型号
- 型号
- 关键词
32-bit Embedded SuperH Device
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：ST(意法半导体)
厂商官网：http://www.st.com/
下载文档| 型号 | ST40RA150XHA | ST40RA200XH6 | ST40RA166XH6 | ST40RA166XH1 | ST40RA |
|---|---|---|---|---|---|
| 描述 | 32-bit Embedded SuperH Device | 32-bit Embedded SuperH Device | 32-bit Embedded SuperH Device | 32-bit Embedded SuperH Device | 32-bit Embedded SuperH Device |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 符合 | - |
| 零件包装代码 | BGA | BGA | BGA | BGA | - |
| 包装说明 | 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372 | 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372 | 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372 | 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372 | - |
| 针数 | 372 | 372 | 372 | 372 | - |
| Reach Compliance Code | _compli | _compli | compli | compli | - |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | - |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | - |
| 地址总线宽度 | 32 | 32 | 32 | 32 | - |
| 位大小 | 32 | 32 | 32 | 32 | - |
| 边界扫描 | YES | YES | YES | YES | - |
| 最大时钟频率 | 27 MHz | 27 MHz | 27 MHz | 27 MHz | - |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | - |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | - |
| 集成缓存 | YES | YES | YES | YES | - |
| JESD-30 代码 | S-PBGA-B372 | S-PBGA-B372 | S-PBGA-B372 | S-PBGA-B372 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | - |
| 长度 | 27 mm | 27 mm | 27 mm | 27 mm | - |
| 低功率模式 | YES | YES | YES | YES | - |
| 端子数量 | 372 | 372 | 372 | 372 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | BGA | BGA | BGA | BGA | - |
| 封装等效代码 | BGA372,20X20,50 | BGA372,20X20,50 | BGA372,20X20,50 | BGA372,20X20,50 | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 2.6 mm | 2.6 mm | 2.6 mm | 2.6 mm | - |
| 速度 | 150 MHz | 200 MHz | 166 MHz | 166 MHz | - |
| 最大供电电压 | 1.95 V | 1.95 V | 1.95 V | 1.95 V | - |
| 最小供电电压 | 1.65 V | 1.8 V | 1.65 V | 1.65 V | - |
| 标称供电电压 | 1.8 V | 1.87 V | 1.8 V | 1.8 V | - |
| 表面贴装 | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | - |
| 端子形式 | BALL | BALL | BALL | BALL | - |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 27 mm | 27 mm | 27 mm | 27 mm | - |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | - |