3.0A Sintered Glass Passivated
Fast Recovery Rectifier
RGF3AB – RGF3MAB
3.0A Sintered Glass Passivated Fast Recovery Rectifier
Features
•
Fast switching for high efficiency
•
Ideal for surface mount automated applications
•
High temperature soldering guaranteed: 260°C/10 seconds,
at terminals
•
Plastic package has UL Flammability Classification 94V-0
•
RoHS Compliance
SMB
Mechanical Data
Case:
Terminals:
Polarity:
Mounting Position:
Weight:
JEDEC DO-214AA (SMB) molded plastic over passivated chip
Tin plated, solderable per MIL-STD-750, Method 2026
Color band denotes cathode end
Any
0.004 ounes,0.12 gram
Maximum Ratings and Electrical Characteristics
(T
A
=25ºC unless otherwise noted)
Symbol
Description
Max. Repetitive Peak
Reverse Voltage
Max. RMS Voltage
Max. DC Blocking
Voltage
Max. Forward
Voltage
Max. Average
Forward Rectified
Current
Max. Full Load
Reverse Current
Peak Forward Surge
Current
Reverse Current
@ VR = VRRM
RGF
3AB
RGF
3BB
RGF
3DB
RGF
3GB
RGF
3JB
RGF
3JAB
RGF
3KB
RGF
3KAB
RGF
3MB
RGF
3MAB
Unit
V
V
V
V
A
µA
A
Conditions
V
RRM
V
RMS
V
DC
V
F
I
F(AV)
I
R(AV)
I
FSM
50
35
50
100
70
100
200
140
200
400
280
400
600
420
600
1.3
3.0
100
115
5
600
420
600
800
560
800
800
560
800
1000
700
1000
1000
700
1000
I
F(AV)
=3.0A
T
L
=100°C
T
A
=55°C
Note 1
T
A
=25°C
I
R
50
120
µA
T
A
=125°C
T
A
=150°C
TAITRON COMPONENTS INCORPORATED
www.taitroncomponents.com
Tel: (800)-TAITRON
Fax: (800)-TAITFAX
(800)-824-8766
(800)-824-8329
(661)-257-6060
(661)-257-6415
Rev. B/AH 2008-01-16
Page 1 of 6
3.0A Sintered Glass Passivated Fast Recovery Rectifier
RGF3AB – RGF3MAB
Symbol
Description
Max. Reverse
Recovery Time
Typical Thermal
Resistance
Typical Junction
Capacitance
RGF
3AB
RGF
3BB
RGF
3DB
RGF
3GB
RGF
3JB
RGF
3JAB
RGF
3KB
RGF
3KAB
RGF
3MB
RGF
3MAB
Unit
nS
Conditions
I
F
=0.5A,
I
R
=1.0A,
I
rr
=0.25A.
Note 2
V
R
=4V,
f=1MHz
Trr
Rth
JA
Rth
JL
C
J
150
250
55
150
500
300
500
300
°C / W
15
60
pF
Operating Junction
T
J,
T
STG
and Storage
Temperature Range
-65 to +175
°C
Note:
1. 8.3ms single half sine-wave superimposed on rated load (JEDEC Method)
2. Thermal resistance from junction to ambient and from junction to lead P.C.B mounted on
0.2 × 0.2” (5.0 × 5.0mm) copper pad areas.
Typical Characteristics Curves
Fig.1- Forward Current Derating Curve
Peak Forward Surge Current, (A)
Average Forward Current, (A)
Fig.2- Maximum Non-Repetitive Forward Surge Current
Lead Temperature (°C)
Number of Cycles at 60Hz
Rev. B/AH 2008-01-16
www.taitroncomponents.com
Page 2 of 6
3.0A Sintered Glass Passivated Fast Recovery Rectifier
RGF3AB – RGF3MAB
Fig.3- Typical Forward Characteristics
Instantaneous Reverse Leakage Current, (µA)
Fig.4-Typical Reverse Characteristics
Instantaneous Forward Current, (A)
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig.5-Typical Junction Capacitance
Junction Capacitance, (pF)
Reverse Voltage (V)
Rev. B/AH 2008-01-16
www.taitroncomponents.com
Page 3 of 6
3.0A Sintered Glass Passivated Fast Recovery Rectifier
RGF3AB – RGF3MAB
Dimensions in inches (mm)
Marking Information:
Rev. B/AH 2008-01-16
www.taitroncomponents.com
Page 4 of 6
3.0A Sintered Glass Passivated Fast Recovery Rectifier
RGF3AB – RGF3MAB
Packing Information:
Carrier Tape Dimensions
(in mm)
Components
Outline
SMB
A0
See note 1
P
8.00±0.10
B0
See note 1
P0
4.0±0.10
D
1.5±0.1
P2
2.0±0.1
E
1.75±0.1
T max.
0.40
F
5.50±0.05
W
12.00±3.00
K0
See note 1
T2
2.67±0.10
B1
8.20max.
D1
1.5min.
Reel Dimensions
(in mm)
A
330 ± 2.0(TR30)
178 ± 2.0(TR70)
B
50min.
C
13.0±0.5
w
18.7max.
T
14.4max.
Rev. B/AH 2008-01-16
www.taitroncomponents.com
Page 5 of 6
PCB设计
