型号
- 型号
- 关键词
| 型号 | SN74CB3Q3251DBQRG4 | SN74CB3Q3251PWRE4 | SN74CB3Q3251PWRG4 | SN74CB3Q3251PWE4 | SN74CB3Q3251 |
|---|---|---|---|---|---|
| 描述 | Multiplexer Switch ICs 2.5V 3.3V LO VLTG HI BandwidthBus Switch | Multiplexer Switch ICs Low-Power RS-485 Transceiver | Multiplexer Switch ICs 2.5V 3.3V LO VLTG HI BandwidthBus Switch | Multiplexer Switch ICs 1-of-8 FET Mltplxr/Demltplxr | SN74CB3Q3251 1-of-8 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | SOIC | TSSOP | TSSOP | TSSOP | - |
| 包装说明 | SSOP, SSOP16,.25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | - |
| 针数 | 16 | 16 | 16 | 16 | - |
| Reach Compliance Code | unknown | unknown | unknown | unknown | - |
| 系列 | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | - |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | - |
| 长度 | 4.9 mm | 5 mm | 5 mm | 5 mm | - |
| 逻辑集成电路类型 | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | - |
| 湿度敏感等级 | 2 | 1 | 1 | 1 | - |
| 功能数量 | 1 | 1 | 1 | 1 | - |
| 输入次数 | 1 | 1 | 1 | 1 | - |
| 输出次数 | 8 | 8 | 8 | 8 | - |
| 端子数量 | 16 | 16 | 16 | 16 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SSOP | TSSOP | TSSOP | TSSOP | - |
| 封装等效代码 | SSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | - |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - |
| 传播延迟（tpd） | 0.18 ns | 0.18 ns | 0.18 ns | 0.18 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.75 mm | 1.2 mm | 1.2 mm | 1.2 mm | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | - |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| 表面贴装 | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 0.635 mm | 0.65 mm | 0.65 mm | 0.65 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 3.9 mm | 4.4 mm | 4.4 mm | 4.4 mm | - |
