512X8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8
厂商名称:ST(意法半导体)
厂商官网:http://www.st.com/
下载文档型号 | ST95041B3 | ST95041B1 | ST95041M1TR | ST95041M3 | ST95041M3TR |
---|---|---|---|---|---|
描述 | 512X8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 512X8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 512X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 512X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 512X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | DIP | DIP | SOIC | SOIC | SOIC |
包装说明 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, | SOP, SOP8,.25 | SOP, |
针数 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
JESD-30 代码 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
长度 | 9.55 mm | 9.55 mm | 4.9 mm | 4.9 mm | 4.9 mm |
内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 |
字数 | 512 words | 512 words | 512 words | 512 words | 512 words |
字数代码 | 512 | 512 | 512 | 512 | 512 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | - | - | -40 °C | -40 °C |
组织 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.9 mm | 5.9 mm | 1.75 mm | 1.75 mm | 1.75 mm |
串行总线类型 | SPI | SPI | SPI | SPI | SPI |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm |
最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
是否无铅 | 含铅 | 含铅 | - | 含铅 | - |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | - |
数据保留时间-最小值 | 40 | 40 | - | 40 | - |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | - |
JESD-609代码 | e0 | e0 | - | e0 | - |
封装等效代码 | DIP8,.3 | DIP8,.3 | - | SOP8,.25 | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
电源 | 5 V | 5 V | - | 5 V | - |
最大待机电流 | 0.00005 A | 0.00005 A | - | 0.00005 A | - |
最大压摆率 | 0.002 mA | 0.002 mA | - | 0.002 mA | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | - |