型号 | SN54LV4052AJ | SN74LV4052ANS | SN74LV4052ADGV |
---|---|---|---|
描述 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16, CERAMIC, DIP-16 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, PLASTIC, SO-16 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, PLASTIC, TVSOP-16 |
零件包装代码 | DIP | SOIC | SOIC |
包装说明 | DIP, | SOP, | TSSOP, |
针数 | 16 | 16 | 16 |
Reach Compliance Code | unknown | compliant | unknown |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-CDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
长度 | 19.56 mm | 10.2 mm | 4.4 mm |
信道数量 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 |
标称断态隔离度 | 45 dB | 45 dB | 45 dB |
通态电阻匹配规范 | 30 Ω | 1.5 Ω | 1.5 Ω |
最大通态电阻 (Ron) | 180 Ω | 180 Ω | 180 Ω |
最高工作温度 | 125 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V |
表面贴装 | NO | YES | YES |
最长断开时间 | 28 ns | 28 ns | 28 ns |
最长接通时间 | 28 ns | 28 ns | 28 ns |
技术 | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 0.4 mm |
端子位置 | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 5.3 mm | 3.6 mm |
Base Number Matches | 1 | 1 | - |