EE PLD, 15ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
厂商名称:Integrated Circuit Systems(IDT )
下载文档型号 | PEEL20CG10ALP-15 | PEEL20CG10ALSI-15 | PEEL20CG10ALPI-15 | PEEL20CG10ALS-15 | PEEL20CG10ALJI-15 | PEEL20CG10ALJ-15 |
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描述 | EE PLD, 15ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | EE PLD, 15ns, CMOS, PDSO24, SOIC-24 | EE PLD, 15ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | EE PLD, 15ns, CMOS, PDSO24, SOIC-24 | EE PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 |
厂商名称 | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) |
零件包装代码 | DIP | SOIC | DIP | SOIC | QLCC | QLCC |
包装说明 | DIP, | SOP, | DIP, | SOP, | QCCJ, | QCCJ, |
针数 | 24 | 24 | 24 | 24 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
最大时钟频率 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
JESD-30 代码 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 | S-PQCC-J28 | S-PQCC-J28 |
长度 | 31.75 mm | 15.4 mm | 31.75 mm | 15.4 mm | 11.5062 mm | 11.5062 mm |
专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 |
I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 |
端子数量 | 24 | 24 | 24 | 24 | 28 | 28 |
最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | DIP | SOP | QCCJ | QCCJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V |
最小供电电压 | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | J BEND | J BEND |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD |
宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm | 11.5062 mm | 11.5062 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
座面最大高度 | - | 2.65 mm | - | 2.65 mm | 4.369 mm | 4.369 mm |