Please refer to LTC standard product data sheet for
other applicable product information.
*DWF = DICE in wafer form.
6
4
5
114mils
×
81mils,
Backside (substrate) metal: Alloyed gold layer
Backside potential: Connect to V
–
L,
LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other
trademarks are the property of their respective owners.
DICE/DWF ELECTRICAL TEST LIMITS
SYMBOL
V
OS
I
OS
I
B
V
IN
CMRR
PSRR
A
VOL
PARAMETER
Input Offset Voltage (Note 1)
Input Offset Current
Input Bias Current
Input Voltage Range
Common Mode Rejection Ratio
Power Supply Rejection Ratio
Large Scale Voltage Gain
V
CM
= ±11V
V
CM
= ±10.3V
V
CM
= 0V
V
CM
= 0V
CONDITIONS
V
S
= ±15V, T
A
= 25°C, V
CM
= 0V, unless otherwise noted.
MIN
MAX
300
150
±400
±11
110
110
5
3.5
2
±12
±10.5
UNITS
μV
nA
nA
V
dB
dB
V/μV
V/μV
V/μV
V
V
V
S
= ±4V to ±16V
V
S
= ±4.5V to ±16V
R
L
≥ 2k, V
O
= ±10V
R
L
≥ 1k, V
O
= ±10V
R
L
≥ 600Ω, V
O
= ±10V
R
L
≥ 2k
R
L
≥ 600Ω
V
OUT
Maximum Output Voltage Swing
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
1
DICE/DWF SPECIFICATION
RH1028M/RH1128M
DICE/DWF ELECTRICAL TEST LIMITS
SYMBOL
SR
I
S
PARAMETER
Slew Rate
Supply Current
CONDITIONS
A
VCL
= –1 (RH1028)
A
VCL
= –1 (RH1128)
V
S
= ±15V, T
A
= 25°C, V
CM
= 0V, unless otherwise noted.
MIN
11
4.5
10.5
MAX
UNITS
V/μs
V/μs
mA
Note 1:
Input offset voltage measurements are performed by automatic
test equipment approximately 0.5 seconds after application of power.
Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus
packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information
on dice performance and lot qualifications via lot sampling test procedures.
Dice data sheet subject to change. Please consult factory for current revision in production.
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