SM8237,SM8237 pdf中文资料,SM8237引脚图,SM8237电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

额定感应系数

22 µH

功能数量

端子数量

最小工作温度

-20 Cel

最大工作温度

85 Cel

自谐振频率

18 MHz

加工封装描述

CHIP, 1008, ROHS COMPLIANT

欧盟RoHS规范

Yes

状态

EOL

电感类型

GENERAL PURPOSE INDUCTOR

case_size_code

1008

结构

Molded Chip

核心材料

CERAMIC

直流电阻

4 ohm

电感应用

RF INDUCTOR

jesd_609_code

制造商系列

ckage_heigh

1.6 mm

ckage_length

2.5 mm

ckage_style__meter_

SMT

ckage_width

2 mm

cking_method

1额定值的最小品质因数

最大额定电流

0.1600 A

series

ELJ-P

形状大小描述

RECTANGULAR PACKAGE

隔离

表面贴装

YES

端子涂层

TIN COPPER

端子布局

DUAL ENDED

端子形状

J BEND

测试频率

2.52 MHz

偏差

10 %

参数对比

与SM8237相近的元器件有：CDRH3D16-220、ELJPC220KF、LQH3C220、LEM2520-220、LB2012B220M、CMDSH2-3、CMDSH-3、BAT54。描述及对比如下：

型号	SM8237	CDRH3D16-220	ELJPC220KF	LQH3C220	LEM2520-220	LB2012B220M	CMDSH2-3	CMDSH-3	BAT54
描述	1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD	1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD	1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD	1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD	1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD	1 ELEMENT, 22 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD	1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD	0.1 A, SILICON, SIGNAL DIODE	0.2 A, 30 V, SILICON, SIGNAL DIODE
额定感应系数	22 µH	22 µH	22 µH	22 µH	22 µH	-	22 µH	-	-
功能数量	1	1	1	1	1	-	1	-	-
端子数量	2	2	2	2	2	-	2	-	3
最小工作温度	-20 Cel	-20 Cel	-20 Cel	-20 Cel	-20 Cel	-	-20 Cel	-	-
最大工作温度	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel	-	85 Cel	-	-
自谐振频率	18 MHz	18 MHz	18 MHz	18 MHz	18 MHz	-	18 MHz	-	-
加工封装描述	CHIP, 1008, ROHS COMPLIANT	CHIP, 1008, ROHS COMPLIANT	CHIP, 1008, ROHS COMPLIANT	CHIP, 1008, ROHS COMPLIANT	CHIP, 1008, ROHS COMPLIANT	-	CHIP, 1008, ROHS COMPLIANT	-	ROHS COMPLIANT, 塑料 PACKAGE-3
欧盟RoHS规范	Yes	Yes	Yes	Yes	Yes	-	Yes	-	-
状态	EOL	EOL	EOL	EOL	EOL	-	EOL	-	ACTIVE
电感类型	GENERAL PURPOSE INDUCTOR	GENERAL PURPOSE INDUCTOR	GENERAL PURPOSE INDUCTOR	GENERAL PURPOSE INDUCTOR	GENERAL PURPOSE INDUCTOR	-	GENERAL PURPOSE INDUCTOR	-	-
case_size_code	1008	1008	1008	1008	1008	-	1008	-	-
结构	Molded Chip	Molded Chip	Molded Chip	Molded Chip	Molded Chip	-	Molded Chip	-	单一的
核心材料	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	-	CERAMIC	-	-
直流电阻	4 ohm	4 ohm	4 ohm	4 ohm	4 ohm	-	4 ohm	-	-
电感应用	RF INDUCTOR	RF INDUCTOR	RF INDUCTOR	RF INDUCTOR	RF INDUCTOR	-	RF INDUCTOR	-	-
jesd_609_code	e2	e2	e2	e2	e2	-	e2	-	-
制造商系列	PC	PC	PC	PC	PC	-	PC	-	-
ckage_heigh	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm	-	-
ckage_length	2.5 mm	2.5 mm	2.5 mm	2.5 mm	2.5 mm	-	2.5 mm	-	-
ckage_style__meter_	SMT	SMT	SMT	SMT	SMT	-	SMT	-	-
ckage_width	2 mm	2 mm	2 mm	2 mm	2 mm	-	2 mm	-	-
cking_method	TR	TR	TR	TR	TR	-	TR	-	-
1额定值的最小品质因数	20	20	20	20	20	-	20	-	-
最大额定电流	0.1600 A	0.1600 A	0.1600 A	0.1600 A	0.1600 A	-	0.1600 A	-	-
series	ELJ-P	ELJ-P	ELJ-P	ELJ-P	ELJ-P	-	ELJ-P	-	-
形状大小描述	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	-	RECTANGULAR PACKAGE	-	-
隔离	NO	NO	NO	NO	NO	-	NO	-	-
表面贴装	YES	YES	YES	YES	YES	-	YES	-	Yes
端子涂层	TIN COPPER	TIN COPPER	TIN COPPER	TIN COPPER	TIN COPPER	-	TIN COPPER	-	-
端子布局	DUAL ENDED	DUAL ENDED	DUAL ENDED	DUAL ENDED	DUAL ENDED	-	DUAL ENDED	-	-
端子形状	J BEND	J BEND	J BEND	J BEND	J BEND	-	J BEND	-	-
测试频率	2.52 MHz	2.52 MHz	2.52 MHz	2.52 MHz	2.52 MHz	-	2.52 MHz	-	-
偏差	10 %	10 %	10 %	10 %	10 %	-	10 %	-	-