型号
- 型号
- 关键词
| 型号 | SNJ54LS10W-00 | SNJ54LS10J-00 | SNJ54LS10W-10 | M38510/30005BCX | M38510/30005B2X | M38510/30005SDX | M38510/30005BDX | M38510/30005SCX |
|---|---|---|---|---|---|---|---|---|
| 描述 | LS SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14 | LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14 | IC LS SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, Gate | LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | LS SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 | LS SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14 | LS SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14 | LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Reach Compliance Code | unknown | unknown | unknown | compliant | compliant | compliant | compliant | compliant |
| 系列 | LS | LS | LS | LS | LS | LS | LS | LS |
| JESD-30 代码 | R-GDFP-F14 | R-GDIP-T14 | R-GDFP-F14 | R-GDIP-T14 | S-CQCC-N20 | R-GDFP-F14 | R-GDFP-F14 | R-GDIP-T14 |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 14 | 14 | 14 | 14 | 20 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DIP | DFP | DIP | QCCN | DFP | DFP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK | FLATPACK | IN-LINE |
| 传播延迟（tpd） | 15 ns | 15 ns | 15 ns | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Qualified | Qualified | Qualified | Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | YES | YES | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD | FLAT | FLAT | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| 负载电容（CL） | 15 pF | 15 pF | 15 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 最大电源电流（ICC） | 3.3 mA | 3.3 mA | 3.3 mA | 3.3 mA | 3.3 mA | 3.3 mA | 3.3 mA | - |
| 零件包装代码 | - | - | - | DIP | QLCC | DFP | DFP | DIP |
| 包装说明 | - | - | - | CERAMIC, DIP-14 | QCCN, | DFP, | DFP, | DIP, |
| 针数 | - | - | - | 14 | 20 | 14 | 14 | 14 |
FPGA/CPLD
微控制器 MCU
51单片机
stm32/stm8
嵌入式系统
LED专区