描述 |
Logic Gates Dual 2-Input Pos |
NOR Gate 2-Element 2-IN CMOS 8-Pin VSSOP T/R |
Dual 2-Input Positive-NOR Gate 8-DSBGA -40 to 125 |
Logic Gates Dual 2 Input Pos NOR Gate |
Dual 2-Input Positive-NOR Gate 8-SM8 -40 to 125 |
NOR Gate 2-Element 2-IN CMOS 8-Pin SSOP T/R |
IC GATE NOR 2CH 2-INP 8DSBGA |
Brand Name |
Texas Instruments |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
- |
是否无铅 |
含铅 |
- |
不含铅 |
含铅 |
不含铅 |
- |
- |
是否Rohs认证 |
符合 |
- |
符合 |
符合 |
符合 |
- |
不符合 |
厂商名称 |
Texas Instruments(德州仪器) |
- |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
- |
Texas Instruments(德州仪器) |
零件包装代码 |
SOIC |
- |
BGA |
SOIC |
SOIC |
- |
BGA |
包装说明 |
VSSOP, TSSOP8,.12,20 |
- |
VFBGA, BGA8,2X4,20 |
VSSOP, TSSOP8,.12,20 |
LSSOP, SSOP8,.16 |
- |
VFBGA, BGA8,2X4,20 |
针数 |
8 |
- |
8 |
8 |
8 |
- |
8 |
Reach Compliance Code |
compli |
- |
compli |
compli |
compli |
- |
not_compliant |
系列 |
LVC/LCX/Z |
- |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
- |
LVC/LCX/Z |
JESD-30 代码 |
R-PDSO-G8 |
- |
R-PBGA-B8 |
R-PDSO-G8 |
R-PDSO-G8 |
- |
R-XBGA-B8 |
JESD-609代码 |
e4 |
- |
e1 |
e4 |
e4 |
- |
- |
长度 |
2.3 mm |
- |
1.9 mm |
2.3 mm |
2.95 mm |
- |
1.9 mm |
负载电容(CL) |
50 pF |
- |
50 pF |
50 pF |
50 pF |
- |
50 pF |
逻辑集成电路类型 |
NOR GATE |
- |
NOR GATE |
NOR GATE |
NOR GATE |
- |
NOR GATE |
最大I(ol) |
0.024 A |
- |
0.032 A |
0.024 A |
0.032 A |
- |
0.024 A |
湿度敏感等级 |
1 |
- |
1 |
1 |
1 |
- |
- |
功能数量 |
2 |
- |
2 |
2 |
2 |
- |
2 |
输入次数 |
2 |
- |
2 |
2 |
2 |
- |
2 |
端子数量 |
8 |
- |
8 |
8 |
8 |
- |
8 |
最高工作温度 |
125 °C |
- |
125 °C |
125 °C |
125 °C |
- |
85 °C |
最低工作温度 |
-40 °C |
- |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
输出特性 |
3-STATE |
- |
3-STATE |
3-STATE |
3-STATE |
- |
- |
封装主体材料 |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
UNSPECIFIED |
封装代码 |
VSSOP |
- |
VFBGA |
VSSOP |
LSSOP |
- |
VFBGA |
封装等效代码 |
TSSOP8,.12,20 |
- |
BGA8,2X4,20 |
TSSOP8,.12,20 |
SSOP8,.16 |
- |
BGA8,2X4,20 |
封装形状 |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
- |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
- |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
包装方法 |
TAPE AND REEL |
- |
TR |
TAPE AND REEL |
TR |
- |
TAPE AND REEL |
峰值回流温度(摄氏度) |
260 |
- |
260 |
260 |
260 |
- |
NOT SPECIFIED |
电源 |
3.3 V |
- |
3.3 V |
3.3 V |
3.3 V |
- |
3.3 V |
Prop。Delay @ Nom-Su |
4.9 ns |
- |
4.9 ns |
4.9 ns |
4.9 ns |
- |
- |
传播延迟(tpd) |
8.9 ns |
- |
8.9 ns |
8.9 ns |
8.9 ns |
- |
8.9 ns |
认证状态 |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
施密特触发器 |
NO |
- |
NO |
NO |
NO |
- |
NO |
座面最大高度 |
0.9 mm |
- |
0.5 mm |
0.9 mm |
1.3 mm |
- |
0.5 mm |
最大供电电压 (Vsup) |
5.5 V |
- |
5.5 V |
5.5 V |
5.5 V |
- |
5.5 V |
最小供电电压 (Vsup) |
1.65 V |
- |
1.65 V |
1.65 V |
1.65 V |
- |
1.65 V |
标称供电电压 (Vsup) |
1.8 V |
- |
1.8 V |
1.8 V |
1.8 V |
- |
1.8 V |
表面贴装 |
YES |
- |
YES |
YES |
YES |
- |
YES |
技术 |
CMOS |
- |
CMOS |
CMOS |
CMOS |
- |
CMOS |
温度等级 |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
- |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
- |
端子形式 |
GULL WING |
- |
BALL |
GULL WING |
GULL WING |
- |
BALL |
端子节距 |
0.5 mm |
- |
0.5 mm |
0.5 mm |
0.65 mm |
- |
0.5 mm |
端子位置 |
DUAL |
- |
BOTTOM |
DUAL |
DUAL |
- |
BOTTOM |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
宽度 |
2 mm |
- |
0.9 mm |
2 mm |
2.8 mm |
- |
0.9 mm |