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RF1S25N06SM

25 A, 60 V, 0.047 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB

器件类别:半导体    分立半导体   

厂商名称:Intersil ( Renesas )

厂商官网:http://www.intersil.com/cda/home/

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RFP25N06, RF1S25N06SM
Data Sheet
July 1999
File Number
1492.4
25A, 60V, 0.047 Ohm, N-Channel Power
MOSFETs
These N-Channel power MOSFETs are manufactured using
the MegaFET process. This process, which uses feature
sizes approaching those of LSI integrated circuits gives
optimum utilization of silicon, resulting in outstanding
performance. They were designed for use in applications
such as switching regulators, switching converters, motor
drivers, and relay drivers. These transistors can be operated
directly from integrated circuits.
Formerly developmental type TA09771.
Features
• 25A, 60V
• r
DS(ON)
= 0.047Ω
• Temperature Compensating PSPICE
®
Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• 175
o
C Operating Temperature
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
Ordering Information
PART NUMBER
RFP25N06
RF1S25N06SM
PACKAGE
TO-220AB
TO-263AB
BRAND
RFP25N06
F1S25N06
Symbol
D
NOTE: When ordering use the entire part number. Add the suffix, 9A,
to obtain the TO-263AB variant in tape and reel, e.g. RF1S25N06SM9A.
G
S
Packaging
JEDEC TO- 220AB
SOURCE
DRAIN
GATE
GATE
SOURCE
JEDEC TO-263AB
DRAIN
(FLANGE)
DRAIN
(FLANGE)
4-511
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation.
http://www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
RFP25N06, RF1S25N06SMS
Absolute Maximum Ratings
T
C
= 25
o
C, Unless Otherwise Specified
RFP25N06,
RF1S25N06SM
60
60
±20
25
(Figure 5)
(Figure 6)
72
0.48
-55 to 175
300
260
UNITS
V
V
V
A
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Continuous Drain Current (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
Single Pulse Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
AS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
pkg
W
W/
o
C
o
C
o
C
o
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. T
J
= 25
o
C to 150
o
C.
Electrical Specifications
PARAMETER
T
C
= 25
o
C, Unless Otherwise Specified
SYMBOL
BV
DSS
V
GS(TH)
I
DSS
TEST CONDITIONS
I
D
= 250µA, V
GS
= 0V (Figure 11)
V
GS
= V
DS
, I
D
= 250µA (Figure 10)
V
DS
= 60V
V
GS
= 0V
T
C
= 25
o
C
T
C
= 150
o
C
MIN
60
2
-
-
-
-
-
-
-
-
-
-
V
GS
= 0 to 20V
V
GS
= 0 to 10V
V
GS
= 0 to 2V
V
DD
= 48V, I
D
= 25A,
R
L
= 1.92Ω
I
g(REF)
= 0.75mA
(Figure 13)
-
-
-
-
-
-
(Figure 3)
-
-
TYP
-
-
-
-
-
-
-
14
30
45
22
-
-
-
-
975
330
95
-
-
MAX
-
4
1
50
±100
0.047
60
-
-
-
-
100
80
45
3
-
-
-
2.083
62
UNITS
V
V
µA
µA
nA
ns
ns
ns
ns
ns
ns
nC
nC
nC
pF
pF
pF
o
C/W
o
C/W
Drain to Source Breakdown Voltage
Gate to Source Threshold Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
Drain to Source On Resistance
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
Total Gate Charge
Gate Charge at 10V
Threshold Gate Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Thermal Resistance Junction to Case
Thermal Resistance Junction to Ambient
I
GSS
r
DS(ON)
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Q
g(TOT)
Q
g(10)
Q
g(TH)
C
ISS
C
OSS
C
RSS
R
θJC
R
θJA
V
GS
=
±20V
I
D
= 25A, V
GS
= 10V (Figure 9)
V
DD
= 30V, I
D
= 12.5A
R
L
= 2.4Ω, V
GS
= 10V
R
GS
= 10Ω
(Figure 13)
V
DS
= 25V, V
GS
= 0V
f = 1MHz
(Figure 12)
Source to Drain Diode Specifications
PARAMETER
Source to Drain Diode Voltage
Reverse Recovery Time
SYMBOL
V
SD
t
rr
I
SD
= 25A
I
SD
= 25A, dI
SD
/dt = 100A/µs
TEST CONDITIONS
MIN
-
-
TYP
-
-
MAX
1.5
125
UNITS
V
ns
4-512
RFP25N06, RF1S25N06SM
Typical Performance Curves
1.2
Unless Otherwise Specified
30
POWER DISSIPATION MULTIPLIER
1.0
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
T
C
, CASE TEMPERATURE (
o
C)
150
175
I
D
, DRAIN CURRENT (A)
25
20
15
10
5
0
25
50
75
100
125
T
C
, CASE TEMPERATURE (
o
C)
150
175
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
2
1
THERMAL IMPEDANCE
0.5
0.2
0.1
0.1
0.05
0.02
0.01
SINGLE PULSE
0.01
10
-5
t
1
t
2
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θ
J
C
x R
θ
J
C
+ T
C
10
-3
10
-2
10
-1
t
1
, RECTANGULAR PULSE DURATION (s)
10
0
10
1
P
DM
Z
θ
JC
, NORMALIZED
10
-4
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
200
100
I
D
, DRAIN CURRENT (A)
T
C
= 25
o
C
T
J
= MAX RATED
SINGLE PULSE
I
DM
, PEAK CURRENT (A)
V
GS
= 20V
200
FOR TEMPERATURES ABOVE 25
o
C
DERATE PEAK CURRENT
CAPABILITY AS FOLLOWS:
175
T C
I = I 25
-----------------------
-
150
V
GS
= 10V
100
100µs
10
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
1ms
10ms
100ms
DC
1
10
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
100
1
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
10
-5
10
10
-4
10
-3
10
-2
10
-1
t, PULSE WIDTH (s)
T
C
= 25
o
C
10
0
10
1
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
FIGURE 5. PEAK CURRENT CAPABILITY
4-513
RFP25N06, RF1S25N06SM
Typical Performance Curves
100
I
AS
, AVALANCHE CURRENT (A)
Unless Otherwise Specified
(Continued)
70
60
I
D
, DRAIN CURRENT (A)
V
GS
= 20V
V
GS
= 10V
V
GS
= 8V
STARTING T
J
= 25
o
C
50
40
30
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
T
C
= 25
o
C
V
GS
= 7V
V
GS
= 6V
10
STARTING T
J
= 150
o
C
If R = 0
t
AV
= (L)(I
AS
)/(1.3*RATED BV
DSS
- V
DD
)
If R
0
t
AV
= (L/R)ln[(I
AS
*R)/(1.3*RATED BV
DSS
-V
DD
) +1]
1
0.01
1
0.1
t
AV
, TIME IN AVALANCHE (µs)
10
20
10
0
V
GS
= 4.5V
0
V
GS
= 5V
8
2
4
6
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
NOTE: Refer to Intersil Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
FIGURE 7. SATURATION CHARACTERISTICS
70
60
I
D,
DRAIN CURRENT (A)
50
175
o
C
40
30
20
10
0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
NORMALIZED DRAIN TO SOURCE
ON RESISTANCE
10
V
DD
= 15V
-55
o
C
25
o
C
2.5
2.0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
GS
= 10V, I
D
= 25A
1.5
1.0
0.5
0
2
4
6
8
V
GS
, GATE TO SOURCE VOLTAGE (V)
0
-80
-40
0
40
80
120
160
T
J
, JUNCTION TEMPERATURE (
o
C)
200
FIGURE 8. TRANSFER CHARACTERISTICS
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
2.0
NORMALIZED DRAIN TO SOURCE
V
GS
= V
DS
I
D
= 250µA
NORMALIZED GATE
THRESHOLD VOLTAGE
1.5
2.0
I
D
= 250µA
BREAKDOWN VOLTAGE
1.5
1.0
1.0
0.5
0.5
0
-80
-40
0
40
80
120
160
T
J
, JUNCTION TEMPERATURE (
o
C)
200
0
-80
-40
0
40
80
120
160
200
T
J
, JUNCTION TEMPERATURE (
o
C)
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
4-514
RFP25N06, RF1S25N06SM
Typical Performance Curves
1600
V
GS
= 0V, f = 1MHz
C
ISS
= C
GS
+ C
GD
C
RSS
= C
GD
C
OSS
= C
DS
+ C
GD
Unless Otherwise Specified
(Continued)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
60
V
DD
= BV
DSS
45
V
DD
= BV
DSS
7.5
10
V
GS
, GATE TO SOURCE VOLTAGE (V)
C, CAPACITANCE (pF)
1200
C
ISS
30
0.75 BV
DSS
15
0.50 BV
DSS
0.25 BV
DSS
R
L
= 2.4Ω
I
g(REF)
= 0.75mA
V
GS
= 10V
0
20
--------------------
I
g
(
ACT
)
I
g
(
REF
)
t, TIME (µs)
80
--------------------
I
g
(
ACT
)
I
g
(
REF
)
5.0
800
C
OSS
2.5
400
C
RSS
0
0
0
5
10
15
20
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
25
NOTE: Refer to Intersil Application Notes AN7254 and AN7260.
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
FIGURE 13. NORMALIZED SWITCHING WAVEFORMS FOR
CONSTANT GATE CURRENT
Test Circuits and Waveforms
V
DS
BV
DSS
L
VARY t
P
TO OBTAIN
REQUIRED PEAK I
AS
V
GS
DUT
t
P
R
G
-
I
AS
V
DD
t
P
V
DS
V
DD
+
0V
I
AS
0.01Ω
0
t
AV
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
t
ON
V
DS
V
DS
V
GS
R
L
+
t
OFF
t
d(OFF)
t
r
t
f
90%
t
d(ON)
90%
DUT
R
GS
V
GS
-
V
DD
0
10%
90%
10%
V
GS
0
10%
50%
PULSE WIDTH
50%
FIGURE 16. SWITCHING TIME TEST CIRCUIT
FIGURE 17. RESISTIVE SWITCHING WAVEFORMS
4-515
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参数对比
与RF1S25N06SM相近的元器件有:RFP25N06。描述及对比如下:
型号 RF1S25N06SM RFP25N06
描述 25 A, 60 V, 0.047 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB 25 A, 60 V, 0.047 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
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