型号
- 型号
- 关键词
EE PLD, 64-Cell, CMOS, PQFP100, 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100
厂商名称：XILINX(赛灵思)
厂商官网：https://www.xilinx.com/
下载文档| 型号 | PZ3064I15BB | PZ3064-12BB | PZ3064I12BB | PZ3064-10BB |
|---|---|---|---|---|
| 描述 | EE PLD, 64-Cell, CMOS, PQFP100, 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100 | EE PLD, 15ns, 64-Cell, CMOS, PQFP100, 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100 | EE PLD, 15ns, 64-Cell, CMOS, PQFP100, 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100 | EE PLD, 15ns, 64-Cell, CMOS, PQFP100, 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100 | 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100 | 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100 | 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100 |
| 针数 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| 其他特性 | NO | NO | NO | NO |
| 系统内可编程 | NO | NO | NO | NO |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| JTAG BST | NO | NO | NO | NO |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 |
| 专用输入次数 | 2 | 2 | 2 | 2 |
| I/O 线路数量 | 64 | 64 | 64 | 64 |
| 宏单元数 | 64 | 64 | 64 | 64 |
| 端子数量 | 100 | 100 | 100 | 100 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C |
| 组织 | 2 DEDICATED INPUTS, 64 I/O | 2 DEDICATED INPUTS, 64 I/O | 2 DEDICATED INPUTS, 64 I/O | 2 DEDICATED INPUTS, 64 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QFP | QFP | QFP |
| 封装等效代码 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.7X.9 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.4 mm | 3.4 mm | 3.4 mm | 3.4 mm |
| 最大供电电压 | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
| 最小供电电压 | 2.97 V | 2.97 V | 2.97 V | 2.97 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm |
| 最大时钟频率 | - | 67 MHz | 67 MHz | 77 MHz |
| 传播延迟 | - | 15 ns | 15 ns | 15 ns |
