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SC16IS740/750/760

Single UART with I

C-bus/SPI interface, 64 bytes of transmit

and receive FIFOs, IrDA SIR built-in support

Rev. 7 — 9 June 2011

Product data sheet

1. General description

The SC16IS740/750/760 is a slave I

C-bus/SPI interface to a single-channel high

performance UART. It offers data rates up to 5 Mbit/s and guarantees low operating and

sleeping current. The SC16IS750 and SC16IS760 also provide the application with 8

additional programmable I/O pins. The device comes in very small HVQFN24, TSSOP24

(SC16IS750/760) and TSSOP16 (SC16IS740) packages, which makes it ideally suitable

for handheld, battery operated applications. This family of products enables seamless

protocol conversion from I

C-bus or SPI to and RS-232/RS-485 and are fully bidirectional.

The SC16IS760 differs from the SC16IS750 in that it supports SPI clock speeds up to

15 Mbit/s instead of the 4 Mbit/s supported by the SC16IS750, and in that it supports

IrDA SIR up to 1.152 Mbit/s. In all other aspects, the SC16IS760 is functionally and

electrically the same as the SC16IS750. The SC16IS740 is functionally and electrically

identical to the SC16IS750, with the exception of the programmable I/O pins which are

only present on the SC16IS750.

The SC16IS740/750/760’s internal register set is backward-compatible with the widely

used and widely popular 16C450. This allows the software to be easily written or ported

from another platform.

The SC16IS740/750/760 also provides additional advanced features such as auto

hardware and software flow control, automatic RS-485 support, and software reset. This

allows the software to reset the UART at any moment, independent of the hardware reset

signal.

2. Features and benefits

2.1 General features



Single full-duplex UART

Selectable I

C-bus or SPI interface

3.3 V or 2.5 V operation

Industrial temperature range:

40 C

to +95

C

64 bytes FIFO (transmitter and receiver)

Fully compatible with industrial standard 16C450 and equivalent

Baud rates up to 5 Mbit/s in 16 clock mode

Auto hardware flow control using RTS/CTS

Auto software flow control with programmable Xon/Xoff characters

Single or double Xon/Xoff characters

Automatic RS-485 support (automatic slave address detection)

NXP Semiconductors

SC16IS740/750/760

Single UART with I

C-bus/SPI interface, 64-byte FIFOs, IrDA SIR



Up to eight programmable I/O pins (SC16IS750 and SC16IS760 only)

RS-485 driver direction control via RTS signal

RS-485 driver direction control inversion

Built-in IrDA encoder and decoder interface

SC16IS750 supports IrDA SIR with speeds up to 115.2 kbit/s

SC16IS760 supports IrDA SIR with speeds up to 1.152 Mbit/s

Software reset

Transmitter and receiver can be enabled/disabled independent of each other

Receive and Transmit FIFO levels

Programmable special character detection

Fully programmable character formatting



5-bit, 6-bit, 7-bit or 8-bit character



Even, odd, or no parity



1, 1



, or 2 stop bits

Line break generation and detection

Internal Loopback mode

Sleep current less than 30

A

at 3.3 V

Industrial and commercial temperature ranges

Available in HVQFN24, TSSOP24 (SC16IS750/760) and TSSOP16 (SC16IS740)

packages

2.2 I

C-bus features



Noise filter on SCL/SDA inputs

400 kbit/s maximum speed

Compliant with I

C-bus fast speed

Slave mode only

2.3 SPI features



SC16IS750 supports 4 Mbit/s maximum SPI clock speed

SC16IS760 supports 15 Mbit/s maximum SPI clock speed

Slave mode only

SPI Mode 0

3. Applications



Factory automation and process control



Portable and battery operated devices



Cellular data devices

Please note that IrDA SIR at 1.152 Mbit/s is

not

compatible with IrDA MIR at that speed. Please refer to application notes for usage

of IrDA SIR at 1.152 Mbit/s.

All information provided in this document is subject to legal disclaimers.

SC16IS740_750_760

Product data sheet

Rev. 7 — 9 June 2011

2 of 63

NXP Semiconductors

SC16IS740/750/760

Single UART with I

C-bus/SPI interface, 64-byte FIFOs, IrDA SIR

4. Ordering information

Table 1.

Ordering information

Package

Name

SC16IS740IPW

SC16IS740IPW/Q900

[1]

SC16IS750IBS

SC16IS750IPW

SC16IS760IBS

SC16IS760IPW

[1]

Type number

Description

Version

TSSOP16

HVQFN24

TSSOP24

HVQFN24

TSSOP24

plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

plastic thermal enhanced very thin quad flat package; no leads;

24 terminals; body 4



0.85 mm

plastic thermal enhanced very thin quad flat package; no leads;

24 terminals; body 4



0.85 mm

SOT616-3

plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1

SOT616-3

plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1

SC16IS740IPW/Q900 is AEC-Q100 compliant. Contact interface.support@nxp.com for PPAP.

SC16IS740_750_760

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 9 June 2011

3 of 63

NXP Semiconductors

SC16IS740/750/760

Single UART with I

C-bus/SPI interface, 64-byte FIFOs, IrDA SIR

5. Block diagram

SC16IS750/760

RESET

SCL

SDA

IRQ

1 kΩ (3.3 V)

1.5 kΩ (2.5 V)

C-BUS

16C450

COMPATIBLE

SETS

RTS

CTS

I2C/SPI

GPIO

GPIO[3:0]

GPIO4/DSR

GPIO5/DTR

GPIO6/CD

GPIO7/RI

XTAL1

XTAL2

002aab014

Fig 1.

Block diagram of SC16IS750/760 I

C-bus interface

SC16IS740

RESET

SCL

SDA

IRQ

1 kΩ (3.3 V)

1.5 kΩ (2.5 V)

C-BUS

16C450

COMPATIBLE

SETS

RTS

CTS

I2C/SPI

XTAL1

XTAL2

002aab971

Fig 2.

Block diagram of SC16IS740 I

C-bus interface

SC16IS740_750_760

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 9 June 2011

4 of 63

NXP Semiconductors

SC16IS740/750/760

Single UART with I

C-bus/SPI interface, 64-byte FIFOs, IrDA SIR

SC16IS750/760

RESET

SCLK

IRQ

1 kΩ (3.3 V)

1.5 kΩ (2.5 V)

SPI

16C450

COMPATIBLE

SETS

RTS

CTS

I2C/SPI

GPIO

GPIO[3:0]

GPIO4/DSR

GPIO5/DTR

GPIO6/CD

GPIO7/RI

XTAL1

XTAL2

002aab396

Fig 3.

Block diagram of SC16IS750/760 SPI interface

SC16IS740

RESET

SCLK

IRQ

1 kΩ (3.3 V)

1.5 kΩ (2.5 V)

SPI

16C450

COMPATIBLE

SETS

RTS

CTS

I2C/SPI

XTAL1

XTAL2

002aab972

Fig 4.

Block diagram of SC16IS740 SPI interface

SC16IS740_750_760

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 9 June 2011

5 of 63

参数对比

与SC16IS750IBS,151相近的元器件有：SC16IS760IPW,112、SC16IS750IBS,157、SC16IS750IPW,112、SC16IS760IBS,151、SC16IS740IPW/Q900,。描述及对比如下：

型号	SC16IS750IBS,151	SC16IS760IPW,112	SC16IS750IBS,157	SC16IS750IPW,112	SC16IS760IBS,151	SC16IS740IPW/Q900,
描述	UART Interface IC UART I2C/SPI	UART 接口集成电路 I2C/SPI-UARTBRIDGE W/IRDA AND GPIO	UART 接口集成电路 I2C/SPI-UARTBRIDGE	UART 接口集成电路 I2C/SPI-UARTBRIDGE	UART 接口集成电路 UART I2C/SPI	UART 接口集成电路 I2C/SPI-UART BRIDGE W/IRDA
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-
是否Rohs认证	符合	符合	符合	符合	符合	-
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	QFN	TSSOP2	QFN	TSSOP2	QFN	-
包装说明	4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN24	4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24	4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN-24	TSSOP, TSSOP24,.25	4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN24	-
针数	24	24	24	24	24	-
制造商包装代码	SOT616-3	SOT355-1	SOT616-3	SOT355-1	SOT616-3	-
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	-
其他特性	ALSO OPERATES AT 2.5V SUPPLY	CAN ALSO OPERATES AT 2.5 V SUPPLY	CAN ALSO OPERATES AT 2.5 V SUPPLY	CAN ALSO OPERATES AT 2.5 V SUPPLY	ALSO OPERATES AT 2.5V SUPPLY	-
地址总线宽度	2	2	2	2	2	-
边界扫描	NO	NO	NO	NO	NO	-
最大时钟频率	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	-
通信协议	ASYNC, BIT	ASYNC, BIT	ASYNC, BIT	ASYNC, BIT	ASYNC, BIT	-
最大数据传输速率	0.625 MBps	0.625 MBps	0.625 MBps	0.625 MBps	0.625 MBps	-
JESD-30 代码	S-PQCC-N24	R-PDSO-G24	S-PQCC-N24	R-PDSO-G24	S-PQCC-N24	-
JESD-609代码	e4	e4	e4	e4	e4	-
长度	4 mm	7.8 mm	4 mm	7.8 mm	4 mm	-
低功率模式	YES	YES	YES	YES	YES	-
湿度敏感等级	1	1	1	1	1	-
串行 I/O 数	1	1	1	1	1	-
端子数量	24	24	24	24	24	-
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	-
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
封装代码	HVQCCN	TSSOP	HVQCCN	TSSOP	HVQCCN	-
封装等效代码	LCC24,.16SQ,20	TSSOP24,.25	LCC24,.16SQ,20	TSSOP24,.25	LCC24,.16SQ,20	-
封装形状	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	-
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-
峰值回流温度（摄氏度）	260	260	260	260	260	-
电源	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	-
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
座面最大高度	1 mm	1.1 mm	1 mm	1.1 mm	1 mm	-
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-
最小供电电压	3 V	3 V	3 V	3 V	3 V	-
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-
表面贴装	YES	YES	YES	YES	YES	-
技术	CMOS	CMOS	CMOS	CMOS	CMOS	-
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
端子面层	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	-
端子形式	NO LEAD	GULL WING	NO LEAD	GULL WING	NO LEAD	-
端子节距	0.5 mm	0.65 mm	0.5 mm	0.65 mm	0.5 mm	-
端子位置	QUAD	DUAL	QUAD	DUAL	QUAD	-
处于峰值回流温度下的最长时间	30	30	30	30	30	-
宽度	4 mm	4.4 mm	4 mm	4.4 mm	4 mm	-
uPs/uCs/外围集成电路类型	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	-