型号
- 型号
- 关键词
Encoders, Decoders, Multiplexers & Demultiplexers Dual 4-to-1 Data Slct/Mltpx W/3St Otp
器件标准：
| 型号 | SN74LS253NSRE4 | SN74LS253NSR | SN74LS253NE4 | SN74LS253DRE4 | SN74LS253D | SN74LS253DE4 |
|---|---|---|---|---|---|---|
| 描述 | Encoders, Decoders, Multiplexers & Demultiplexers Dual 4-to-1 Data Slct/Mltpx W/3St Otp | Encoders, Decoders, Multiplexers & Demultiplexers Dual 4-to-1 Data Slct/Mltpx W/3St Otp | Encoders, Decoders, Multiplexers & Demultiplexers Dual 4-to-1 Data Slct/Mltpx W/3St Otp | Encoders, Decoders, Multiplexers & Demultiplexers Dual 4-to-1 Data Slct/Mltpx W/3St Otp | Encoders, Decoders, Multiplexers & Demultiplexers Dual 4-to-1 Data Slct/Mltpx W/3St Otp | Encoders, Decoders, Multiplexers & Demultiplexers Dual 4-to-1 Data Slct/Mltpx W/3St Otp |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | SOIC | DIP | SOIC | SOIC | SOIC |
| 包装说明 | SOP, SOP16,.3 | SOP, SOP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
| 系列 | - | LS | LS | LS | LS | LS |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | - | e4 | e4 | e4 | e4 | e4 |
| 长度 | - | 10.2 mm | 19.305 mm | 9.9 mm | 9.9 mm | 9.9 mm |
| 负载电容（CL） | - | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| 逻辑集成电路类型 | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I（ol） | - | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| 湿度敏感等级 | - | 1 | - | 1 | 1 | 1 |
| 功能数量 | - | 2 | 2 | 2 | 2 | 2 |
| 输入次数 | - | 4 | 4 | 4 | 4 | 4 |
| 输出次数 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | DIP | SOP | SOP | SOP |
| 封装等效代码 | - | SOP16,.3 | DIP16,.3 | SOP16,.25 | SOP16,.25 | SOP16,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 包装方法 | - | TAPE AND REEL | TUBE | TAPE AND REEL | TUBE | TUBE |
| 峰值回流温度（摄氏度） | - | 260 | NOT SPECIFIED | 260 | 260 | 260 |
| 电源 | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大电源电流（ICC） | - | 14 mA | 12 mA | 12 mA | 12 mA | 12 mA |
| Prop。Delay @ Nom-Su | - | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| 传播延迟（tpd） | - | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 2 mm | 5.08 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | - | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | - | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | NO | YES | YES | YES |
| 技术 | - | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 5.3 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Base Number Matches | - | 1 | - | 1 | 1 | 1 |
模拟电子
stm32/stm8
嵌入式系统
FPGA/CPLD
模拟电子
嵌入式系统
