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®
SP3220E/EB/EU
+3.0V to +5.5V RS-232 Driver/Receiver Pair
■
Meets All EIA-232 and ITU V.28 Specifications
from a wide +3.0V to +5.5V power supply
EN
●
Interoperable with RS232 and V.28 at 2.7V
C1+
■
Supports High Serial DataRates:
●
120 kbps SP3220E
V+
●
250 kbps SP3220EB
C1-
●
1 Mbps
SP3220EU
■
1µA Low Power Shutdown Mode
C2+
■
Footprint Compatible with MAX3221E, ISL3221
C2-
■
4 x 0.1µF External Charge Pump Capacitors
■
Tri–State/Receiver Enable
V-
■
Improved ESD Specifications:
●
+15kV Human Body Model
R1IN
●
+15kV IEC1000-4-2 Air Discharge
●
+8kV IEC1000-4-2 Contact Discharge
1
2
3
4
5
6
7
8
SP3220
E/EB/EU
16 SHDN
15 V
CC
14 GND
13 T1OUT
12 No Connect
11 T1IN
10 No Connect
9
R1OUT
Available in Lead Free Packaging
DESCRIPTION
The
SP3220E
devices are RS-232 driver/receiver solutions intended for portable or hand-held
applications such as palmtop computers, instrumentation and consumer products. These
devices incorporate a high-efficiency charge-pump power supply that allows the
SP3220E
devices to deliver true RS-232 performance from a single power supply ranging from +3.0V
to +5.0V. This charge pump requires only 0.1µF capacitors in 3.3V operation. The ESD
tolerance of these devices is over
±15kV
for both Human Model and IEC1000-4-2 Air discharge
test methods. All devices have a low-power shutdown mode where the driver outputs and
charge pumps are disabled. During shutdown, the supply current falls to less than 1µA.
V
CC
C5
C1
+
+
0.1µF
2 C1+
0.1µF
4 C1-
5 C2+
0.1µF
6 C2-
11 T1IN
9 R1OUT
5k
1 EN
GND
14
*can be returned to
either V
CC
or GND
SHDN
16
15
V
CC
V+
3
*C3
7
C4
+
0.1µF
C2
+
SP3220
E/EB/EU
V-
+
0.1µF
LOGIC
INPUTS
LOGIC
OUTPUTS
T1OUT
R1IN
13
8
RS-232
OUTPUTS
RS-232
INPUTS
Date: 8/22/05
Date: 8/30/05
SP3220E/EB/EU
High ESD RS-232 Driver/Receiver
SP3220E/EB/EU
High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
© Copyright 2005 Sipex Corporation
1
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability and cause permanent damage to the
device.
V
CC
.............................................................-0.3V to +6.0V
V+ (NOTE 1)..............................................-0.3V to +7.0V
V- (NOTE 1).............................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...................................................+13V
I
CC
(DC V
CC
or GND current)..........................+100mA
Input Voltages
TxIN, EN, SHUTDOWN ................ -0.3V to V
CC
+0.3V
RxIN ................................................................... +25V
Output Voltages
TxOUT ............................................................. +13.2V
RxOUT ......................................... -0.3V to (V
CC
+0.3V)
Short-Circuit Duration
TxOUT ...................................................... Continuous
Storage Temperature ....................... -65°C to +150°C
Power Dissipation Per Package
16-pin SSOP (derate 9.69mW/
o
Cabove+70
o
C) ........ 775mW
16-pin TSSOP (derate 10.5mW/
o
C above +70
o
C) ..... 840mW
16-pin Wide SOIC (derate 11.2mW/
o
C above+70
o
C) 900mW
NOTE 1:
V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
SPECIFICATIONS
Unless otherwise noted, the following specifications apply for V
CC
= +3.0V to +5.0V with T
AMB
= T
MIN
to T
MAX
.
Typical Values apply at V
CC
= +3.3V or +5.0V and T
AMB
= 25
o
C, C1-4=0.1µF.
PARAMETER
DC CHARACTERISTICS
Supply Current
Shutdown Supply Current
0.3
1.0
1.0
10
mA
µA
no load, T
AMB
= +25
o
C, V
CC
= 3.3V, TxIN =
GND or V
CC
_____
SHDN = GND, T
AMB
= +25
o
C, V
CC
= +3.3V,
TxIN = GND or V
CC
MIN.
TYP.
MAX.
UNITS
CONDITIONS
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
Input Logic Threshold HIGH
Input Leakage Current
Output Leakage Current
Output Voltage LOW
Output Voltage HIGH
DRIVER OUTPUTS
Output Voltage Swing
Output Resistance
Output Short-Circuit Current
Output Leakage Current
±5.0
300
±3 5
±6 0
±25
±5.4
V
Ω
mA
µA
3k
Ω
load to ground at all driver outputs,
T
AMB
= +25
o
C
V
CC
= V+ = V- = GND, T
OUT
= +2V
V
OUT
= GND
V
OUT
= +12V,V
CC
= GND to 5.5V,drivers disabled
V
CC
-0.6
V
CC
-0.1
GND
2 .0
2 .4
± 0 .0 1
±0.05
± 1. 0
±1 0
0. 4
0. 8
V
V
V
µA
µA
V
V
TxIN, EN, SHDN, Note 2
V
CC
= 3.3V, Note 2
V
CC
= 5.0V, Note 2
__ _____
TxIN, EN, SHDN,
T
AMB
= +25
o
C V
IN
= GND to V
CC
Receivers Disabled V
OUT
= GND to V
CC
I
OUT
= 1.6mA
I
OUT
= -1.0mA
___ _______
NOTE 2:
Driver input hysteresis is typically 250mV.
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
Date: 8/22/05
2
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
SPECIFICATIONS (continued)
Unless otherwise noted, the following specifications apply for V
CC
= +3.0V to +5.0V with T
AMB
= T
MIN
to T
MAX
.
Typical Values apply at V
CC
= +3.3V or +5.0V and T
AMB
= 25
o
C, C1-4=0.1µF.
PARAMETER
RECEIVER INPUTS
Input Voltage Range
Input Threshold LOW
Input Threshold HIGH
Input Hysteresis
Input Resistance
TIMING CHARACTERISTICS
Data Rate SP3220E
Data Rate SP3220EB
Data Rate SP3220EU
Receiver Propagation Delay
Receiver Output Enable Time
Receiver Output Disable Time
Driver Skew
Receiver Skew
Transition-Region Slew Rate
90
120
250
1000
0.15
0.15
20 0
200
100
50
30
235
Kbps
Kbps
Kbps
µs
µs
ns
ns
ns
ns
V/
µs
V/
µs
| t
PHL
- t
PLH
|, T
AMB
= 25
o
C
| t
PHL
- t
PLH
|
V
CC
= 3.3V, R
L
= 3K
Ω
, T
AMB
= 25
o
C,
measurements taken from -3.0V to +3.0V
or +3.0V to -3.0V (SP3220E and EB)
(SP3220EU)
R
L
=3k
Ω
, C
L
=1000pF, one driver switching
R
L
=3k
Ω
, C
L
=1000pF
R
L
=3k
Ω
, C
L
= 250pF
t
PHL
, RxIN to RxOUT, C
L
= 150pF
t
PHL
, RxIN to RxOUT, C
L
= 150pF
3
-25
0.6
0.8
1.2
1.5
1.5
1.8
0. 3
5
7
2.4
2.4
+25
V
V
V
V
kΩ
V
CC
=3.3V
V
CC
=5.0V
V
CC
=3.3V
V
CC
=5.0V
MIN.
TYP.
MAX.
UNITS
CONDITIONS
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
3
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for V
CC
= +3.3V, 250kbps data rates, all drivers
loaded with 3k , 0.1µF charge pump capacitors, and T
AMB
= +25°C.
30
Transmitter Output
Voltage (V)
6
T1 at Full Data Rate
T2 at 1/16 Full Data Rate
T1+T2 Loaded with 3k/CLoad
25
Icc (mA)
125Kbps
4
2
0
-2
-4
-6
0
1000
T1 at 250Kbps
TxOUT +
20
60Kbps
15
10
5
0
0
1000
2000
3000
4000
5000
20Kbps
TxOUT -
Load Capacitance (pF)
2000
3000
4000
5000
Load Capacitance (pF)
Figure 1. I
CC
vs Load Capacitance for the SP3220EB.
Figure 2. Transmitter Output Voltage vs Load Capaci-
tance for the SP3220EB.
6
12
TxOUT +
Transmitter Output
Voltage (V)
2
0
-2
-4
-6
2.7
3
TxOUT -
Supply Current (mA)
4
10
8
6
4
2
0
2.7
T1 Loaded with 3K // 1000pf @ 250Kbps
3.5
4
Supply Voltage (V)
4.5
5
3
3.5
4
4.5
5
Supply Voltage (V)
Figure 3. Transmitter Output Voltage vs Supply Voltage
for the SP3220EB.
Figure 4. Supply Current vs Supply Voltage for the
SP3220EB.
25
Slew rate (V/µs)
20
15
10
5
0
0
500
1000
2000
3000
4000
5000
- Slew
+ Slew
40
1Mbps
30
2Mbps
500Kbps
Icc (mA)
20
10
0
0
250
500
1000
2000
3000
4000
Load Capacitance (pF)
Load Capacitance (pF)
Figure 5. Slew Rate vs Load Capacitance for the
SP3220EB.
Figure 4. Supply Current vs Supply Voltage for the
SP3220EU.
Date: 8/22/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
4
© Copyright 2005 Sipex Corporation
