型号
- 型号
- 关键词
Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer
器件标准：
| 型号 | SN74HCT139NE4 | SN74HCT139PWTE4 | SN74HCT139DTE4 | SN74HCT139DT | SN74HCT139DBRE4 |
|---|---|---|---|---|---|
| 描述 | Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer | Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer | Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer | Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer | Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP | TSSOP | SOIC | SOIC | SOIC |
| 包装说明 | DIP, DIP16,.3 | TSSOP, TSSOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SSOP, SSOP16,.3 |
| 针数 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknow | unknow | unknow | compli | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | HCT | HCT | HCT | HCT | HCT |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 19.305 mm | 5 mm | 9.9 mm | 9.9 mm | 6.2 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | TSSOP | SOP | SOP | SSOP |
| 封装等效代码 | DIP16,.3 | TSSOP16,.25 | SOP16,.25 | SOP16,.25 | SSOP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
| 包装方法 | TUBE | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Su | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns |
| 传播延迟（tpd） | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.2 mm | 1.75 mm | 1.75 mm | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 4.4 mm | 3.9 mm | 3.9 mm | 5.3 mm |
| Base Number Matches | 1 | 1 | - | - | 1 |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
