型号
- 型号
- 关键词
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU
器件类别：嵌入式处理器和控制器 微控制器和处理器
器件标准：
| 型号 | RM48L530ZWTT | RM48L730ZWTT | RM48L730PGET | RM48L530 | RM48L730 |
|---|---|---|---|---|---|
| 描述 | ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU | ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU | ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU | RM48L530 16/32-Bit RISC Flash Microcontroller | RM48L730 16/32-Bit RISC Flash Microcontroller |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - |
| 零件包装代码 | BGA | BGA | QFP | - | - |
| 包装说明 | LFBGA, BGA337,19X19,32 | LFBGA, BGA337,19X19,32 | LFQFP, QFP144,.87SQ,20 | - | - |
| 针数 | 337 | 337 | 144 | - | - |
| Reach Compliance Code | compliant | compliant | compliant | - | - |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | - | - |
| 具有ADC | YES | YES | YES | - | - |
| 其他特性 | ALSO REQURIES AT 3.3 V I/O SUPPLY | ALSO REQURIES AT 3.3 V I/O SUPPLY | ALSO REQURIES AT 3.3 V I/O SUPPLY | - | - |
| 位大小 | 32 | 32 | 32 | - | - |
| CPU系列 | CORTEX-R4F | CORTEX-R4F | CORTEX-R4F | - | - |
| 最大时钟频率 | 80 MHz | 80 MHz | 80 MHz | - | - |
| DAC 通道 | NO | NO | NO | - | - |
| DMA 通道 | YES | YES | YES | - | - |
| JESD-30 代码 | S-PBGA-B337 | S-PBGA-B337 | S-PQFP-G144 | - | - |
| JESD-609代码 | e1 | e1 | e4 | - | - |
| 长度 | 16 mm | 16 mm | 20 mm | - | - |
| 湿度敏感等级 | 3 | 3 | 3 | - | - |
| I/O 线路数量 | 16 | 16 | 10 | - | - |
| 端子数量 | 337 | 337 | 144 | - | - |
| 最高工作温度 | 105 °C | 105 °C | 105 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | - |
| PWM 通道 | YES | YES | YES | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | LFBGA | LFBGA | LFQFP | - | - |
| 封装等效代码 | BGA337,19X19,32 | BGA337,19X19,32 | QFP144,.87SQ,20 | - | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | - | - |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | - | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | - | - |
| 电源 | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - |
| RAM（字节） | 196608 | 262144 | 262144 | - | - |
| ROM（单词） | 2097152 | 2097152 | 2097152 | - | - |
| ROM可编程性 | FLASH | FLASH | FLASH | - | - |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.6 mm | - | - |
| 速度 | 200 MHz | 200 MHz | 200 MHz | - | - |
| 最大供电电压 | 1.32 V | 1.32 V | 1.32 V | - | - |
| 最小供电电压 | 1.14 V | 1.14 V | 1.14 V | - | - |
| 标称供电电压 | 1.2 V | 1.2 V | 1.2 V | - | - |
| 表面贴装 | YES | YES | YES | - | - |
| 技术 | CMOS | CMOS | CMOS | - | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - |
| 端子形式 | BALL | BALL | GULL WING | - | - |
| 端子节距 | 0.8 mm | 0.8 mm | 0.5 mm | - | - |
| 端子位置 | BOTTOM | BOTTOM | QUAD | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 16 mm | 16 mm | 20 mm | - | - |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | - |
