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SLE24C164-D/P

EEPROM, 2KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8

器件类别:存储    存储   

厂商名称:Infineon(英飞凌)

厂商官网:http://www.infineon.com/

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
零件包装代码
DIP
包装说明
PLASTIC, DIP-8
针数
8
Reach Compliance Code
unknow
ECCN代码
EAR99
最大时钟频率 (fCLK)
0.4 MHz
数据保留时间-最小值
40
耐久性
1000000 Write/Erase Cycles
I2C控制字节
1DDDMMMR
JESD-30 代码
R-PDIP-T8
JESD-609代码
e0
长度
9.4 mm
内存密度
16384 bi
内存集成电路类型
EEPROM
内存宽度
8
功能数量
1
端子数量
8
字数
2048 words
字数代码
2000
工作模式
SYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-40 °C
组织
2KX8
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装等效代码
DIP8,.3
封装形状
RECTANGULAR
封装形式
IN-LINE
并行/串行
SERIAL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
5 V
认证状态
Not Qualified
座面最大高度
4.7 mm
串行总线类型
I2C
最大待机电流
0.00005 A
最大压摆率
0.003 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
NO
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
7.62 mm
最长写入周期时间 (tWC)
8 ms
写保护
HARDWARE/SOFTWARE
Base Number Matches
1
文档预览
Standard EEPROM ICs
SLx 24C164/P
16 Kbit (2048
×
8 bit)
Serial CMOS-EEPROM with
I
2
C Synchronous 2-Wire Bus
and Page Protection Mode
Data Sheet 1999-02-02
Edition 1999-02-02
Published by Siemens AG,
Bereich Halbleiter, Marketing-
Kommunikation, Balanstraße 73,
81541 München
©
Siemens AG 1999.
All Rights Reserved.
Attention please!
As far as patents or other rights of third par-
ties are concerned, liability is only assumed
for components, not for applications, pro-
cesses and circuits implemented within
components or assemblies.
The information describes the type of
component and shall not be considered as
assured characteristics.
Terms of delivery and rights to change design
reserved.
For questions on technology, delivery and
prices please contact the Semiconductor
Group Offices in Germany or the Siemens
Companies and Representatives worldwide
(see address list).
Due to technical requirements components
may contain dangerous substances. For
information on the types in question please
contact your nearest Siemens Office,
Semiconductor Group.
Siemens AG is an approved CECC
manufacturer.
Packing
Please use the recycling operators known to
you. We can also help you – get in touch with
your nearest sales office. By agreement we
will take packing material back, if it is sorted.
You must bear the costs of transport.
For packing material that is returned to us
unsorted or which we are not obliged to
accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices
or systems must be expressly authorized
for such purpose!
Critical components
1
of the Semiconductor
Group of Siemens AG, may only be used in
life-support devices or systems
2
with the
express written approval of the
Semiconductor Group of Siemens AG.
1 A critical component is a component used
in a life-support device or system whose
failure can reasonably be expected to
cause the failure of that life-support
device or system, or to affect its safety or
effectiveness of that device or system.
2 Life support devices or systems are
intended (a) to be implanted in the human
body, or (b) to support and/or maintain
and sustain human life. If they fail, it is
reasonable to assume that the health of
the user may be endangered.
SLx 24C164/P
Revision History:
Previous Version:
Page
Page
(in previous (in current
Version)
Version)
Current Version: 1999-02-02
06.97
Subjects (major changes since last revision)
Changes in the complete P-DIP-8-4 changed to P-DIP-8-3, P-DSO-8-3 changed to P-DSO-8-2.
document
3
4
4
4
5
6
6
11, 12
14
15
18
21
23
23
19
25
25
25
4
5
5
5
6
7
7
13, 14
15
17
19
23
24
25
26
27
27
27
Text changed to “Typical programming time 5 ms for up to 16 bytes”.
SLA 24C164-D-3/P and SLA 24C164-S-3/P deleted.
Voltage changed from 4.5 V...5.5 V to 2.7 V...5.5 V.
Package (TSSOP, die, wafer delivery) added.
WP =
V
CC
protects the upper half entire memory.
Footnote added “Values are temperature ….”
Text changed to “The device with a voltage range of 2.7 … 5.5. V is
available …”.
The erase/write cycle is finished latest after 10 8 ms.
Text added “(see
figure 10)”.
Figure 11: second command byte is a
CSR
and not CSW.
Figure 13: “CSW” changed to “CSR”.
The write or erase cycle is finished latest after 10 4 ms.
Figure 17: “ACK” deleted before “STOP”.
Line “Supply voltage”: Text deleted.
“Capacitive load …” added.
Some timings changed.
The line “erase/write cycle” removed.
Chapter 8.4 “Erase and Write Characteristics” added.
Page Protection Mode™ is a trademark of Siemens AG.
I
2
C Bus
Purchase of Siemens
I
2
C components conveys the license under the Philips
I
2
C patent to use the components in
the
I
2
C system provided the system conforms to the
I
2
C specifications defined by Philips.
16 Kbit (2048
×
8 bit) Serial CMOS
EEPROMs,
I
2
C Synchronous 2-Wire Bus,
Page Protection Mode
SLx 24C164/P
1
1.1
Overview
Features
• Data EEPROM internally organized as
2048 bytes and 128 pages
×
16 bytes
• Page protection mode, flexible page-by-page
hardware write protection
– Additional protection EEPROM of 128 bits, 1 bit
per data page
– Protection setting for each data page by writing its
protection bit
– Protection management without switching WP pin
• Low power CMOS
V
CC
= 2.7 to 5.5 V operation
• Two wire serial interface bus,
I
2
C-Bus compatible
• Three chip select pins to address 8 devices
P-DIP-8-3
P-DSO-8-2
• Filtered inputs for noise suppression with Schmitt trigger
• Clock frequency up to 400 kHz
• High programming flexibility
– Internal programming voltage
– Self timed programming cycle including erase
– Byte-write and page-write programming, between 1 and 16 bytes
– Typical programming time 5 ms for up to 16 bytes
• High reliability
– Endurance 10
6
cycles
1)
– Data retention 40 years
1)
– ESD protection 4000 V on all pins
• 8 pin DIP/DSO packages
• Available for extended temperature ranges
– Industrial:
40 °C to + 85 °C
– Automotive:
40°C to + 125 °C
1)
Values are temperature dependent, for further information please refer to your Siemens Sales office.
Semiconductor Group
4
1999-02-02
SLx 24C164/P
Ordering Information
Type
SLA 24C164-D/P
SLA 24C164-S/P
SLE 24C164-D/P
SLE 24C164-S/P
Ordering Code
Q67100-H3504
Q67100-H3499
Q67100-H3503
Q67100-H3497
Package
P-DIP-8-3
P-DIP-8-3
Temperature
Voltage
– 40 °C … + 85 °C 2.7 V...5.5 V
– 40°C … + 125 °C 2.7 V...5.5 V
P-DSO-8-2 – 40 °C … + 85 °C 2.7 V...5.5 V
P-DSO-8-2 – 40°C … + 125 °C 2.7 V...5.5 V
Other types are available on request
– Temperature range (– 55 °C
+ 150 °C)
– Package (TSSOP, die, wafer delivery)
1.2
Pin Configuration
P-DIP-8-3
CS0
CS1
CS2
1
2
3
4
8
7
6
5
IEP02125
P-DSO-8-2
V
CC
WP
SCL
SDA
CS0
CS1
CS2
V
SS
1
2
3
4
8
7
6
5
IEP02124
V
CC
WP
SCL
SDA
V
SS
Figure 1
Pin Configuration
(top view)
Pin Definitions and Functions
Table 1
Pin No.
1, 2, 3
4
5
6
7
8
Symbol
CS0, CS1, CS2
Function
Chip select inputs
Ground
Serial bidirectional data bus
Serial clock input
Write protection input
Supply voltage
V
SS
SDA
SCL
WP
V
CC
Semiconductor Group
5
1999-02-02
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参数对比
与SLE24C164-D/P相近的元器件有:SLA24C164-S/P、SLA24C164-D/P、SLE24C164-S/P。描述及对比如下:
型号 SLE24C164-D/P SLA24C164-S/P SLA24C164-D/P SLE24C164-S/P
描述 EEPROM, 2KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, DSO-8 EEPROM, 2KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, DSO-8
是否无铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合
零件包装代码 DIP SOIC DIP SOIC
包装说明 PLASTIC, DIP-8 PLASTIC, DSO-8 PLASTIC, DIP-8 PLASTIC, DSO-8
针数 8 8 8 8
Reach Compliance Code unknow unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99
最大时钟频率 (fCLK) 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz
数据保留时间-最小值 40 40 40 40
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C控制字节 1DDDMMMR 1DDDMMMR 1DDDMMMR 1DDDMMMR
JESD-30 代码 R-PDIP-T8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8
JESD-609代码 e0 e0 e0 e0
长度 9.4 mm 4.93 mm 9.4 mm 4.93 mm
内存密度 16384 bi 16384 bi 16384 bi 16384 bi
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM
内存宽度 8 8 8 8
功能数量 1 1 1 1
端子数量 8 8 8 8
字数 2048 words 2048 words 2048 words 2048 words
字数代码 2000 2000 2000 2000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 125 °C 85 °C 85 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
组织 2KX8 2KX8 2KX8 2KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP DIP SOP
封装等效代码 DIP8,.3 SOP8,.25 DIP8,.3 SOP8,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE
并行/串行 SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.7 mm 1.75 mm 4.7 mm 1.75 mm
串行总线类型 I2C I2C I2C I2C
最大待机电流 0.00005 A 0.00005 A 0.00005 A 0.00005 A
最大压摆率 0.003 mA 0.003 mA 0.003 mA 0.003 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V 3 V
表面贴装 NO YES NO YES
技术 CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE INDUSTRIAL INDUSTRIAL AUTOMOTIVE
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING
端子节距 2.54 mm 1.27 mm 2.54 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 7.62 mm 3.94 mm 7.62 mm 3.94 mm
写保护 HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1 1 1
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