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S3F9498-AO

Microcontroller, 8-Bit, FLASH, SAM88RCRI CPU, 8MHz, CMOS, PDIP32

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:SAMSUNG(三星)

厂商官网:http://www.samsung.com/Products/Semiconductor/

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器件参数
参数名称
属性值
厂商名称
SAMSUNG(三星)
包装说明
SDIP, SDIP32,.4
Reach Compliance Code
compliant
位大小
8
CPU系列
SAM88RCRI
JESD-30 代码
R-PDIP-T32
端子数量
32
最高工作温度
85 °C
最低工作温度
-25 °C
封装主体材料
PLASTIC/EPOXY
封装代码
SDIP
封装等效代码
SDIP32,.4
封装形状
RECTANGULAR
封装形式
IN-LINE, SHRINK PITCH
电源
2.5/5 V
认证状态
Not Qualified
RAM(字节)
208
ROM(单词)
8192
ROM可编程性
FLASH
速度
8 MHz
最大压摆率
12 mA
表面贴装
NO
技术
CMOS
温度等级
OTHER
端子形式
THROUGH-HOLE
端子节距
1.78 mm
端子位置
DUAL
文档预览
S3C9498/F9498
8-BIT CMOS
MICROCONTROLLER
USER'S MANUAL
Revision 1
Important Notice
The information in this publication has been carefully
checked and is believed to be entirely accurate at the
time of publication. Samsung assumes no
responsibility, however, for possible errors or
omissions, or for any consequences resulting from
the use of the information contained herein.
Samsung reserves the right to make changes in its
products or product specifications with the intent to
improve function or design at any time and without
notice and is not required to update this
documentation to reflect such changes.
This publication does not convey to a purchaser of
semiconductor devices described herein any license
under the patent rights of Samsung or others.
Samsung makes no warranty, representation, or
guarantee regarding the suitability of its products for
any particular purpose, nor does Samsung assume
any liability arising out of the application or use of any
product or circuit and specifically disclaims any and
all liability, including without limitation any
consequential or incidental damages.
S3C9498/F9498 8-Bit CMOS Microcontroller
User's Manual, Revision 1
Publication Number: 21-S3-C9498/F9498-102004
© 2004 Samsung Electronics
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any
form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written
consent of Samsung Electronics.
Samsung Electronics' microcontroller business has been awarded full ISO-14001
certification (BVQ1 Certificate No. 9330). All semiconductor products are designed and
manufactured in accordance with the highest quality standards and objectives.
Samsung Electronics Co., Ltd.
San #24 Nongseo-Ri, Giheung- Eup
Yongin-City, Gyeonggi-Do, Korea
C.P.O. Box #37, Suwon 449-900
TEL:
FAX:
(82)-(031)-209-1934
(82) (331) 209-1889
"Typical" parameters can and do vary in different
applications. All operating parameters, including
"Typicals" must be validated for each customer
application by the customer's technical experts.
Samsung products are not designed, intended, or
authorized for use as components in systems
intended for surgical implant into the body, for other
applications intended to support or sustain life, or for
any other application in which the failure of the
Samsung product could create a situation where
personal injury or death may occur.
Should the Buyer purchase or use a Samsung
product for any such unintended or unauthorized
application, the Buyer shall indemnify and hold
Samsung and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all claims,
costs, damages, expenses, and reasonable attorney
fees arising out of, either directly or indirectly, any
claim of personal injury or death that may be
associated with such unintended or unauthorized use,
even if such claim alleges that Samsung was
negligent regarding the design or manufacture of said
product.
Home-Page URL: Http://www.samsungsemi.com/
Printed in the Republic of Korea
Preface
The
S3C9498/F9498 Microcontroller User's Manual
is designed for application designers and programmers who are
using the S3C9498/F9498 microcontroller for application development. It is organized in two parts:
Part I
Programming Model
Part II
Hardware Descriptions
Part I contains software-related information to familiarize you with the microcontroller's architecture, programming
model, instruction set, and interrupt structure. It has six chapters:
Chapter 1
Chapter 2
Chapter 3
Product Overview
Address Spaces
Addressing Modes
Chapter 4
Chapter 5
Chapter 6
Control Registers
Interrupt Structure
SAM88RCRI Instruction Set
Chapter 1, "Product Overview," is a high-level introduction to the S3C9498/F9498 with a general product description,
and detailed information about individual pin characteristics and pin circuit types.
