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S29AL016M90FFIR12

Flash, 1MX16, 90ns, PBGA64,

器件类别:存储    存储   

厂商名称:AMD(超微)

厂商官网:http://www.amd.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
104648018
包装说明
BGA, BGA64,8X8,40
Reach Compliance Code
unknown
ECCN代码
EAR99
最长访问时间
90 ns
备用内存宽度
8
启动块
TOP
命令用户界面
YES
通用闪存接口
YES
数据轮询
YES
JESD-30 代码
S-PBGA-B64
内存密度
16777216 bit
内存集成电路类型
FLASH
内存宽度
16
部门数/规模
1,2,1,31
端子数量
64
字数
1048576 words
字数代码
1000000
最高工作温度
85 °C
最低工作温度
-40 °C
组织
1MX16
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA64,8X8,40
封装形状
SQUARE
封装形式
GRID ARRAY
并行/串行
PARALLEL
电源
3.3 V
认证状态
Not Qualified
就绪/忙碌
YES
部门规模
16K,8K,32K,64K
最大待机电流
0.000005 A
最大压摆率
0.06 mA
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
切换位
YES
类型
NOR TYPE
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S29AL016M
MirrorBit Flash Memory
TM
16 Megabit (1 M x 16-Bit / 2 M x 8-Bit)
Spansion
Overview
Spansion
, the Flash memory subsidiary of AMD and Fujitsu, is the
world’s leading manufacturer of NOR Flash Memory. Spansion is
committed to delivering outstanding customer service and expert
technical support, as well as providing the highest level of quality
and reliability in its products. All Spansion production fabs are
certified to the demanding ISO/TS16949:2002 global technical
specification, ISO9001:2000 quality standards, and the ISO14001
environmental standard.
FEATURES AND BENEFITS
• Based on Proven, High-Volume
Production MirrorBit
Technology
• Lower Cost Alternative
• Drop-in Replacement for
Standard Floating Gate Products
• High Quality and Reliability
General Description
Spansion S29AL016M devices, manufactured using 230-
nanometer, high-volume production MirrorBit
(two-bit-per-
cell) technology, are drop-in replacements to standard
floating gate products and offer a compelling solution for
lowering your bill of materials. Several packages are available,
offering the widest variety for all applications.
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL
• Established 230nm
MirrorBit technology
• Single 3.0V power supply
• Boot sector architecture
• Industrial operating temperature
range -40 ºC to +85 ºC
• JEDEC pinout and software
standards compliant
SOFTWARE AND HARDWARE
Target Applications
• DVD Players
• Printers
• MP3 Players
• Projectors
• Optical Disk Drives
• Modems
• Mobile Devices
• Program and Erase
Suspend and Resume
• CFI (Common Flash Interface)
compliant
PERFORMANCE CHARACTERISTICS
ACCESS SPEED
Max. Access Time (ns)
Max. CE
#
Access Time (ns)
Max. OE
#
Access Time
(ns)
90
90
25
100
100
25
SECURITY
• Sector Protection/Unprotection
• 128-word/256-byte one-time
programmable Secured
Silicon Sector
QUALITY AND RELIABILITY
CURRENT CONSUMPTION
Active Read (@ 10 MHz) (mA)
Program (mA)
Erase (mA)
Standby Mode (µA)
Note: Typical values shown.
35
40
40
0.4
• Cycling endurance: 100,000 cycles
per sector typical
• Data retention: 20 years typical
PACKAGING
• 48-pin TSOP Package
• 48-ball Fine-pitch BGA Package
• 64-ball Fine-pitch BGA Package
• Standard and Pb-Free packages
available
PROGRAM & ERASE PERFORMANCE
Byte Program Time (µs)
Word Program Time (µs)
Sector Erase Time (sec)
Note: Typical values shown.
18
18
0.7
For more information about Spansion Flash memory solutions, please visit www.spansion.com.
Ordering Information
S29AL016M
90
T
A
I
01
2
PACKING TYPE
0
2
3
01
R1
02
R2
= Tray
= 7˝ Tape and Reel
= 13˝ Tape and Reel
= Top boot sector device
x8/x16, V
CC
= 2.7 – 3.6 V
= Top boot sector device
x8/x16, V
CC
= 3.0 – 3.6 V
= Bottom boot sector device
x8/x16, V
CC
= 2.7 – 3.6 V
= Bottom boot sector device
x8/x16, V
CC
= 3.0 – 3.6 V
= Industrial (-40
o
C to +85
o
C)
= Standard
= Pb-Free
= TSOP Package
= Fine-pitch BGA Package
= Fortified BGA Package
= 90 ns
= 100 ns
MODEL NUMBER
TEMPERATURE RANGE
I
A
F
T
B
F
90
10
PACKAGING MATERIAL SET
PACKAGE TYPE
SPEED OPTIONS
DEVICE NUMBER/DESCRIPTION
16 Mb (2 M x 8-Bit/1 M x 16-Bit), 230nm
MirrorBit
TM
Flash Memory, 3.0 Volt-only,
Read, Program and Erase
AVAILABLE ORDERING PART NUMBERS FOR S29AL016M FLASH MEMORY
Device
Number
S29AL016M
Speed
Option
90, 10
Package & Material
Temperature
TAI, TFI
BAI, BFI
FAI, FFI
Model
Number
01, R1, 02, R2
Packing
Type
0, 2, 3
1
Package
Description
TS048 (TSOP)
2
FBA048 (Fine-pitch BGA)
3
LAA064 (Fortified BGA)
3
PRODUCT SELECTION GUIDE
4
Part Number for New Designs
S29AL016M
Legacy Part Numbers
Am29LV160M
MBM29LV160TM/BM
Notes:
1. Type 0 is standard. Specify others as required: TSOPs
can be packed in Types 0 and 3; BGAs can be packed in
Types 0, 2, or 3.
2. TSOP package marking omits packing type designator
from ordering part numbers
3. BGA package marking omits leading “S29” and packing
type designator from ordering number. For example, the
package marking for Part Number S29AL016M10FA1010
is AL016M10FAI01.
4. Refer to related Spansion OPN map for feature mapping.
SPANSION
915 Deguigne Drive, PO Box 3453 Sunnyvale, CA 94088-3453, USA Tel 408-962-2500 1-866-SPANSION
SPANSION JAPAN
4-33-4 Nishi Shinjuku Shinjuku, Tokyo, 160-0023, Japan Tel. +81-3-5302-2200 Fax +81-3-5302-2674
© 2005 Spansion LLC. All rights reserved. Spansion, the Spansion logo, MirrorBit, and combinations thereof are trademarks of Spansion LLC. AMD is a trademark of Advanced
Micro Devices, Inc. Fujitsu is a registered trademark of Fujitsu Limited. Other names used are for informational purposes only and may be trademarks of their respective owners.
33023A
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参数对比
与S29AL016M90FFIR12相近的元器件有:S29AL016M10BAIR10、S29AL016M10TFI010、S29AL016M90BAIR20。描述及对比如下:
型号 S29AL016M90FFIR12 S29AL016M10BAIR10 S29AL016M10TFI010 S29AL016M90BAIR20
描述 Flash, 1MX16, 90ns, PBGA64, Flash, 1MX16, 100ns, PBGA48, Flash, 1MX16, 100ns, PDSO48, Flash, 1MX16, 90ns, PBGA48,
是否Rohs认证 符合 不符合 符合 不符合
Reach Compliance Code unknown unknown unknown unknown
最长访问时间 90 ns 100 ns 100 ns 90 ns
备用内存宽度 8 8 8 8
启动块 TOP TOP TOP BOTTOM
命令用户界面 YES YES YES YES
通用闪存接口 YES YES YES YES
数据轮询 YES YES YES YES
JESD-30 代码 S-PBGA-B64 R-PBGA-B48 R-PDSO-G48 R-PBGA-B48
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16
部门数/规模 1,2,1,31 1,2,1,31 1,2,1,31 1,2,1,31
端子数量 64 48 48 48
字数 1048576 words 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000 1000000
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
组织 1MX16 1MX16 1MX16 1MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA FBGA TSSOP FBGA
封装等效代码 BGA64,8X8,40 BGA48,6X8,32 TSSOP48,.8,20 BGA48,6X8,32
封装形状 SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
电源 3.3 V 3.3 V 3/3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
就绪/忙碌 YES YES YES YES
部门规模 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K
最大待机电流 0.000005 A 0.000005 A 0.000005 A 0.000005 A
最大压摆率 0.06 mA 0.06 mA 0.06 mA 0.06 mA
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL GULL WING BALL
端子节距 1 mm 0.8 mm 0.5 mm 0.8 mm
端子位置 BOTTOM BOTTOM DUAL BOTTOM
切换位 YES YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE
包装说明 BGA, BGA64,8X8,40 FBGA, BGA48,6X8,32 - FBGA, BGA48,6X8,32
标称供电电压 (Vsup) 3.3 V 3.3 V - 3.3 V
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