型号
- 型号
- 关键词
| 型号 | SN54BCT374WR | SN74BCT374DW-00 | SN74BCT374N-10 | SN74BCT374DB | SN74BCT374DBE4 | SN54BCT374FK | SN54BCT374J-00 | SN54BCT374FKR |
|---|---|---|---|---|---|---|---|---|
| 描述 | BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 | BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20 | BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | IC BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, Bus Driver/Transceiver | BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20 | BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 |
| 包装说明 | DFP, | SOP, | DIP, | SSOP, | SSOP, | QCCN, LCC20,.35SQ | DIP, | QCCN, |
| Reach Compliance Code | unknown | unknown | unknown | compliant | compliant | not_compliant | unknown | unknown |
| 系列 | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT |
| JESD-30 代码 | R-GDFP-F20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 |
| 长度 | 13.09 mm | 12.8 mm | 24.325 mm | 7.2 mm | 7.2 mm | 8.89 mm | 24.195 mm | 8.89 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | SOP | DIP | SSOP | SSOP | QCCN | DIP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 最大电源电流（ICC） | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA |
| 传播延迟（tpd） | 10.6 ns | 10 ns | 10 ns | 10 ns | 10 ns | 10.6 ns | 10.6 ns | 10.6 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 2.65 mm | 5.08 mm | 2 mm | 2 mm | 2.03 mm | 5.08 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | YES | YES | NO | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 0.65 mm | 0.65 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
| 宽度 | 6.92 mm | 7.5 mm | 7.62 mm | 5.3 mm | 5.3 mm | 8.89 mm | 7.62 mm | 8.89 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |