型号
- 型号
- 关键词
| 型号 | SN74ACT7808-25PAG | SN74ACT7808-30FN | SN74ACT7808-25FN | SN74ACT7808-40FN |
|---|---|---|---|---|
| 描述 | 2048 X 9 asynchronous FIFO memory 64-TQFP 0 to 70 | FIFO 2048 X 9 asynch FIFO Memory | FIFO 2048 X 9 asynch FIFO Memory | FIFO 2048 X 9 asynch FIFO Memory |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP | LCC | LCC | LCC |
| 包装说明 | TFQFP, TQFP64,.47SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ |
| 针数 | 64 | 44 | 44 | 44 |
| Reach Compliance Code | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week |
| 最长访问时间 | 22 ns | 25 ns | 22 ns | 28 ns |
| 最大时钟频率 (fCLK) | 40 MHz | 33.3 MHz | 40 MHz | 25 MHz |
| 周期时间 | 25 ns | 30 ns | 25 ns | 40 ns |
| JESD-30 代码 | S-PQFP-G64 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 10 mm | 16.585 mm | 16.585 mm | 16.585 mm |
| 内存密度 | 18432 bi | 18432 bi | 18432 bi | 18432 bi |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 9 | 9 | 9 | 9 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 44 | 44 | 44 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 2KX9 | 2KX9 | 2KX9 | 2KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFQFP | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | TQFP64,.47SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | J BEND | J BEND | J BEND |
| 端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10 mm | 16.585 mm | 16.585 mm | 16.585 mm |
