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RF1S45N06SM

45 A, 60 V, 0.028 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB

器件类别:半导体    分立半导体   

厂商名称:Intersil ( Renesas )

厂商官网:http://www.intersil.com/cda/home/

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RFG45N06, RFP45N06, RF1S45N06SM
Data Sheet
July 1999
File Number
3574.4
45A, 60V, 0.028 Ohm, N-Channel Power
MOSFETs
These are N-Channel enhancement mode silicon gate
power field effect transistors. They are advanced power
MOSFETs designed, tested, and guaranteed to withstand a
specified level of energy in the breakdown avalanche mode
of operation. All of these power MOSFETs are designed for
applications such as switching regulators, switching
convertors, motor drivers, relay drivers, and drivers for high
power bipolar switching transistors requiring high speed and
low gate drive power. These types can be operated directly
from integrated circuits.
Formerly developmental type TA49028.
Features
• 45A, 60V
• r
DS(ON)
= 0.028Ω
• Temperature Compensating PSPICE
®
Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• 175
o
C Operating Temperature
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
Components to PC Boards”
Symbol
DRAIN
Ordering Information
PART NUMBER
RFG45N06
RFP45N06
RF1S45N06SM
PACKAGE
TO-247
TO-220AB
TO-263AB
BRAND
RFG45N06
RFP45N06
F1S45N06
GATE
NOTE: When ordering, use the entire part number. Add the suffix, 9A,
to obtain the TO-263AB variant in tape and reel, i.e.
RF1S45N06SM9A.
SOURCE
Packaging
JEDEC STYLE TO-247
SOURCE
DRAIN
GATE
DRAIN
(BOTTOM
SIDE METAL)
DRAIN
(FLANGE)
JEDEC TO-220AB
SOURCE
DRAIN
GATE
JEDEC TO-263AB
DRAIN
(FLANGE)
GATE
SOURCE
4-455
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation.
http://www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
RFG45N06, RFP45N06, RF1S45N06SM
Absolute Maximum Ratings
T
C
= 25
o
C, Unless Otherwise Specified
RFG45N06, RFP45N06
RF1S45N06SM
60
60
45
Refer to Peak Current Curve
±20
Refer to UIS Curve
131
0.877
-55 to 175
300
260
UNITS
V
V
A
V
W
W/
o
C
o
C
o
C
o
C
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
Drain to Gate Voltage (R
G
= 20KΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
D
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
AS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
pkg
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. T
J
= 25
o
C to 150
o
C.
Electrical Specifications
PARAMETER
T
C
= 25
o
C, Unless Otherwise Specified
SYMBOL
BV
DSS
V
GS(TH)
I
DSS
TEST CONDITIONS
I
D
= 250µA, V
GS
= 0V (Figure 11)
V
GS
= V
DS
, I
D
= 250µA (Figure 10)
V
DS
= Rated BV
DSS
, V
GS
= 0V
V
DS
= 0.8 x Rated BV
DSS
, V
GS
= 0V (125
o
C)
V
GS
=
±20V
I
D
= 45A, V
GS
= 10V (Figure 9)
V
DD
= 30V, I
D
= 45A
R
L
= 0.667Ω, V
GS
= +10V
R
G
= 3.6Ω (Figure 13)
MIN
60
2
-
-
-
-
-
-
-
-
-
-
V
GS
= 0 to 20V
V
GS
= 0 to 10V
V
GS
= 0 to 2V
V
DD
= 48V, I
D
= 45A,
R
L
= 1.07Ω
I
g(REF)
= 1.5mA
(Figure 13)
-
-
-
-
-
-
-
-
TYP
-
-
-
-
-
-
-
12
74
37
16
-
125
67
3.7
2050
600
200
-
-
MAX
-
4
1
25
±100
0.028
120
-
-
-
-
80
150
80
4.5
-
-
-
1.14
80
UNITS
V
V
µA
µA
nA
ns
ns
ns
ns
ns
ns
nC
nC
nC
pF
pF
pF
o
C/W
o
C/W
Drain to Source Breakdown Voltage
Gate Threshold Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
Drain Source On Resistance (Note 2)
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
Total Gate Charge
Gate Charge at 10V
Threshold Gate Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Thermal Resistance Junction to Case
Thermal Resistance Junction to Ambient
I
GSS
r
DS(ON)
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Q
g(TOT)
Q
g(10)
Q
g(TH)
C
ISS
C
OSS
C
RSS
R
θJC
R
θJA
V
DS
= 25V, V
GS
= 0V
f = 1MHz (Figure 12)
Source to Drain Diode Specifications
PARAMETER
Source to Drain Diode Voltage
Diode Reverse Recovery Time
NOTES:
2. Pulse test: pulse width
300µs, duty cycle
2%.
3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3) and Peak Current
Capability Curve (Figure 5).
SYMBOL
V
SD
t
rr
TEST CONDITIONS
I
SD
= 45A
I
SD
= 45A, dI
SD
/dt = 100A/µs
MIN
-
-
TYP
-
-
MAX
1.5
125
UNITS
V
ns
4-456
RFG45N06, RFP45N06, RF1S45N06SM
Typical Performance Curves
1.2
POWER DISSIPATION MULTIPLIER
1.0
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
175
T
C
, CASE TEMPERATURE (
o
C)
I
D
, DRAIN CURRENT (A)
Unless Otherwise Specified
50
40
30
20
10
0
25
50
75
100
125
150
175
T
C
, CASE TEMPERATURE (
o
C)
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
Z
θ
JC
, NORMALIZED TRANSIENT
THERMAL IMPEDANCE
1
0.5
P
DM
0.2
0.1
0.1
0.05
0.02
0.01
SINGLE PULSE
0.01
10
-5
10
-4
10
-3
10
-2
10
-1
t, RECTANGULAR PULSE DURATION (s)
t
1
t
2
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θ
JC
x R
θ
JC
+ T
C
10
0
10
1
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
400
T
J
= MAX RATED
SINGLE PULSE
T
C
= 25
o
C
I
DM
, PEAK CURRENT (A)
10
3
FOR TEMPERATURES ABOVE 25
o
C
DERATE PEAK CURRENT
CAPABILITY AS FOLLOWS:
175
T C
I = I 25
-----------------------
-
150
I
D
, DRAIN CURRENT (A)
100
100µs
1ms
10
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
V
DSS(MAX)
= 60V
1
10
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
10ms
100ms
DC
100
V
GS
= 20V
V
GS
= 10V
10
2
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
40
10
-3
10
-2
10
-1
10
0
10
1
10
2
t, PULSE WIDTH (ms)
10
3
10
4
T
C
= 25
o
C
1
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
FIGURE 5. PEAK CURRENT CAPABILITY
4-457
RFG45N06, RFP45N06, RF1S45N06SM
Typical Performance Curves
300
I
AS,
AVALANCHE CURRENT (A)
Unless Otherwise Specified
(Continued)
125
V
GS
= 10V
I
D
, DRAIN CURRENT (A)
V
GS
= 8V
V
GS
= 7V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
T
C
= 25
o
C
V
GS
= 6V
V
GS
= 5V
V
GS
= 4.5V
10
0
0
1.5
3
4.5
6
7.5
100
100
STARTING T
J
= 25
o
C
75
10
STARTING T
J
= 150
o
C
If R = 0
t
AV
= (L) (I
AS
) / (1.3 RATED BV
DSS
- V
DD
)
50
25
1
0.01
If R
0
t
AV
= (L/R) ln [(I
AS
*R) / (1.3 RATED BV
DSS
- V
DD
) + 1]
0.1
1
t
AV,
TIME IN AVALANCHE (ms)
V
DS,
DRAIN TO SOURCE VOLTAGE (V)
NOTE: Refer to Intersil Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING
FIGURE 7. SATURATION CHARACTERISTICS
I
DS(ON)
, DRAIN TO SOURCE CURRENT (A)
125
100
NORMALIZED DRAIN TO SOURCE
ON RESISTANCE
10
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
DD
= 15V
-55
o
C
25
o
C
2.5
175
o
C
2
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
V
GS
= 10V, I
D
= 45A
75
1.5
50
1
25
0.5
0
0
1
2
3
4
5
6
7
8
9
V
GS
, GATE TO SOURCE VOLTAGE (V)
0
-80
-40
0
40
80
120
160
200
T
J,
JUNCTION TEMPERATURE (
o
C)
FIGURE 8. TRANSFER CHARACTERISTICS
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
2.0
V
GS
= V
DS
, I
D
= 250µA
NORMALIZED DRAIN TO SOURCE
2.0
I
D
= 250µA
BREAKDOWN VOLTAGE
NORMALIZED GATE
THRESHOLD VOLTAGE
1.5
1.5
1.0
1.0
0.5
0.5
0
-80
-40
0
40
80
120
160
200
0
-80
-40
0
40
80
120
160
200
T
J,
JUNCTION TEMPERATURE (
o
C)
T
J,
JUNCTION TEMPERATURE (
o
C)
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
4-458
RFG45N06, RFP45N06, RF1S45N06SM
Typical Performance Curves
4000
V
GS
= 0V, f = 1MHz
C
ISS
= C
GS
+ C
GD
C
RSS
= C
GD
C
OSS
C
DS
+ C
GD
C
ISS
2000
C
OSS
1000
C
RSS
0
0
5
10
15
20
25
Unless Otherwise Specified
(Continued)
60
V
DS,
DRAIN TO SOURCE VOLTAGE (V)
V
DD
= BV
DSS
45
V
DD
= BV
DSS
7.5
10
V
GS,
GATE TO SOURCE VOLTAGE (V)
C, CAPACITANCE (pF)
3000
30
0.75 BV
DSS
0.75 BV
DSS
0.50 BV
DSS
0.50 BV
DSS
0.25 BV
DSS
0.25 BV
DSS
R
L
= 1.33Ω
I
G(REF)
= 1.5mA
V
GS
= 10V
0
20
5.0
15
2.5
0
I
G(REF)
I
G(ACT)
t, TIME (µs)
80
I
G(REF)
I
G(ACT)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
NOTE: Refer to Intersil Application Notes AN7254 and AN7260.
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
FIGURE 13. NORMALIZED SWITCHING WAVEFORMS FOR
CONSTANT GATE CURRENT
Test Circuits and Waveforms
V
DS
BV
DSS
L
VARY t
P
TO OBTAIN
REQUIRED PEAK I
AS
V
GS
DUT
t
P
R
G
-
I
AS
V
DD
t
P
V
DS
V
DD
+
0V
I
AS
0.01Ω
0
t
AV
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
t
ON
t
d(ON)
t
r
R
L
V
DS
+
t
OFF
t
d(OFF)
t
f
90%
90%
R
G
DUT
-
V
DD
0
10%
90%
10%
V
GS
V
GS
0
10%
50%
PULSE WIDTH
50%
FIGURE 16. SWITCHING TIME TEST CIRCUIT
FIGURE 17. RESISTIVE SWITCHING WAVEFORMS
4-459
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参数对比
与RF1S45N06SM相近的元器件有:RFP45N06、RFG45N06。描述及对比如下:
型号 RF1S45N06SM RFP45N06 RFG45N06
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