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RM25C64C-BTAC-T

EEPROM 8-TSSOP, 2.7V, T&R, SPI

器件类别:存储    存储   

厂商名称:Adesto Technologies

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Adesto Technologies
包装说明
TSSOP,
Reach Compliance Code
compliant
Factory Lead Time
9 weeks
最大时钟频率 (fCLK)
5 MHz
JESD-30 代码
R-PDSO-G8
长度
4.4 mm
内存密度
65536 bit
内存集成电路类型
EEPROM
内存宽度
1
功能数量
1
端子数量
8
字数
65536 words
字数代码
64000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
64KX1
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行
SERIAL
峰值回流温度(摄氏度)
NOT SPECIFIED
座面最大高度
1.2 mm
串行总线类型
SPI
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
3 mm
文档预览
RM25C64C
64Kbit 2.7V Minimum
Non-volatile Serial Memory
SPI Bus
Features
Memory array: 64Kbit EEPROM-compatible serial memory
Single supply voltage: 2.7V - 3.6V
Serial peripheral interface (SPI) compatible
Supports SPI modes 0 and 3
1.6MHz maximum clock rate for normal read
5MHz maximum clock rate for fast read
Page size: 32 byte
-Byte and Page Write from 1 to 32 bytes
-Byte Write within 25µs
-Page Write within 1ms
Self-timed erase and write cycles
Page or chip erase capability
1mA read current, 1.5mA write current, 5µA power-down current
8-lead packages
RoHS-compliant and halogen-free packaging
Based on Adesto's proprietary CBRAM
®
technology
Data Retention: 10 years
Endurance: 25,000 Write Cycles
Unlimited Read Cycles
Description
The Mavriq
™ 
RM25C64C is an EEPROM-compatible, 64Kbit non-volatile serial
memory utilizing Adesto's CBRAM resistive memory technology. The memory device
uses a single low-voltage supply ranging from 2.7V to 3.6V.
The RM25C64C is accessed through a 4-wire SPI interface consisting of a Serial Data
Input (SDI), Serial Data Output (SDO), Serial Clock (SCK), and Chip Select (CS). The
maximum clock (SCK) frequency in normal read mode is 1.6MHz. In fast read mode
the maximum clock frequency is 5MHz.
Writing into the device can be done from one to 32 bytes at a time. All writing is
internally self-timed. The device also features an Erase which can be performed on
32-byte pages, or the whole chip. Writing a single byte to the Mavriq RM25C32C
device consumes only 10% of the energy required by a Byte Write operation of
EEPROM devices of similar size.
DS-RM25C64C–064F–1/2018
1.
Block Diagram
VCC
Status
Registers
&
Control
Logic
I/O Buffers and Data
Latches
Page Buffer
SCK
SDI
SDO
CS
WP
HOLD
Y-Decoder
SPI
Interface
GND
Address
Latch
&
Counter
X-Decoder
64Kb
CBRAM
Memory
Figure 1-1. Block Diagram
RM25C64C
DS-RM25C64C–064F–1/2018
2
2.
Absolute Maximum Ratings
Table 2-1.
Parameter
Operating ambient temp range
Storage temperature range
Input supply voltage, VCC to GND
Voltage on any pin with respect to GND
ESD protection on all pins (Human Body Model)
Junction temperature
DC output current
Absolute Maximum Ratings
(1)
Specification
0°C to +70° C
-20°C to +100°C
- 0.3V to 3.6V
-0.3V to (VCC + 0.3)
>2kV
85°C
5mA
1. CAUTION: Stresses greater than Absolute Maximum Ratings may cause permanent damage to the devices. These
are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in other
sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods
may reduce device reliability
RM25C64C
DS-RM25C64C–064F–1/2018
3
3.
3.1
Electrical Characteristics
DC Operating Characteristics
Applicable over recommended operating range: TA = 0°C to +70° C, VCC = 2.7V to 3.6V
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CC
Supply Range
VCC Inhibit
Supply current, Fast
Read
V
CC
= 3.6V SCK at 5 MHz
SDO = Open, Read
V
CC
= 3.6V SCK at 1.6 MHz
SDO = Open, Read
2.7
3.6
2.4
V
V
V
VCCI
I
CC1
1.2
3
mA
I
CC2
Supply Current,
Read Operation
1
2
mA
I
CC3
I
CC4
I
CC5
I
IL
I
LO
V
IL
V
IH
V
OL
V
OH
Supply Current,
Program or Erase
Supply Current,
Standby
Supply Current,
Power Down
Input Leakage
Output Leakage
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
V
CC
= 3.6V SCK at 5 MHz
V
CC
= 3.6V CS = V
CC
V
CC
= 3.6V Power Down
SCK, SDI,
 
CS
HOLD
WP
V
IN
=
0V to V
CC
SDO ,
 
CS
 = 
V
CC
 
V
IN
=
0V to V
CC
SCK, SDI,
 
CS
HOLD
WP
SCK, SDI,
 
CS
HOLD
WP
I
OL
= 3.0mA
I
OH
= -100µA
V
CC
- 0.2
-0.3
V
CC
x 0.7
1.5
100
5
3
200
20
1
1
V
CC
x 0.3
V
CC
+ 0.3
0.4
mA
µA
µA
µA
µA
V
V
V
V
RM25C64C
DS-RM25C64C–064F–1/2018
4
3.2
AC Operating Characteristics
Applicable over recommended operating range: TA = 0°C to +70° C, VCC = 2.7V to 3.6V
Symbol
f
SCKF
f
SCK
t
RI
t
FL
t
SCKH
t
SCKL
t
CS
t
CSS
t
CSH
t
DS
t
DH
t
HS
t
HD
t
OV
t
OH
t
LZ
t
HZ
t
DIS
t
PW
t
BP
t
PUD
t
RPD
C
IN
C
OUT
Parameter
SCK Clock Frequency for Fast Read Mode
SCK Clock Frequency for Normal Read Mode
SCK Input Rise Time
SCK Input Fall Time
SCK High Time
SCK Low Time
CS High Time
CS Setup Time
CS Hold Time
Data In Setup Time
Data In Hold Time
HOLD Setup Time
HOLD Hold Time
Output Valid
Output Hold Time Normal Mode
HOLD to output Low Z
HOLD to output High Z
Output Disable Time
Page Write Cycle Time
Byte Write Cycle Time
V
cc
Power-up Delay
(1)
Return from Power-Down Time
SCK, SDI,
 
CS
HOLD
WP
V
IN
=
0V
SDO V
IN
=
0V
25000
(2)
Endurance
Unlimited
(3)
Retention
50
6
8
1
25
0
0
200
200
100
3
100
75
7.5
7.5
100
10
10
4
4
30
30
6.5
Min
0
0
Typ
Max
5
1.6
1
1
Units
MHz
MHz
µs
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
µs
µs
µs
pf
pf
Write
Cycles
Read
Cycles
Years
70C
10
Notes: 1. VCC must be within operating range.
2. Adesto memory products based on CBRAM technology are “Direct‐Write” memories. Endurance cycle calculations follow 
JEDEC specification JESD22‐A117B.
3.
Subject to expected 10‐year data retention specification.
RM25C64C
DS-RM25C64C–064F–1/2018
5
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参数对比
与RM25C64C-BTAC-T相近的元器件有:RM25C64C-BSNC-B、RM25C64C-BTAC-B、RM25C64C-BSNC-T。描述及对比如下:
型号 RM25C64C-BTAC-T RM25C64C-BSNC-B RM25C64C-BTAC-B RM25C64C-BSNC-T
描述 EEPROM 8-TSSOP, 2.7V, T&R, SPI EEPROM 8-SOIC-N, 2.7V, TUBE, SPI EEPROM 8-TSSOP, 1.65V, TUBE, I2C with 128B OTP EEPROM 8-SOIC-N, 1.65V, TUBE, I2C
是否Rohs认证 符合 符合 符合 符合
包装说明 TSSOP, SOP, TSSOP, SOP,
Reach Compliance Code compliant compliant compliant compliant
Factory Lead Time 9 weeks 9 weeks 9 weeks 9 weeks
最大时钟频率 (fCLK) 5 MHz 5 MHz 5 MHz 5 MHz
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
长度 4.4 mm 4.925 mm 4.4 mm 4.925 mm
内存密度 65536 bit 65536 bit 65536 bit 65536 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM
内存宽度 1 1 1 1
功能数量 1 1 1 1
端子数量 8 8 8 8
字数 65536 words 65536 words 65536 words 65536 words
字数代码 64000 64000 64000 64000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C
组织 64KX1 64KX1 64KX1 64KX1
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SOP TSSOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
并行/串行 SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
座面最大高度 1.2 mm 1.75 mm 1.2 mm 1.75 mm
串行总线类型 SPI SPI SPI SPI
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 1.27 mm 0.65 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 3 mm 3.9 mm 3 mm 3.9 mm
厂商名称 Adesto Technologies Adesto Technologies - Adesto Technologies
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