SN74HC09FN,SN74HC09FN pdf中文资料,SN74HC09FN引脚图,SN74HC09FN电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

Texas Instruments(德州仪器)

包装说明

QCCJ, LDCC20,.4SQ

Reach Compliance Code

not_compliant

JESD-30 代码

S-PQCC-J20

逻辑集成电路类型

AND GATE

端子数量

最高工作温度

85 °C

最低工作温度

-40 °C

输出特性

OPEN-DRAIN

封装主体材料

PLASTIC/EPOXY

封装代码

QCCJ

封装等效代码

LDCC20,.4SQ

封装形状

SQUARE

封装形式

CHIP CARRIER

电源

2/6 V

认证状态

Not Qualified

施密特触发器

表面贴装

YES

技术

CMOS

温度等级

INDUSTRIAL

端子形式

J BEND

端子节距

1.27 mm

端子位置

QUAD

Base Number Matches

参数对比

与SN74HC09FN相近的元器件有：SN74HC09NP3、SN74HC09FHP4、SN74HC09FN3、SN74HC09FH4、SN74HC09JP4、SN74HC09N3、SN74HC09J4、SN74HC09FH、SN74HC09J。描述及对比如下：

型号	SN74HC09FN	SN74HC09NP3	SN74HC09FHP4	SN74HC09FN3	SN74HC09FH4	SN74HC09JP4	SN74HC09N3	SN74HC09J4	SN74HC09FH	SN74HC09J
描述	IC,LOGIC GATE,QUAD 2-INPUT AND,HC-CMOS,LDCC,20PIN,PLASTIC	SN74HC09NP3	SN74HC09FHP4	SN74HC09FN3	SN74HC09FH4	SN74HC09JP4	SN74HC09N3	SN74HC09J4	IC,LOGIC GATE,QUAD 2-INPUT AND,HC-CMOS,LLCC,20PIN,CERAMIC	IC,LOGIC GATE,QUAD 2-INPUT AND,HC-CMOS,DIP,14PIN,CERAMIC
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
包装说明	QCCJ, LDCC20,.4SQ	DIP, DIP14,.3	QCCN, LCC20,.35SQ	QCCJ, LDCC20,.4SQ	QCCN, LCC20,.35SQ	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	QCCN, LCC20,.35SQ	DIP, DIP14,.3
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 代码	S-PQCC-J20	R-PDIP-T14	S-XQCC-N20	S-PQCC-J20	S-XQCC-N20	R-XDIP-T14	R-PDIP-T14	R-XDIP-T14	S-XQCC-N20	R-XDIP-T14
逻辑集成电路类型	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE
端子数量	20	14	20	20	20	14	14	14	20	14
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出特性	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC
封装代码	QCCJ	DIP	QCCN	QCCJ	QCCN	DIP	DIP	DIP	QCCN	DIP
封装等效代码	LDCC20,.4SQ	DIP14,.3	LCC20,.35SQ	LDCC20,.4SQ	LCC20,.35SQ	DIP14,.3	DIP14,.3	DIP14,.3	LCC20,.35SQ	DIP14,.3
封装形状	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
封装形式	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
电源	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
施密特触发器	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
表面贴装	YES	NO	YES	YES	YES	NO	NO	NO	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	J BEND	THROUGH-HOLE	NO LEAD	J BEND	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
端子节距	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
端子位置	QUAD	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1	1	1	1	1