SP4-5330-4,SP4-5330-4 pdf中文资料,SP4-5330-4引脚图,SP4-5330-4电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

SIPEX

包装说明

CERAMIC, LCC-20

Reach Compliance Code

unknown

标称采集时间

0.5 µs

放大器类型

SAMPLE AND HOLD CIRCUIT

最大模拟输入电压

10 V

最小模拟输入电压

-10 V

JESD-30 代码

S-CQCC-N20

负供电电压上限

-20 V

标称负供电电压 (Vsup)

-15 V

功能数量

端子数量

最高工作温度

85 °C

最低工作温度

-25 °C

封装主体材料

CERAMIC, METAL-SEALED COFIRED

封装代码

QCCN

封装形状

SQUARE

封装形式

CHIP CARRIER

认证状态

Not Qualified

采样并保持/跟踪并保持

SAMPLE

最大压摆率

21 mA

供电电压上限

20 V

标称供电电压 (Vsup)

15 V

表面贴装

YES

技术

BIPOLAR

温度等级

OTHER

端子形式

NO LEAD

端子位置

QUAD

参数对比

与SP4-5330-4相近的元器件有：SP4-5330/883、SP4-5330-5、SP4-5330-2、SP0-5330-5、SP1-5330/883。描述及对比如下：

型号	SP4-5330-4	SP4-5330/883	SP4-5330-5	SP4-5330-2	SP0-5330-5	SP1-5330/883
描述	Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CQCC20, CERAMIC, LCC-20	Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CQCC20, CERAMIC, LCC-20	Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CQCC20, CERAMIC, LCC-20	Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CQCC20, CERAMIC, LCC-20	Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, DIE	Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CDIP14, CERDIP-14
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	SIPEX	SIPEX	SIPEX	SIPEX	SIPEX	SIPEX
包装说明	CERAMIC, LCC-20	CERAMIC, LCC-20	CERAMIC, LCC-20	CERAMIC, LCC-20	DIE	CERDIP-14
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
标称采集时间	0.5 µs	0.5 µs	0.5 µs	0.5 µs	0.5 µs	0.5 µs
放大器类型	SAMPLE AND HOLD CIRCUIT	SAMPLE AND HOLD CIRCUIT	SAMPLE AND HOLD CIRCUIT	SAMPLE AND HOLD CIRCUIT	SAMPLE AND HOLD CIRCUIT	SAMPLE AND HOLD CIRCUIT
最大模拟输入电压	10 V	10 V	10 V	10 V	10 V	10 V
最小模拟输入电压	-10 V	-10 V	-10 V	-10 V	-10 V	-10 V
JESD-30 代码	S-CQCC-N20	S-CQCC-N20	S-CQCC-N20	S-CQCC-N20	R-XUUC-N8	R-CDIP-T14
负供电电压上限	-20 V	-20 V	-20 V	-20 V	-20 V	-20 V
标称负供电电压 (Vsup)	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
功能数量	1	1	1	1	1	1
端子数量	20	20	20	20	8	14
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN	QCCN	QCCN	QCCN	DIE	DIP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	UNCASED CHIP	IN-LINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
采样并保持/跟踪并保持	SAMPLE	SAMPLE	SAMPLE	SAMPLE	SAMPLE	SAMPLE
最大压摆率	21 mA	21 mA	23 mA	21 mA	23 mA	21 mA
供电电压上限	20 V	20 V	20 V	20 V	20 V	20 V
标称供电电压 (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V
表面贴装	YES	YES	YES	YES	YES	NO
技术	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE
端子位置	QUAD	QUAD	QUAD	QUAD	UPPER	DUAL
最高工作温度	85 °C	125 °C	75 °C	125 °C	-	125 °C
最低工作温度	-25 °C	-55 °C	-	-55 °C	-	-55 °C
温度等级	OTHER	MILITARY	COMMERCIAL EXTENDED	MILITARY	-	MILITARY