型号
- 型号
- 关键词
Very Low-Power Stereo CODEC with HP Amplifier, notch filters, ALC and 3D Effects 32-VQFN -40 to 85
器件标准：
| 型号 | PCM3794ARHBT | PCM3793ARHBT | PCM3793ARHBR | PCM3794ARHBR | PCM3794ARHBRG4 | PCM3794ARHBTG4 |
|---|---|---|---|---|---|---|
| 描述 | Very Low-Power Stereo CODEC with HP Amplifier, notch filters, ALC and 3D Effects 32-VQFN -40 to 85 | Very Low-Power Stereo CODEC with HP/Class-D Speaker Amplifier, notch filters, ALC and 3D Effects 32-VQFN -40 to 85 | Very Low-Power Stereo CODEC with HP/Class-D Speaker Amplifier, notch filters, ALC and 3D Effects 32-VQFN -40 to 85 | Very Low-Power Stereo CODEC with HP Amplifier, notch filters, ALC and 3D Effects 32-VQFN -40 to 85 | Very Low-Power Stereo CODEC with HP Amplifier, notch filters, ALC and 3D Effects 32-VQFN -40 to 85 | Very Low-Power Stereo CODEC with HP Amplifier, notch filters, ALC and 3D Effects 32-VQFN -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFN | QFN | QFN | QFN | QFN | QFN |
| 包装说明 | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| JESD-30 代码 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
| 湿度敏感等级 | 2 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | - | - |
