512K X 8 STANDARD SRAM, 70 ns, PDSO32
512K × 8 标准存储器, 70 ns, PDSO32
厂商名称:Renesas(瑞萨电子)
器件标准:
下载文档型号 | R1LV0408CSA-7LI | R1LV0408C-I | R1LV0408CSB-5SI | R1LV0408CSP-5SI | R1LV0408CSP-7LI | R1LV0408CSA-5SI | R1LV0408CSB-7LI |
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描述 | 512K X 8 STANDARD SRAM, 70 ns, PDSO32 | 512K X 8 STANDARD SRAM, 70 ns, PDSO32 | 512K X 8 STANDARD SRAM, 70 ns, PDSO32 | 512K X 8 STANDARD SRAM, 70 ns, PDSO32 | 512K X 8 STANDARD SRAM, 70 ns, PDSO32 | 512K X 8 STANDARD SRAM, 70 ns, PDSO32 | 512K X 8 STANDARD SRAM, 70 ns, PDSO32 |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
组织 | 512KX8 | 512K X 8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
表面贴装 | YES | Yes | YES | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | - |
零件包装代码 | TSOP | - | TSOP2 | SOIC | SOIC | TSOP | TSOP2 |
包装说明 | TSOP2, TSSOP32,.56,20 | - | SOP, | SOP, | SOP, | SOP, | SOP, |
针数 | 32 | - | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknow | - | compli | compli | compli | compli | compli |
ECCN代码 | 3A991.B.2.A | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 70 ns | - | 55 ns | 55 ns | 70 ns | 55 ns | 70 ns |
JESD-30 代码 | R-PDSO-G32 | - | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
内存密度 | 4194304 bi | - | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
内存集成电路类型 | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
字数 | 524288 words | - | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | - | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | - | SOP | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |