Dual Positive-Edge-Triggered D-Type Flip-Flops With Clear and Preset 14-SSOP -40 to 125
型号 | SN74AHC74DBLE | SN54AHC74FK | SN54AHC74FKR | SN74AHC74PWLE | SN54AHC74W | SN54AHC74WR | SN74AHC74DGV |
---|---|---|---|---|---|---|---|
描述 | Dual Positive-Edge-Triggered D-Type Flip-Flops With Clear and Preset 14-SSOP -40 to 125 | AHC SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, CC-20 | AHC SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20 | Dual Positive-Edge-Triggered D-Type Flip-Flops With Clear and Preset 14-TSSOP -40 to 125 | AHC SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP14, CERAMIC, FP-14 | AHC SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP14, CERAMIC, FP-14 | AHC SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14, PLASTIC, TVSOP-14 |
零件包装代码 | SSOP | QFN | QLCC | TSSOP | DFP | DFP | SOIC |
包装说明 | SSOP, SSOP14,.3 | QCCN, | QCCN, | TSSOP, TSSOP14,.25 | DFP, | DFP, | TSSOP, TSSOP14,.25,16 |
针数 | 14 | 20 | 20 | 14 | 14 | 14 | 14 |
Reach Compliance Code | not_compliant | unknown | unknown | not_compliant | unknown | unknown | unknown |
系列 | AHC/VHC/H/U/V | AHC | AHC | AHC/VHC/H/U/V | AHC | AHC | AHC |
JESD-30 代码 | R-PDSO-G14 | S-CQCC-N20 | S-CQCC-N20 | R-PDSO-G14 | R-GDFP-F14 | R-GDFP-F14 | R-PDSO-G14 |
长度 | 6.2 mm | 8.89 mm | 8.89 mm | 5 mm | 9.21 mm | 9.21 mm | 4.4 mm |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 20 | 20 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C |
最低工作温度 | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -40 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | SSOP | QCCN | QCCN | TSSOP | DFP | DFP | TSSOP |
封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | FLATPACK | FLATPACK | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 17.5 ns | 17.5 ns | 17.5 ns | 17.5 ns | 17.5 ns | 17.5 ns | 17.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2 mm | 2.03 mm | 2.03 mm | 1.2 mm | 2.03 mm | 2.03 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | MILITARY | MILITARY | AUTOMOTIVE | MILITARY | MILITARY | INDUSTRIAL |
端子形式 | GULL WING | NO LEAD | NO LEAD | GULL WING | FLAT | FLAT | GULL WING |
端子节距 | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.4 mm |
端子位置 | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 5.3 mm | 8.89 mm | 8.89 mm | 4.4 mm | 6.29 mm | 6.29 mm | 3.6 mm |
最小 fmax | 110 MHz | 110 MHz | 110 MHz | 110 MHz | 110 MHz | 110 MHz | 110 MHz |
厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |