AND-OR-Invert Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDIP14
厂商官网:https://www.rocelec.com/
下载文档型号 | SN54H50J | SNJ54H50J | SN5450W | SN74H50N | SN54H50W | SNJ54H50W | SNJ5450W |
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描述 | AND-OR-Invert Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDIP14 | AND-OR-Invert Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDIP14 | AND-OR-Invert Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDFP14, CERAMIC, FP-14 | AND-OR-Invert Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, PDIP14 | AND-OR-Invert Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDFP14 | AND-OR-Invert Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDFP14, HERMETIC SEALED, CERAMIC, FP-14 | AND-OR-Invert Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDFP14, CERAMIC, FP-14 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, | DIP, | DFP, | DIP, | DFP, | DFP, | DFP, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | 2 EXPAND INPUTS FOR 1 FUNCTION | 2 EXPAND INPUTS FOR 1 FUNCTION | 1 EXPANDABLE FUNCTION | 2 EXPAND INPUTS FOR 1 FUNCTION | 2 EXPAND INPUTS FOR 1 FUNCTION; CENTER PIN VCC AND GND | 2 EXPAND INPUTS FOR 1 FUNCTION; CENTER PIN VCC AND GND | 1 EXPANDABLE FUNCTION |
系列 | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L |
JESD-30 代码 | R-GDIP-T14 | R-GDIP-T14 | R-GDFP-F14 | R-PDIP-T14 | R-GDFP-F14 | R-GDFP-F14 | R-GDFP-F14 |
长度 | 19.56 mm | 19.56 mm | 9.21 mm | 19.305 mm | 9.21 mm | 8.725 mm | 9.21 mm |
逻辑集成电路类型 | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
输入次数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DFP | DIP | DFP | DFP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK | FLATPACK | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
传播延迟(tpd) | 11 ns | 11 ns | 15 ns | 11 ns | 11 ns | 11 ns | 15 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 2.03 mm | 5.08 mm | 2.03 mm | 2.03 mm | 2.03 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | NO | YES | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | FLAT | FLAT |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 6.29 mm | 7.62 mm | 6.29 mm | 6.35 mm | 6.29 mm |
厂商名称 | Rochester Electronics | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - |