型号
- 型号
- 关键词
| 型号 | S82S137F | N82S137AN | N82S137N | S82S136F | N82S136F |
|---|---|---|---|---|---|
| 描述 | OTP ROM, 1KX4, 80ns, Bipolar, CDIP18 | OTP ROM, 1KX4, 45ns, Bipolar, PDIP24 | OTP ROM, 1KX4, 60ns, Bipolar, PDIP24 | OTP ROM, 1KX4, 80ns, Bipolar, CDIP18 | OTP ROM, 1KX4, 60ns, Bipolar, CDIP18 |
| 包装说明 | , | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 80 ns | 45 ns | 60 ns | 80 ns | 60 ns |
| JESD-30 代码 | R-CDIP-T18 | R-PDIP-T24 | R-PDIP-T24 | R-CDIP-T18 | R-CDIP-T18 |
| 内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bi |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 24 | 24 | 18 | 18 |
| 字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 75 °C | 75 °C | 125 °C | 75 °C |
| 组织 | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | MILITARY | COMMERCIAL EXTENDED |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Signetics | - | Signetics | Signetics | Signetics |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 |
| 封装代码 | - | DIP | DIP | DIP | DIP |
| 封装等效代码 | - | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
