作温度 | - | - | - | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | - | - | - | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | - | LBGA | LBGA | LBGA | LBGA |
封装形状 | - | - | - | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | - | - | - | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
认证状态 | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | - | - | 1.65 mm | 1.65 mm | 1.65 mm | 1.65 mm |
速度 | - | - | - | 333 MHz | 333 MHz | 333 MHz | 333 MHz |
最大供电电压 | - | - | - | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
最小供电电压 | - | - | - | 1.45 V | 1.45 V | 1.45 V | 1.45 V |
标称供电电压 | - | - | - | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
表面贴装 | - | - | - | YES | YES | YES | YES |
技术 | - | - | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | - | - | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | - | - | - | BALL | BALL | BALL | BALL |
端子节距 | - | - | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | - | - | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | - | - | - | 37.5 mm | 37.5 mm | 37.5 mm | 37.5 mm |
uPs/uCs/外围集成电路类型 | - | - | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |