SMP-0SCMC
Trisil™ for telecommunication equipment protection
Datasheet
production data
Features
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■
Bidirectional crowbar protection
Repetitive peak pulse current
(T
amb
-40 °C to +85 °C)
– I
PP
= 100 A (10/1000 µs)
– I
PP
= 200 A (5/310 µs)
– I
PP
= 500 A (2/10 µs)
Breakdown voltage: from 72 V to 310 V
Operating T
j
max: 150 °C
Micro capacitance technology
JEDEC registered package outline
SMB
(JEDEC DO-214AA)
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■
■
■
Complies with the following standards
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■
■
■
■
■
Telcordia GR-1089
ITU-T K20/21/45 enhanced level
TIA-968
YD/T 950 / 993 / 1082
IEC 61000-4-5
IEC 61000-4-2 level 4
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
MIL STD 883H - Method 3015-8 Class 3B
Resin meets UL 94, V0
MIL-STD-750, method 2026 soldererabilty
EIA STD RS-481 and IEC 60286-3 packing
IPC 7531 footprint
UL497B recognized, UL file E136224
Description
The devices in the SMP-0SCMC series are micro
capacitance Trisils designed to protect broadband
telecommunication equipment such as DSL
modems, subscriber gateways and DSLAMs from
lightning surges and power faults.
Trisils are not subject to aging and provide a
failsafe mode in short circuit for a better
protection. They are used to help equipment to
meet main standards such as UL60950, IEC950 /
CSA C22.2and UL1459.
The SMP-0SCMC series is packaged in SMB.
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TM: Trisil is a trademark of STMicroelectronics
January 2013
This is information on a product in full production.
Doc ID 022779 Rev 1
1/7
www.st.com
7
Characteristics
SMP-0SCMC
1
Table 1.
Voltage
pulse
Current
pulse
I
PP
Characteristics
Absolute ratings (-40 °C < T
amb
< 85 °C) for repetitive peak pulse current I
PP
0.5/700
2/10
1.2/50
10/160
10/560
9/720
10/360
10/1000
10/700
µs
0.2/310
100
2/10
500
8/20
400
10/160
200
10/560
150
5/320
200
10/360
175
10/1000
100
5/310
200
µs
A
Table 2.
Symbol
Absolute ratings (T
amb
= 25 °C) for other parameters
Parameter
t = 10 ms
t = 0.2 s
t=1s
t=2s
t = 15 mn
Value
61
18
9
7
4
-55 to 150
-40 to 150
260
Unit
I
TSM
Non repetitive surge peak on-state current (sinusoidal)
(1)
A
T
stg
T
j
T
L
Storage temperature range
Operating junction temperature range
Maximum lead temperature for soldering during 10 s.
°C
°C
°C
1. In fail safe mode, the device acts as a short circuit.
Figure 1.
Electrical characteristics - definitions (T
amb
= 25 °C)
Symbol
V
RM
V
BO
I
RM
I
PP
I
T
I
H
V
T
C
Parameter
Stand-off voltage
Breakover voltage
Leakage current
Peak pulse current
On-state current
Holding current
On-state voltage
Capacitance
I
PP
I
IT
I
BO
I
H
I
RM
V
VT
V
RM
V
R
V
BO
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Doc ID 022779 Rev 1
SMP-0SCMC
Table 3.
Electrical characteristics - values (T
amb
= 25 °C)
I
RM
max @ V
RM
Order code
Max.
µA
SMP0720SCMC
SMP0900SCMC
SMP1100SCMC
SMP1300SCMC
SMP1500SCMC
SMP1800SCMC
SMP2100SCMC
SMP2300SCMC
SMP2600SCMC
SMP3100SCMC
5
5
5
5
5
5
5
5
5
5
V
65
75
90
120
140
170
180
190
220
275
V
BR
Typ.
V
72
90
110
130
150
180
210
230
260
310
V
BO
Max.
V
88
98
130
160
180
220
240
260
300
350
I
H
Min.
mA
150
150
150
150
150
150
150
150
150
150
V
T
@ 2.2 A
Max.
V
3
3
3
3
3
3
3
3
3
3
Characteristics
C @ 2 V C @ 50 V
Max.
pF
80
80
75
75
75
70
45
45
40
40
Max.
pF
45
45
40
40
40
35
25
25
20
20
T
(1)
10
-4
/°C
9
9.1
9.3
9.5
9.7
9.9
10.2
10.3
10.6
11
1. For V
BR
versus junction temperature, use the following formula: V
BR
@ T
J
= V
BR
@ 25 °C x (1 +
T
x (T
J
- 25))
Figure 2.
Pulse waveform
Figure 3.
I
TSM
(A)
Non repetitive surge peak on-state
current versus overload duration
F=50Hz
Tj initial = 25°C
%I
PP
100
Repetitive peak pulse current
tr = rise time (µs)
tp = pulse duration time (µs)
70
60
50
40
50
30
20
10
0
t
r
t
p
t
0
1.E-02
1.E-01
t(s)
1.E+00
1.E+01
1.E+02
1.E+03
Doc ID 022779 Rev 1
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Characteristics
SMP-0SCMC
Figure 4.
Relative variation of holding
current versus junction
temperature
Figure 5.
Percentage of change of break over
voltage versus junction
temperature
2,0
1,8
1,6
1,4
1,2
1,0
0,8
0,6
IH(Tj) / IH(Tj = 25 °C)
Tj (°C)
-20
0
20
40
60
80
100
120
140
0,4
-40
14
12
10
8
6
4
2
0
-2
-4
-6
-8
-40
%
Tj (°C)
-20
0
20
40
60
80
100
120
140
Figure 6.
Relative variation of junction capacitance versus reverse applied voltage (typical
values)
1,4
1,2
1,0
0,8
0,6
0,4
VR (V)
0,2
1
10
100
1000
C[VR]/C[VR =2]
F = 1 MHz
VRMS = 1 V
Tj = 25 °C
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Doc ID 022779 Rev 1
SMP-0SCMC
Package information
2
Package information
●
●
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Table 4.
SMB dimensions
Dimensions
Ref.
E1
Millimeters
Min.
Max.
2.45
0.20
2.20
0.40
5.60
4.60
3.95
1.50
Inches
Min.
0.075
0.002
0.077
0.006
0.201
0.159
0.130
0.030
Max.
0.096
0.008
0.087
0.016
0.220
0.181
0.156
0.059
D
A1
A2
b
1.90
0.05
1.95
0.15
5.10
4.05
3.30
0.75
E
c
A1
E
E1
b
C
L
A2
D
L
Figure 7.
Footprint dimensions
in mm (inches)
1.62
(0.064)
2.18
(0.086)
Figure 8.
Marking layout
1.62
2.60
(0.064) (0.102)
e
x x x x x
z y ww
e: ECOPACK compliance
XXXXX: Marking
Z: Manufacturing location
Y: Year
WW: week
5.84
(0.23)
Doc ID 022779 Rev 1
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微控制器 MCU
