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R5F562N8ANFP

IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,QFP,100PIN,PLASTIC

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
厂商名称
Renesas(瑞萨电子)
零件包装代码
QFP
针数
100
Reach Compliance Code
compli
位大小
32
CPU系列
RX
JESD-30 代码
S-PQFP-G100
端子数量
100
最高工作温度
85 °C
最低工作温度
-20 °C
封装主体材料
PLASTIC/EPOXY
封装代码
QFP
封装等效代码
QFP100,.63SQ,20
封装形状
SQUARE
封装形式
FLATPACK
电源
3.3 V
认证状态
Not Qualified
RAM(字节)
98304
ROM(单词)
524288
ROM可编程性
FLASH
速度
100 MHz
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
文档预览
PRELIMINARY
RX62N Group, RX621 Group
Renesas 32-Bit MCU
REJ03B0281-0050
Rev.0.50
Mar. 11, 2010
1.
1.1
Overview
Features
The RX62N/RX621 Group is a set of MCUs that feature the high-speed, high-performance RX CPU as the processor
core.
Each basic instruction is executable in one cycle of the system clock. Calculation functionality is enhanced by the
inclusion of a single-precision floating-point calculation unit as well as a 32-bit multiplier and divider. Additionally, code
efficiency is improved by instructions with lengths that are variable in byte units to cover an enhanced range of
addressing modes.
Timers, an Ethernet controller, USB 2.0 host/function modules, serial communications interfaces, I
2
C bus interfaces,
CAN modules, an A/D converter, and a D/A converter are incorporated as peripheral functions which are essential to
embedded network devices.
Facilities for connecting external memory are also included, enabling direct connection to memory and peripheral LSI
circuits. Large-capacity flash memory units capable of high-speed operation are included as on-chip memory,
significantly reducing the cost of configuring systems.
1.1.1
Applications
Industrial equipment and embedded network devices
Notes to users:
• While the information contained herein is believed to be accurate, it may contain technical
inaccuracies or typographical errors.
• The specification may be subject to change due to produce improvements or other reasons.
Please verify the document is the latest version available.
REJ03B0281-0050 Rev.0.50
Page 1 of 101
Mar. 11, 2010
Under development
Preliminary Specification
Specifications in this preliminary version are subject to change.
RX62N Group, RX621 Group
1.1.2
Outline of Specifications
1. Overview
Table 1.1 lists the specifications in outline, and table 1.2 lists the functions of products.
Table 1.1
CPU
Outline of Specifications
Module/Function
CPU
Classification
Description
Maximum operating frequency: 100 MHz
32-bit RX CPU
Minimum instruction execution time: One instruction per state (cycle of the system clock)
Address space: 4-Gbyte linear
Register set of the CPU
General purpose: Sixteen 32-bit registers
Control: Nine 32-bit registers
Accumulator: One 64-bit register
Basic instructions: 73
Floating-point instructions: 8
DSP instructions: 9
Addressing modes: 10
Data arrangement
Instructions: Little endian
Data: Selectable as little endian or big endian
On-chip 32-bit multiplier: 32 x 32
64 bits
On-chip divider: 32 / 32
32 bits
Barrel shifter: 32 bits
Memory-protection unit (MPU) (as an optional function)*
1
FPU
Single precision (32-bit) floating point
Data types and floating-point exceptions in conformance with the IEEE754 standard
Memory
ROM
ROM capacity: 512 Kbytes (max.)
Two on-board programming modes
Boot mode (The user MAT is programmable via the SCI and USB.)
User program mode
Parallel programmer mode (for off-board programming)
RAM
Data flash
MCU operating modes
RAM capacity: 96 Kbytes (max.)
Data flash capacity: 32 Kbytes
Single-chip mode, on-chip ROM enabled expansion mode, and on-chip ROM disabled
expansion mode (software switching)
REJ03B0281-0050 Rev.0.50
Page 2 of 101
Mar. 11, 2010
Under development
Preliminary Specification
Specifications in this preliminary version are subject to change.
RX62N Group, RX621 Group
Classification
Clock
1. Overview
Module/Function
Clock generation
circuit
Description
Two circuits: Main clock oscillator and subclock oscillator
Internal oscillator: Low-speed on-chip oscillator
Structure of a PLL frequency synthesizer and frequency divider for selectable operating
frequency
Oscillation stoppage detection
Independent frequency-division and multiplication settings for the system clock (ICLK),
peripheral module clock (PCLK), and external bus clock (BCLK)
The CPU and other bus masters run in synchronization with the system
clock (ICLK): 8 to 100 MHz
Peripheral modules run in synchronization with the peripheral module
clock (PCLK): 8 to 50 MHz
Devices connected to the external bus run in synchronization with the external bus
clock (BCLK): 8 to 50 MHz
Reset
Pin reset, power-on reset, voltage-monitoring reset, watchdog timer reset, independent
watchdog timer reset, and deep software standby reset
Voltage detection circuit
When the voltage on VCC falls below the voltage detection level (Vdet), an internal reset or
internal interrupt is generated.
