STP6NC60 - STP6NC60FP
STB6NC60-1
N-CHANNEL 600V - 1Ω - 6A TO-220/TO-220FP/I2PAK
PowerMESH™II MOSFET
TYPE
STP(B)6NC60(-1)
STP6NC60FP
s
s
s
s
s
V
DSS
600 V
600 V
R
DS(on)
< 1.2
Ω
< 1.2
Ω
I
D
6A
6A
3
1
2
TYPICAL R
DS
(on) = 1.0
Ω
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
GATE CHARGE MINIMIZED
TO-220
TO-220FP
DESCRIPTION
The PowerMESH
™
II is the evolution of the first
generation of MESH OVERLAY
™.
The layout re-
finements introduced greatly improve the Ron*area
figure of merit while keeping the device at the lead-
ing edge for what concerns swithing speed, gate
charge and ruggedness.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
s
SWITH MODE POWER SUPPLIES (SMPS)
s
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVES
s
12
3
I
2
PAK
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
V
DS
V
DGR
V
GS
b
O
so
I
D
I
D
te
le
Drain-source Voltage (V
GS
= 0)
Drain-gate Voltage (R
GS
= 20 kΩ)
Gate- source Voltage
Drain Current (continuos) at T
C
= 25°C
Drain Current (continuos) at T
C
= 100°C
Drain Current (pulsed)
Total Dissipation at T
C
= 25°C
6
3.8
24
125
1.0
r
P
uc
od
s)
t(
bs
-O
et
l
o
P
e
od
r
s)
t(
uc
Parameter
Value
STP(B)6NC60(-1) STP6NC60FP
600
600
±30
6(*)
3.8(*)
24(*)
40
0.32
3
-
–65 to 150
150
(1)I
SD
≤6A,
di/dt
≤100A/µs,
V
DD
≤
V
(BR)DSS
, T
j
≤
T
JMAX.
Unit
V
V
V
A
A
A
W
W/°C
V/ns
2500
V
°C
°C
I
DM
(
q
)
P
TOT
Derating Factor
dv/dt (1)
V
ISO
T
stg
T
j
Peak Diode Recovery voltage slope
Insulation Withstand Voltage (DC)
Storage Temperature
Max. Operating Junction Temperature
(•)Pulse width limited by safe operating area
(*) Limited only by maximum temperature allowed
May 2001
1/10
STP6NC60/FP/STB6NC60-1
THERMAL DATA
TO-220/I
2
PAK
Rthj-case
Rthj-amb
Rthc-sink
T
l
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
1.0
62.5
0.5
300
TO-220FP
3.1
°C/W
°C/W
°C/W
°C
AVALANCHE CHARACTERISTICS
Symbol
I
AR
E
AS
Parameter
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
j
max)
Single Pulse Avalanche Energy
(starting T
j
= 25 °C, I
D
= I
AR
, V
DD
= 50 V)
Max Value
6
320
Unit
A
mJ
ELECTRICAL CHARACTERISTICS
(TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
V
(BR)DSS
I
DSS
I
GSS
Parameter
Drain-source
Breakdown Voltage
Zero Gate Voltage
Drain Current (V
GS
= 0)
Gate-body Leakage
Current (V
DS
= 0)
Test Conditions
I
D
= 250 µA, V
GS
= 0
V
DS
= Max Rating
V
DS
= Max Rating, T
C
= 125 °C
V
GS
= ±30V
Min.
600
Typ.
ON (1)
Symbol
V
GS(th)
R
DS(on)
I
D(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
On State Drain Current
V
DS
= V
GS
, I
D
= 250µA
DYNAMIC
Symbol
g
fs
(1)
C
iss
b
O
C
oss
C
rss
so
te
le
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
r
P
Parameter
uc
od
s)
t(
V
GS
= 10V, I
D
= 3 A
bs
-O
Test Conditions
et
l
o
P
e
Min.
2
od
r
Typ.
3
1.0
s)
t(
uc
Max.
1
50
±100
Max.
4
1.2
Unit
V
µA
µA
nA
Unit
V
Ω
A
V
DS
> I
D(on)
x R
DS(on)max,
V
GS
= 10V
6
Test Conditions
V
DS
> I
D(on)
x R
DS(on)max,
I
D
= 3A
V
DS
= 25V, f = 1 MHz, V
GS
= 0
Min.
Typ.
6.5
1020
145
21
Max.
Unit
S
pF
pF
pF
2/10
STP6NC60/FP/STB6NC60-1
ELECTRICAL CHARACTERISTICS
(CONTINUED)
SWITCHING ON
Symbol
t
d(on)
t
r
Q
g
Q
gs
Q
gd
Parameter
Turn-on Delay Time
Rise Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Test Conditions
V
DD
= 300 V, I
D
= 3 A
R
G
= 4.7Ω V
GS
= 10 V
(see test circuit, Figure 3)
V
DD
= 480V, I
D
= 6 A,
V
GS
= 10V
Min.
Typ.
16
14
35
5.5
17.2
45.5
Max.
Unit
ns
ns
nC
nC
nC
SWITCHING OFF
Symbol
t
r(Voff)
t
f
t
c
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Conditions
V
DD
= 480V, I
D
= 6 A,
R
G
= 4.7Ω, V
GS
= 10V
(see test circuit, Figure 5)
Min.
Typ.
13
16
23
Max.
Unit
ns
ns
SOURCE DRAIN DIODE
Symbol
I
SD
I
SDM
(2)
V
SD
(1)
t
rr
Q
rr
I
RRM
Parameter
Source-drain Current
Source-drain Current (pulsed)
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
= 6 A, V
GS
= 0
I
SD
= 6 A, di/dt = 100A/µs
V
DD
= 100V, T
j
= 150°C
(see test circuit, Figure 5)
Test Conditions
Min.
Typ.
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Safe Operating Area for TO-220/I2PAK
O
so
b
te
le
r
P
uc
od
s)
t(
so
b
-O
te
le
r
P
od
450
2.9
13
s)
t(
uc
Max.
6
A
24
1.6
A
V
A
ns
Unit
ns
µC
Safe Operating Area for TO-220FP
3/10
STP6NC60/FP/STB6NC60-1
Thermal Impedence for TO-220/I2PAK
Thermal Impedence for TO-220FP
Output Characteristics
Transfer Characteristics
Transconductance
O
so
b
te
le
r
P
uc
od
s)
t(
bs
-O
et
l
o
P
e
od
r
s)
t(
uc
Static Drain-source On Resistance
4/10
STP6NC60/FP/STB6NC60-1
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized Gate Threshold Voltage vs Temp.
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
O
so
b
te
le
r
P
uc
od
s)
t(
bs
-O
et
l
o
P
e
od
r
s)
t(
uc
5/10