Chapter 2, "Address Spaces," explains the S3C9498/F9498 program and data memory, internal register file, and
mapped control registers, and explains how to address them. Chapter 2 also describes working register addressing,
as well as system and user-defined stack operations.
Chapter 3, "Addressing Modes," contains detailed descriptions of the six addressing modes that are supported by
the CPU.
Chapter 4, "Control Registers," contains overview tables for all mapped system and peripheral control register values,
as well as detailed one-page descriptions in standard format. You can use these easy-to-read, alphabetically
organized, register descriptions as a quick-reference source when writing programs.
Chapter 5, "Interrupt Structure," describes the S3C9498/F9498 interrupt structure in detail and further prepares you
for additional information presented in the individual hardware module descriptions in part II.
Chapter 6, "SAM88RCRI Instruction Set," describes the features and conventions of the instruction set used for all
S3C9-series microcontrollers. Several summary tables are presented for orientation and reference. Detailed
descriptions of each ins truction are presented in a standard format. Each instruction description includes one or
more practical examples of how to use the instruction when writing an application program.
A basic familiarity with the information in part I will help you to understand the hardware module descriptions in Part
II. If you are not yet familiar with the SAM88RCRI product family and are reading this manual for the first time, we
recommend that you first read chapters 1–3 carefully. Then, briefly look over the detailed information in chapters 4,
5, and 6. Later, you can reference the information in part I as necessary.
Part II contains detailed information about the peripheral components of the S3C9498/F9498 microcontrollers. Also
included in part II are electrical, mechanical, MTP, and development tools data. It has 14 chapters:
Chapter 7
Chapter 8
Chapter 9
Chapter 10
Chapter 11
Chapter 12
Chapter 13
Clock Circuit
RESET and Power-Down
I/O Ports
Basic Timer
8-bit Timer A/B
16-bit Timer 1
Timer 0
Chapter 14
Chapter 15
Chapter 16
Chapter 17
Chapter 18
Chapter 19
Chapter 20
Chapter 21
UART
Serial I/O Interface
PWM
ADC
Electrical Data
Mechanical Data
MTP
Development Tools
Two order forms are included at the back of this manual to facilitate customer order for S3C9498/F9498
microcontroller: the Mask ROM Order Form, and the Mask Option Selection Form. You can photocopy these forms,
fill them out, and then forward them to your local Samsung Sales Representative.
S3C9498/F9498 MICROCONTROLLER
iii
Table of Contents
Part I — Programming Model
Chapter 1
Product Overview
S3C9-Series Microcontrollers ...............................................................................................................1-1
S3C9498/F9498 Microcontroller ............................................................................................................1-1
MTP ...................................................................................................................................................1-1
Features................................ ................................ ................................ ................................ .............1-2
Block Diagram ....................................................................................................................................1-3
Pin Assignment...................................................................................................................................1-4
Pin Descriptions..................................................................................................................................1-6
Pin Circuits................................ ................................ ................................ ................................ .........1-8
Chapter 2
Address Spaces
Overview................................ ................................ ................................ ................................ .............2-1
Program Memory (ROM)......................................................................................................................2-2
Program Memory (ROM)......................................................................................................................2-2
Register Architecture ...........................................................................................................................2-4
Common Working Register Area (C0H–CFH) ................................ ................................ .........................2-6
System Stack................................ ................................ ................................ ................................ .....2-7
Chapter 3
Addressing Modes
Overview................................ ................................ ................................ ................................ .............3-1
Register Addressing Mode (R)..............................................................................................................3-2
Indirect Register Addressing Mode (IR)..................................................................................................3-3
Indexed Addressing Mode (X) ...............................................................................................................3-7
Direct Address Mode (DA)....................................................................................................................3-10
Direct Address Mode (Continued)..........................................................................................................3-11
Relative Address Mode (RA)................................ ................................ ................................ .................3-12
Immediate Mode (IM) ...........................................................................................................................3-13
S3C9498/F9498 MICROCONTROLLER
v
Table of Contents
(Continued)
Chapter 4
Control Registers
Overview................................ ................................ ................................ ................................ .............4-1
Chapter 5
Interrupt Structure
Overview................................ ................................ ................................ ................................ .............5-1
Interrupt Processing Control Points ...............................................................................................5-1
Enable/Disable Interrupt Instructions (EI, DI) ..................................................................................5-2
Interrupt Pending Function Types..................................................................................................5-2
Interrupt Priority...........................................................................................................................5-2
Interrupt Source SERvice Sequence..............................................................................................5-3
Interrupt Service Routines ................................ ................................ ................................ .............5-3
Generating interrupt Vector Addresses ..........................................................................................5-3
S3C9498/F9498 Interrupt Structure ...............................................................................................5-4
Chapter 6
SAM88RCRI Instruction Set
Overview................................ ................................ ................................ ................................ .............6-1
Register Addressing ....................................................................................................................6-1
Addressing Modes.......................................................................................................................6-1
Flags Register (FLAGS)...............................................................................................................6-4
Flag Descriptions ........................................................................................................................6-4
Instruction Set Notation................................................................................................................6-5
Condition Codes..........................................................................................................................6-9
Instruction Descriptions ................................................................................................................6-10
vi
S3C9498/F9498 MICROCONTROLLER
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参数对比
与S3F9498-AO相近的元器件有:S3C9498XX-SN、S3C9498XX-SO、S3C9498XX-AV、S3C9498XX-AO、S3F9498-SN。描述及对比如下:
型号 S3F9498-AO S3C9498XX-SN S3C9498XX-SO S3C9498XX-AV S3C9498XX-AO S3F9498-SN
描述 Microcontroller, 8-Bit, FLASH, SAM88RCRI CPU, 8MHz, CMOS, PDIP32 Microcontroller, 8-Bit, MROM, SAM88RCRI CPU, 8MHz, CMOS, PDSO28 Microcontroller, 8-Bit, MROM, SAM88RCRI CPU, 8MHz, CMOS, PDSO32 Microcontroller, 8-Bit, MROM, SAM88RCRI CPU, 8MHz, CMOS, PDIP30 Microcontroller, 8-Bit, MROM, SAM88RCRI CPU, 8MHz, CMOS, PDIP32 Microcontroller, 8-Bit, FLASH, SAM88RCRI CPU, 8MHz, CMOS, PDSO28
厂商名称 SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星)
包装说明 SDIP, SDIP32,.4 SOP, SOP28,.4 SOP, SOP32,.45 SDIP, SDIP30,.4 SDIP, SDIP32,.4 SOP, SOP28,.4
Reach Compliance Code compliant compliant compliant compliant compliant compliant
位大小 8 8 8 8 8 8
CPU系列 SAM88RCRI SAM88RCRI SAM88RCRI SAM88RCRI SAM88RCRI SAM88RCRI
JESD-30 代码 R-PDIP-T32 R-PDSO-G28 R-PDSO-G32 R-PDIP-T30 R-PDIP-T32 R-PDSO-G28
端子数量 32 28 32 30 32 28
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SDIP SOP SOP SDIP SDIP SOP
封装等效代码 SDIP32,.4 SOP28,.4 SOP32,.45 SDIP30,.4 SDIP32,.4 SOP28,.4
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE IN-LINE, SHRINK PITCH IN-LINE, SHRINK PITCH SMALL OUTLINE
电源 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM(字节) 208 208 208 208 208 208
ROM(单词) 8192 8192 8192 8192 8192 8192
ROM可编程性 FLASH MROM MROM MROM MROM FLASH
速度 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz
最大压摆率 12 mA 12 mA 12 mA 12 mA 12 mA 12 mA
表面贴装 NO YES YES NO NO YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 OTHER OTHER OTHER OTHER OTHER OTHER
端子形式 THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
端子节距 1.78 mm 1.27 mm 1.27 mm 1.78 mm 1.78 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
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