型号
- 型号
- 关键词
| 型号 | SN74LV125ADGV | SN54LV125AFK | SN74LV125ANS | SN74LV125ADB | SN54LV125AW | SN54LV125AJ |
|---|---|---|---|---|---|---|
| 描述 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, PLASTIC, SOP-14 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, DFP-14 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDIP14, CERAMIC, DIP-14 |
| 包装说明 | TSOP1, | QCCN, | SOP, SOP14,.3 | SSOP, | DFP, | DIP, |
| Reach Compliance Code | unknown | unknown | compliant | compliant | unknown | unknown |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G14 | S-CQCC-N20 | R-PDSO-G14 | R-PDSO-G14 | R-GDFP-F14 | R-GDIP-T14 |
| 长度 | 4.4 mm | 8.89 mm | 10.2 mm | 6.2 mm | 9.21 mm | 19.56 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 20 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | TSOP1 | QCCN | SOP | SSOP | DFP | DIP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | FLATPACK | IN-LINE |
| 传播延迟（tpd） | 18.5 ns | 18.5 ns | 18.5 ns | 18.5 ns | 18.5 ns | 18.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 2.03 mm | 2 mm | 2 mm | 2.03 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING | FLAT | THROUGH-HOLE |
| 端子节距 | 0.4 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.6 mm | 8.89 mm | 5.3 mm | 5.3 mm | 6.29 mm | 7.62 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | - | QLCC | SOIC | - | DFP | DIP |
| 针数 | - | 20 | 14 | - | 14 | 14 |