描述 |
Single Schmitt-Trigger Inverter 5-SC70 -40 to 85 |
Single Schmitt-Trigger Inverter 5-SOT-23 -40 to 85 |
Single Schmitt-Trigger Inverter 5-SOT-23 -40 to 85 |
Single Schmitt-Trigger Inverter 5-SC70 -40 to 85 |
Single Schmitt-Trigger Inverter 5-SC70 -40 to 85 |
Single Schmitt-Trigger Inverter 5-DSBGA -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
SOIC |
SOT-23 |
SOT-23 |
SOIC |
SOIC |
BGA |
包装说明 |
SC-70, 5 PIN |
SOT-23, 5 PIN |
LSSOP, TSOP5/6,.11,37 |
TSSOP, TSSOP5/6,.08 |
TSSOP, TSSOP5/6,.08 |
VFBGA, BGA5,2X3,20 |
针数 |
5 |
5 |
5 |
5 |
5 |
5 |
Reach Compliance Code |
compliant |
compliant |
compli |
compli |
compli |
compli |
Factory Lead Time |
1 week |
1 week |
6 weeks |
6 weeks |
6 weeks |
1 week |
系列 |
AUC |
AUC |
AUC |
AUC |
AUC |
AUC |
JESD-30 代码 |
R-PDSO-G5 |
R-PDSO-G5 |
R-PDSO-G5 |
R-PDSO-G5 |
R-PDSO-G5 |
R-XBGA-B5 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
e4 |
e1 |
长度 |
2 mm |
2.9 mm |
2.9 mm |
2 mm |
2 mm |
1.4 mm |
负载电容(CL) |
15 pF |
15 pF |
15 pF |
15 pF |
15 pF |
15 pF |
逻辑集成电路类型 |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
最大I(ol) |
0.009 A |
0.009 A |
0.009 A |
0.009 A |
0.009 A |
0.009 A |
湿度敏感等级 |
1 |
1 |
1 |
1 |
1 |
1 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
输入次数 |
1 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
5 |
5 |
5 |
5 |
5 |
5 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
封装代码 |
TSSOP |
LSSOP |
LSSOP |
TSSOP |
TSSOP |
VFBGA |
封装等效代码 |
TSSOP5/6,.08 |
TSOP5/6,.11,37 |
TSOP5/6,.11,37 |
TSSOP5/6,.08 |
TSSOP5/6,.08 |
BGA5,2X3,20 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
包装方法 |
TR |
TR |
TR |
TR |
TR |
TR |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
260 |
电源 |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
最大电源电流(ICC) |
0.01 mA |
0.01 mA |
0.01 mA |
0.01 mA |
0.01 mA |
0.01 mA |
传播延迟(tpd) |
4 ns |
4 ns |
4 ns |
4 ns |
4 ns |
4 ns |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
施密特触发器 |
YES |
YES |
YES |
YES |
YES |
YES |
座面最大高度 |
1.1 mm |
1.45 mm |
1.45 mm |
1.1 mm |
1.1 mm |
0.5 mm |
最大供电电压 (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
最小供电电压 (Vsup) |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
标称供电电压 (Vsup) |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
BALL |
端子节距 |
0.65 mm |
0.95 mm |
0.95 mm |
0.65 mm |
0.65 mm |
0.5 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
BOTTOM |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
1.25 mm |
1.6 mm |
1.6 mm |
1.25 mm |
1.25 mm |
0.9 mm |
Prop。Delay @ Nom-Su |
- |
- |
4 ns |
4 ns |
4 ns |
4 ns |