Low power
consumption
Low power
consumption facilities
Module stop function
Four low power consumption modes
Sleep mode, all-module clock stop mode, software standby mode, and deep software
standby mode
Interrupt
Interrupt control unit
Peripheral function interrupts: 146 sources
External interrupts: 16 (pins IRQ0 to IRQ15)
Non-maskable interrupts: 3 (the NMI pin, oscillation stop detection interrupt, and
voltage-monitoring interrupt)
Sixteen levels specifiable for the order of priority
User break controller
(as an optional
function)
External bus extension
Two breakpoint channels
Address breaks in fetch cycles are specifiable (enabling ROM correction)
The external address space can be divided into nine areas (CS0 to CS7, SDCS), each
with independent control of access settings.
Capacity of each area: 16 Mbytes (CS0 to CS7), 128 Mbytes (SDCS)
A chip-select signal (CS0# to CS7#, SDCS#) can be output for each area.
Each area is specifiable as an 8-, 16-, or 32-bit bus space (however, only 176-pin
versions support 32-bit bus spaces).
The data arrangement in each area is selectable as little or big endian (only for data).
SDRAM interface connectable
Bus format: Separate buses
Wait control
Write buffer facility
REJ03B0281-0050 Rev.0.50
Page 3 of 101
Mar. 11, 2010
Under development
Preliminary Specification
Specifications in this preliminary version are subject to change.
RX62N Group, RX621 Group
Classification
DMA
1. Overview
Module/Function
DMA controller
Description
4 channels
Three transfer modes: Normal transfer, repeat transfer, and block transfer
Activation sources: Software trigger, external interrupts, and interrupt requests from
peripheral functions
EXDMA controller
2 channels
Four transfer modes: Normal transfer, repeat transfer, block transfer, and cluster transfer
Single-address transfer enabled with the EDACK signal
Capable of direct data transfer to TFT LCD panels
Activation sources: Software trigger, external DMA requests (EDREQ), and interrupt
requests from peripheral functions
Data transfer
controller
Three transfer modes: Normal transfer, repeat transfer, and block transfer
Activation sources: Software trigger, external interrupts and interrupt requests from
peripheral functions
I/O ports
Programmable I/O
ports
I/O ports for the 176-pin LFBGA/145-pin TFLGA/144-pin LQFP/100-pin LQFP/85-pin TFLGA
I/O pins: 126/103/103/72/58
Input pins: 2/2/2/2/2
Pull-up resistors: 56/44/44/40/28
Open-drain outputs: 35/33/33/27/23
5-V tolerance: 11/11/11/7/6
Timers
Multi-function timer
pulse unit
(16 bits x 6 channels) x 2 units
Time bases for the 12 16-bit timer channels can be provided via up to 32
pulse-input/output lines and six pulse-input lines
Select from among eight counter-input clock signals for each channel (MPCLK/1,
MPCLK/4, MPCLK/16, MPCLK/64, MTCLKA, MTCLKB, MTCLKC, MTCLKD) other than
channel 5, for which only four signals are available.
Input capture function
21 output compare/input capture registers
Pulse output mode
Complementary PWM output mode
Reset synchronous PWM mode
Phase-counting mode
Generation of triggers for A/D converter conversion
Port output enable
Controls the high-impedance state of the MTU’s waveform output pins
REJ03B0281-0050 Rev.0.50
Page 4 of 101
Mar. 11, 2010
Under development
Preliminary Specification
Specifications in this preliminary version are subject to change.
RX62N Group, RX621 Group
Classification
Timers
1. Overview
Module/Function
Programmable pulse
generator
Description
(4 bits x 4 groups) x 2 units
Pulse output with the MTU output as a trigger
Maximum of 32-bit pulse output possible
8-bit timers
(8 bits x 2 channels) x 2 units
Select from among seven internal clock signals (PCLK, PCLK/2, PCLK/8, PCLK/32,
PCLK/64, PCLK/1024, PCLK/8192) and one external clock signal
Capable of output of pulse trains with desired duty cycles or of PWM signals
The 2 channels of each unit can be cascaded to create a 16-bit timer
Generation of triggers for A/D converter conversion
Capable of generating baud-rate clocks for SCI5 and SCI6
Compare match timer
(16 bits x 2 channels) x 2 units
Select from among four internal clock signals (PCLK/8, PCLK/32, PCLK/128, PCLK/512)
Watchdog timer
8 bits x 1 channel
Select from among eight counter-input clock signals (PCLK/4, PCLK/64, PCLK/128,
PCLK/512, PCLK/2048, PCLK/8192, PCLK/32768, PCLK/131072)
Switchable between watchdog timer mode and interval timer mode
Independent
watchdog timer
Realtime clock
14 bits x 1 channel
Counter-input clock: Dedicated on-chip oscillator
Clock source: Subclock
Time/calendar
Interrupt sources: Alarm interrupt, periodic interrupt, and carry interrupt
Communication
function
Ethernet controller
Input and output of Ethernet/IEEE 802.3 frames
Transfer at 10 or 100 Mbps
Full- and half-duplex modes
MII (Media Independent Interface) or RMII (Reduced Media Independent Interface) as
defined in IEEE 802.3u
Detection of Magic Packets
TM
*
or output of a "wake-on-LAN" signal (WOL)
Compliance with flow control as defined in IEEE 802.3x standards
Note:
*
Magic Packet
DMA controller for
Ethernet controller
USB 2.0
host/function module
TM
is a registered trademark of Advanced Micro Devices, Inc.
Alleviation of CPU loads by the descriptor control method
Transmission FIFO: 2 Kbytes; Reception FIFO: 2 Kbytes
Includes a UDC (USB Device Controller) and transceiver for USB 2.0
Single port (176-pin products: two ports)
Compliance with the USB 2.0 specification
Transfer rate: Full speed (12 Mbps)
Self-power mode and bus power are selectable
OTG (On the Go) operation is possible
Incorporates 2 Kbytes of RAM as a transfer buffer
Serial
communications
interfaces
6 channels
Serial communications modes:
Asynchronous, clock synchronous, and smart-card interface
Multi-processor communications function
On-chip baud rate generator allows selection of the desired bit rate
Choice of LSB-first or MSB-first transfer
Average transfer rate clock can be input from TMR timers for SCI5 and SCI6
REJ03B0281-0050 Rev.0.50
Page 5 of 101
Mar. 11, 2010
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参数对比
与R5F562N8ANFP相近的元器件有:R5F562N8ANBG、R5F562N8ANFB、R5F562N8ANLE、R5F562N8BNBG、R5F562N8BNFB、R5F562N8BNFP、R5F562N8BNLE、R5F56217BNFP。描述及对比如下:
型号 R5F562N8ANFP R5F562N8ANBG R5F562N8ANFB R5F562N8ANLE R5F562N8BNBG R5F562N8BNFB R5F562N8BNFP R5F562N8BNLE R5F56217BNFP
描述 IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,QFP,100PIN,PLASTIC IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,BGA,176PIN,PLASTIC IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,QFP,144PIN,PLASTIC IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,LGA,145PIN,PLASTIC IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,BGA,176PIN,PLASTIC IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,QFP,144PIN,PLASTIC IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,QFP,100PIN,PLASTIC IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,LGA,145PIN,PLASTIC IC,MICROCONTROLLER,32-BIT,RX CPU,CMOS,QFP,100PIN,PLASTIC
零件包装代码 QFP BGA QFP LGA BGA QFP QFP LGA QFP
针数 100 176 144 145 176 144 100 145 100
Reach Compliance Code compli compli compli compli compli compli compli compli compliant
位大小 32 32 32 32 32 32 32 32 32
CPU系列 RX RX RX RX RX RX RX RX RX
JESD-30 代码 S-PQFP-G100 S-PBGA-B176 S-PQFP-G144 S-PBGA-N145 S-PBGA-B176 S-PQFP-G144 S-PQFP-G100 S-PBGA-N145 S-PQFP-G100
端子数量 100 176 144 145 176 144 100 145 100
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QFP FBGA QFP LGA FBGA QFP QFP LGA QFP
封装等效代码 QFP100,.63SQ,20 BGA176,15X15,32 QFP144,.87SQ,20 LGA145,13X13,25 BGA176,15X15,32 QFP144,.87SQ,20 QFP100,.63SQ,20 LGA145,13X13,25 QFP100,.63SQ,20
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK GRID ARRAY, FINE PITCH FLATPACK GRID ARRAY GRID ARRAY, FINE PITCH FLATPACK FLATPACK GRID ARRAY FLATPACK
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM(字节) 98304 98304 98304 98304 98304 98304 98304 98304 65536
ROM(单词) 524288 524288 524288 524288 524288 524288 524288 524288 393216
ROM可编程性 FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
速度 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 OTHER OTHER OTHER OTHER OTHER OTHER OTHER OTHER OTHER
端子形式 GULL WING BALL GULL WING NO LEAD BALL GULL WING GULL WING NO LEAD GULL WING
端子节距 0.5 mm 0.8 mm 0.5 mm 0.635 mm 0.8 mm 0.5 mm 0.5 mm 0.635 mm 0.5 mm
端子位置 QUAD BOTTOM QUAD BOTTOM BOTTOM QUAD QUAD BOTTOM QUAD
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) -
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