型号
- 型号
- 关键词
| 型号 | SMJ44C250-10HJM | SMJ44C250-12HJM | SMJ44C250-10JDM | SMJ44C250-12JDM |
|---|---|---|---|---|
| 描述 | 256KX4 VIDEO DRAM, 100ns, CDSO28, CERAMIC, SOJ-28 | 256KX4 VIDEO DRAM, 120ns, CDSO28, CERAMIC, SOJ-28 | 256KX4 VIDEO DRAM, 100ns, CDIP28, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-28 | 256KX4 VIDEO DRAM, 120ns, CDIP28, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-28 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOJ | SOJ | DIP | DIP |
| 包装说明 | SOJ, SOJ28,.44 | SOJ, SOJ28,.44 | DIP, DIP28,.4 | DIP, DIP28,.4 |
| 针数 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 100 ns | 120 ns | 100 ns | 120 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| JESD-30 代码 | R-CDSO-J28 | R-CDSO-J28 | R-CDIP-T28 | R-CDIP-T28 |
| 长度 | 18.542 mm | 18.542 mm | 35.925 mm | 35.925 mm |
| 内存密度 | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 28 | 28 | 28 | 28 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | SOJ | SOJ | DIP | DIP |
| 封装等效代码 | SOJ28,.44 | SOJ28,.44 | DIP28,.4 | DIP28,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 4.521 mm | 4.521 mm | 4.445 mm | 4.445 mm |
| 最大待机电流 | 0.015 A | 0.015 A | 0.015 A | 0.015 A |
| 最大压摆率 | 0.11 mA | 0.1 mA | 0.11 mA | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10.541 mm | 10.541 mm | 10.16 mm | 10.16 mm |