描述 |
Logic Gates Quadruple 2-Input Positive-NAND gates |
Logic Gates Quadruple 2-Input Positive-NAND gates |
Logic Gates Quadruple 2-Input Positive-NAND gates |
Logic Gates Quad 2-Input Pos- NAND Gates |
Logic Gates Quadruple 2-Input Positive-NAND gates |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
零件包装代码 |
TSSOP |
TSSOP |
SOIC |
SOIC |
SSOP |
包装说明 |
TSSOP, TSSOP14,.25 |
TSSOP, TSSOP14,.25 |
SOP, SOP14,.3 |
SOP, SOP14,.3 |
GREEN, PLASTIC, SSOP-14 |
针数 |
14 |
14 |
14 |
14 |
14 |
Reach Compliance Code |
unknow |
unknow |
unknow |
unknow |
compli |
系列 |
AC |
AC |
AC |
AC |
AC |
JESD-30 代码 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
长度 |
5 mm |
5 mm |
10.2 mm |
10.2 mm |
6.2 mm |
负载电容(CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
逻辑集成电路类型 |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
最大I(ol) |
0.012 A |
0.012 A |
0.012 A |
0.012 A |
0.012 A |
功能数量 |
4 |
4 |
4 |
4 |
4 |
输入次数 |
2 |
2 |
2 |
2 |
2 |
端子数量 |
14 |
14 |
14 |
14 |
14 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
TSSOP |
TSSOP |
SOP |
SOP |
SSOP |
封装等效代码 |
TSSOP14,.25 |
TSSOP14,.25 |
SOP14,.3 |
SOP14,.3 |
SSOP14,.3 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
NOT SPECIFIED |
电源 |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
Prop。Delay @ Nom-Su |
10 ns |
10 ns |
10 ns |
10 ns |
10 ns |
传播延迟(tpd) |
10 ns |
10 ns |
10 ns |
10 ns |
10 ns |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
施密特触发器 |
NO |
NO |
NO |
NO |
NO |
座面最大高度 |
1.2 mm |
1.2 mm |
2 mm |
2 mm |
2 mm |
最大供电电压 (Vsup) |
6 V |
6 V |
6 V |
6 V |
6 V |
最小供电电压 (Vsup) |
2 V |
2 V |
2 V |
2 V |
2 V |
标称供电电压 (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.65 mm |
0.65 mm |
1.27 mm |
1.27 mm |
0.65 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
4.4 mm |
4.4 mm |
5.3 mm |
5.3 mm |
5.3 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
- |
湿度敏感等级 |
1 |
1 |
1 |
1 |
- |
包装方法 |
TAPE AND REEL |
- |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |