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SC22203440

CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 0.000222uF, SURFACE MOUNT, 0404, CHIP

器件类别:无源元件    电容器   

厂商名称:Skyworks(思佳讯)

厂商官网:http://www.skyworksinc.com

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器件参数
参数名称
属性值
厂商名称
Skyworks(思佳讯)
包装说明
, 0404
Reach Compliance Code
unknown
ECCN代码
EAR99
电容
0.000222 µF
电容器类型
FILM CAPACITOR
介电材料
SILICON DIOXIDE AND NITRIDE
制造商序列号
SC
安装特点
SURFACE MOUNT
负容差
20%
最高工作温度
200 °C
最低工作温度
-65 °C
封装形状
RECTANGULAR PACKAGE
包装方法
WAFFLE PACK
正容差
20%
尺寸代码
0404
表面贴装
YES
端子面层
NOT SPECIFIED
端子形状
ONE SURFACE
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MIS Chip Capacitors
SC Series
Features
Readily Available From Stock
High Reliability Silicon Oxide–Nitride
Dielectric
Low Loss — Typically 0.04 dB in a 50
System
Operation through 26 GHz
Wide Temperature Operation
Absolute Maximum Ratings
Characteristic
Operating Temp Range (T
OP
)
Value
-65 to +200°C
-65 to +200°C
100 V
Description
Alpha’s MIS Chip Capacitors are available in a wide range
of sizes and capacitance values. They are frequently used
in applications requiring DC blocking, and RF bypassing,
or as a fixed capacitance tuning element in filters,
oscillators, and matching networks. The devices have a
dielectric composed of thermally grown silicon dioxide over
which a layer of silicon nitride is deposited. This dielectric
possesses a low temperature coefficient of capacitance,
very high insulation resistance. The devices also exhibit
excellent long term stability making them suitable for high
reliability applications. The capacitors have a high
dielectric breakdown which permits the use of thin
dielectrics resulting in larger capacitance per unit area than
our previous catalog offerings. The temperature coefficient
is less that 50 ppm/°C, and operation is suitable from
-65°C to 200°C. Compared to ceramic capacitors,
Skyworks’ MIS chip capacitors offer higher Q, and a lower
insertion loss of 0.04 dB, in a 50
system. Insulation
resistance is greater than 10
5
M
Ω.
To accommodate high
volume automated assembly methods, wafers can be
supplied on expanded film frame. To reduce cost, chips
can be supplied with only sample testing packaged in vials.
Packaging in waffle packs with 100% electrical test and
visual inspection is always available if required.
Storage Temp Range (T
STG
)
Dielectric Withstanding Voltage
Electrical Specifications
Capacitance Range
1:
0.8 to 1000 pF
Temperature Coefficient: 50 ppm/°C Typical
Capacitance Tolerance
2:
±20%
Operating Temperature: -65°C to 200°C
Dielectric Withstanding Voltage: 100 V
Insulation Resistance: 10
5
Megohms Typical
Leakage Current: Typ. < 1 nA
Typical SPDT Switch
BIAS
OUTPUT
C
2
C
3
BIAS
INPUT 1
C
1
D
1
D
2
C
4
INPUT 2
C
2
, C
3
— Chip MIS Capacitor
C
1
, C
4
— Chip or Beam — Lead MIS Capacitor
D
1
, D
2
DSG6474 Beam — Lead PIN Diode
Skyworks Solutions, Inc.
[978] 241-7000
Fax
[978] 241-7906
Email
sales@skyworksinc.com
www.skyworksinc.com
Specifications subject to change without notice. 10/02A
1
MIS Chip Capacitors
SC Series
Electrical Specifications
Part Number
SC00080710
SC00080912
SC00120710
SC00120912
SC00180710
SC00180912
SC00260710
SC00260912
SC00380710
SC00380912
SC00560710
SC00560912
SC00680710
SC00680912
SC00820710
SC00820912
SC00821518
SC01000710
SC01000912
SC01001518
SC01500710
SC01500912
SC01501518
SC02200912
SC02201518
SC03301518
SC04701518
SC06801518
SC10002430
SC10003440
SC22203440
SC33303440
SC50004450
SC99906068
Capacitance
(+ 20%)
0.8
0.8
1.2
1.2
1.8
1.8
2.6
2.6
3.8
3.8
5.6
5.6
6.8
6.8
8.2
8.2
8.2
10
10
10
15
15
15
22
22
33
47
68
100
100
222
333
500
1000
Chip Dimensions
(+ 1 mil)
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
15 mil Pad/18 mil Chip
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
15 mil Pad/18 mil Chip
7 mil Pad/10 mil Chip
9 mil Pad/12 mil Chip
15 mil Pad/18 mil Chip
9 mil Pad/12 mil Chip
15 mil Pad/18 mil Chip
15 mil Pad/18 mil Chip
15 mil Pad/18 mil Chip
15 mil Pad/18 mil Chip
24 mil Pad/30 mil Chip
34 mil Pad/40 mil Chip
34 mil Pad/40 mil Chip
34 mil Pad/40 mil Chip
44 mil Pad/50 mil Chip
60 mil Pad/68 mil Chip
Example
Part Number Structure — SCXXXXYYZZ
where:
SC = Silicon Capacitor
XXXX = Capacitance (pF)
YY = Square Contact Size (mils)
ZZ = Square Chip Size (mils)
ZZ
± 0.001˚
YY
± 0.001˚
CHIP THICKNESS
0.005
± 0.001˚
Performance Data
Tests on typical MIS capacitors at L and S band show
insertion loss to be 1/2 to 1/3 that of equivalent ceramic
type capacitors, without any of the associated resonance
problems. Power tests indicate that the only limitation is
the actual breakdown voltage of the device (see data
section). A typical insertion loss versus frequency graph
is shown in Figure 1. This data is taken from an actual tests
circuit with series mounted beam-lead or chip capacitors
on a 50
microstrip transmission line. The apparent
higher loss at lower frequencies on the lower capacitance
units is strictly due to the capacitive reactance of the
capacitor.
10.0
1 pF
Insertion Loss (dB)
1.0
8.2 pF
100 pF
47 pF
100 pF
0.01
2
6
10
14
18
1–47 pF
Available through distribution.
0.10
Frequency (GHz)
Figure 1. Typical Insertion
Loss vs. Frequency (50
System)
2
Skyworks Solutions, Inc.
[978] 241-7000
Fax
[978] 241-7906
Email
sales@skyworksinc.com
www.skyworksinc.com
Specifications subject to change without notice. 10/02A
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参数对比
与SC22203440相近的元器件有:SC00080710、SC00260710、SC00380710、SC00560710、SC00680710、SC00180710。描述及对比如下:
型号 SC22203440 SC00080710 SC00260710 SC00380710 SC00560710 SC00680710 SC00180710
描述 CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 0.000222uF, SURFACE MOUNT, 0404, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 0.0000008uF, SURFACE MOUNT, 0101, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 0.0000026uF, SURFACE MOUNT, 0101, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 0.0000038uF, SURFACE MOUNT, 0101, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 0.0000056uF, SURFACE MOUNT, 0101, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 0.0000068uF, SURFACE MOUNT, 0101, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 0.0000018uF, SURFACE MOUNT, 0101, CHIP
厂商名称 Skyworks(思佳讯) Skyworks(思佳讯) Skyworks(思佳讯) Skyworks(思佳讯) Skyworks(思佳讯) Skyworks(思佳讯) Skyworks(思佳讯)
包装说明 , 0404 , 0101 , 0101 , 0101 , 0101 , 0101 , 0101
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
电容 0.000222 µF 8e-7 µF 0.0000026 µF 0.0000038 µF 0.0000056 µF 0.0000068 µF 0.0000018 µF
电容器类型 FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR
介电材料 SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE
制造商序列号 SC SC SC SC SC SC SC
安装特点 SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT
负容差 20% 20% 20% 20% 20% 20% 20%
最高工作温度 200 °C 200 °C 200 °C 200 °C 200 °C 200 °C 200 °C
最低工作温度 -65 °C -65 °C -65 °C -65 °C -65 °C -65 °C -65 °C
封装形状 RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE
包装方法 WAFFLE PACK WAFFLE PACK WAFFLE PACK WAFFLE PACK WAFFLE PACK WAFFLE PACK WAFFLE PACK
正容差 20% 20% 20% 20% 20% 20% 20%
尺寸代码 0404 0101 0101 0101 0101 0101 0101
表面贴装 YES YES YES YES YES YES YES
端子面层 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
端子形状 ONE SURFACE ONE SURFACE ONE SURFACE ONE SURFACE ONE SURFACE ONE SURFACE ONE SURFACE
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