SPC584Gx, SPC58EGx,
SPC58NGx
32-bit Power Architecture microcontroller for automotive ASIL-D
applications
Datasheet
-
production data
eTQFP144 (20 x 20 x 1.0 mm)
eLQFP176 (24 x 24 x 1.4 mm)
FPBGA292 (17 x 17 x 1.8 mm)
– Logic BIST
– FCCU for collection and reaction to failure
notifications
– Memory BIST
– Cyclic redundancy check (CRC) unit
– Memory Error Management Unit (MEMU)
for collection and reporting of error events
in memories
•
Crossbar switch architecture for concurrent
access to peripherals, Flash, or RAM from
multiple bus masters with end-to-end ECC
•
Body cross triggering unit (BCTU)
– Triggers ADC conversions from any eMIOS
channel
– Triggers ADC conversions from up to 2
dedicated PIT_RTIs
•
Enhanced modular IO subsystem (eMIOS): up
to 64 timed IO channels with 16-bit counter
resolution
•
Enhanced analog-to-digital converter system
with:
– 4 independent fast 12-bit SAR analog
converters
– One supervisor 12-bit SAR analog
converter
– One standby 10-bit SAR analog converter
•
Communication interfaces:
– 18 LINFlexD modules
– 10 deserial serial peripheral interface
(DSPI) modules
– 8 MCAN interfaces with advanced shared
memory scheme and ISO CAN-FD support
– Dual-channel FlexRay controller
– Two independent Ethernet controllers
10/100Mbps compliant IEEE 802.3-2008
•
Low power capabilities
– Versatile low power modes
– Ultra low power standby with RTC
– Smart Wake-up Unit for contact monitoring
Features
•
AEC-Q100 qualified
•
High performance e200z4 triple core:
– 32-bit Power Architecture technology CPU
– Core frequency as high as 180 MHz
– Variable Length Encoding (VLE)
– Floating Point, End-to-End Error Correction
•
6582 KB (6144 KB code flash+ 256 KB data
flash) on-chip flash memory:
– supports read during program and erase
operations, and multiple blocks allowing
EEPROM emulation
– Supports read while read between the two
code Flash partitions.
•
608 KB on-chip general-purpose SRAM (in
addition to 160 KB core local data RAM): 64KB
in CPU_0, 64 KB in CPU_1 and 32 KB in
CPU_2
•
182 KB HSM dedicated flash memory (144 KB
code + 32 KB data)
•
Multi-channel direct memory access controller
(eDMA)
– one eDMA with 64 channels
– one eDMA with 32 channels
•
1 interrupt controller (INTC)
•
Comprehensive new generation ASIL-D safety
concept:
– ASIL-D of ISO 26262
– One CPU channel in lockstep
July 2019
This is information on a product in full production.
DS11758 Rev 6
1/139
www.st.com
SPC584Gx, SPC58EGx and SPC58NGx
– Fast wakeup schemes
•
Dual phase-locked loops with stable clock domain for peripherals and FM modulation
domain for computational shell
•
Nexus development interface (NDI) per IEEEISTO 5001-2003 standard, with some
support for 2010 standard
•
Boot assist Flash (BAF) supports factory programming using a serial bootload through the
asynchronous CAN or LIN/UART
•
Junction temperature range -40 °C to 150 °C
Table 1. Device summary
Part number
Package
Single core
4 MB
Dual core
Triple core
Single core
6 MB
Dual core
Triple core
eTQFP144 SPC584G80E5 SPC58EG80E5 SPC58NG80E5 SPC584G84E5 SPC58EG84E5 SPC58NG84E5
eLQFP176 SPC584G80E7 SPC58EG80E7 SPC58NG80E7 SPC584G84E7 SPC58EG84E7 SPC58NG84E7
FPBGA292 SPC584G80C3 SPC58EG80C3 SPC58NG80C3 SPC584G84C3 SPC58EG84C3 SPC58NG84C3
2/139
DS11758 Rev 6
SPC584Gx, SPC58EGx, SPC58NGx
Table of contents
Table of contents
1
2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
2.2
2.3
Device feature summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3
4
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 14
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.3.1
Power domains and power up/down sequencing . . . . . . . . . . . . . . . . . 21
Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Electromagnetic compatibility characteristics . . . . . . . . . . . . . . . . . . . . . . 23
Temperature profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Device consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
I/O pad specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.8.1
4.8.2
4.8.3
I/O input DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
I/O output DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
I/O pad current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.9
4.10
Reset pad (PORST, ESR0) electrical characteristics . . . . . . . . . . . . . . . . 39
PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
4.10.1
4.10.2
PLL0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Crystal oscillator 40 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Crystal Oscillator 32 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
RC oscillator 16 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Low power RC oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
ADC input description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
4.11
Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.11.1
4.11.2
4.11.3
4.11.4
4.12
ADC system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
4.12.1
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Table of contents
4.12.2
4.12.3
SPC584Gx, SPC58EGx, SPC58NGx
SAR ADC 12 bit electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . 50
SAR ADC 10 bit electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . 55
4.13
4.14
Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
LFAST pad electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.14.1
4.14.2
4.14.3
LFAST interface timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
LFAST and MSC/DSPILVDS interface electrical characteristics . . . . . . 60
LFAST PLL electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Power management integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Voltage regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Voltage monitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.15
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
4.15.1
4.15.2
4.15.3
4.16
4.17
Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
4.17.1
4.17.2
4.17.3
4.17.4
4.17.5
4.17.6
4.17.7
Debug and calibration interface timing . . . . . . . . . . . . . . . . . . . . . . . . . 78
DSPI timing with CMOS pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Ethernet timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
FlexRay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
CAN timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
UART timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
I2C timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
5
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
5.1
5.2
5.3
5.4
eLQFP176 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
5.1.1
5.2.1
5.3.1
5.4.1
5.4.2
5.4.3
5.4.4
Package mechanical drawings and data information . . . . . . . . . . . . . 111
Package mechanical drawings and data information . . . . . . . . . . . . . 116
Package mechanical drawings and data information . . . . . . . . . . . . . 119
eTQFP144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
LQFP176 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
FPBGA292 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
General notes for specifications at maximum junction temperature . . 122
eTQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
FPBGA292 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
6
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
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DS11758 Rev 6
SPC584Gx, SPC58EGx, SPC58NGx
Table of contents
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Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
DS11758 Rev 6
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