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STM32F101x6

STM32F101x8 STM32F101xB

Access line, advanced ARM-based 32-bit MCU with Flash memory,

six 16-bit timers, ADC and seven communication interfaces

Features

■

Core: ARM 32-bit Cortex™-M3 CPU

– 36 MHz maximum frequency,

1.25 DMIPS/MHz (Dhrystone 2.1)

performance at 0 wait state memory

access

– Single-cycle multiplication and hardware

division

Memories

– 32 to 128 Kbytes of Flash memory

– 6 to 16 Kbytes of SRAM

Clock, reset and supply management

– 2.0 to 3.6 V application supply and I/Os

– POR, PDR and programmable voltage

detector (PVD)

– 4-to-16 MHz crystal oscillator

– Internal 8 MHz factory-trimmed RC

– Internal 40 kHz RC

– PLL for CPU clock

– 32 kHz oscillator for RTC with calibration

Low power

– Sleep, Stop and Standby modes

– V

BAT

supply for RTC and backup registers

Debug mode

– Serial wire debug (SWD) and JTAG

interfaces

DMA

– 7-channel DMA controller

– Peripherals supported: timers, ADC, SPIs,

Cs and USARTs

1 × 12-bit, 1 µs A/D converter (up to 16

channels)

– Conversion range: 0 to 3.6 V

– Temperature sensor

Up to 80 fast I/O ports

– 26/37/51/80 I/Os, all mappable on 16

external interrupt vectors, all 5 V-tolerant

except for analog inputs

VFQFPN36

6 × 6 mm

LQFP48

7 x 7 mm

LQFP64

10 x 10 mm

LQFP100

14 x 14 mm

■

Up to 6 timers

– Up to three 16-bit timers, each with up to 4

IC/OC/PWM or pulse counter

– 2 watchdog timers (Independent and

Window)

– SysTick timer: 24-bit downcounter

Up to 7 communication interfaces

– Up to 2 x I

C interfaces (SMBus/PMBus)

– Up to 3 USARTs (ISO 7816 interface, LIN,

IrDA capability, modem control)

– Up to 2 SPIs (18 Mbit/s)

CRC calculation unit, 96-bit unique ID

ECOPACK

packages

Device summary

Root part number

STM32F101C6, STM32F101R6,

STM32F101T6

STM32F101C8, STM32F101R8

STM32F101V8, STM32F101T8

STM32F101RB, STM32F101VB,

STM32F101CB

■

Table 1.

Reference

STM32F101x6

STM32F101x8

STM32F101xB

■

May 2008

Rev 7

1/75

www.st.com

Contents

STM32F101x6, STM32F101x8, STM32F101xB

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1

2.2

2.3

Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Full compatibility throughout the family . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.1

Test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

5.2

5.3

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

5.3.1

5.3.2

5.3.3

5.3.4

5.3.5

5.3.6

5.3.7

5.3.8

5.3.9

5.3.10

5.3.11

5.3.12

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 29

Embedded reset and power control block characteristics . . . . . . . . . . . 30

Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 47

I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

2/75

STM32F101x6, STM32F101x8, STM32F101xB

5.3.13

5.3.14

5.3.15

5.3.16

5.3.17

Contents

NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

6.1

6.2

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

6.2.1

6.2.2

Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Evaluating the maximum junction temperature for an application . . . . . 69

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

7.1

Future family enhancements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

3/75

List of tables

STM32F101x6, STM32F101x8, STM32F101xB

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Table 30.

Table 31.

Table 32.

Table 33.

Table 34.

Table 35.

Table 36.

Table 37.

Table 38.

Table 39.

Table 40.

Table 41.

Table 42.

Table 43.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Device features and peripheral counts (STM32F101xx High-density

access line) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

STM32F101xx family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 30

Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Maximum current consumption in Run mode, code with data processing

running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Maximum current consumption in Run mode, code with data processing

running from RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Maximum current consumption in Sleep mode, code running from Flash or RAM. . . . . . . 33

Typical and maximum current consumptions in Stop and Standby modes . . . . . . . . . . . . 34

Typical current consumption in Run mode, code with data processing

running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Typical current consumption in Sleep mode, code with data processing

code running from Flash or RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Typical current consumption in Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

High-speed user external (HSE) clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Low-speed user external clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

HSE 4-16 MHz oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

LSE oscillator characteristics (

fLSE

= 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

SCL frequency (f

PCLK1

= 36 MHz, V

= 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

AIN

max for f

ADC

= 10 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

4/75

STM32F101x6, STM32F101x8, STM32F101xB

Table 44.

Table 45.

Table 46.

Table 47.

Table 48.

Table 49.

Table 50.

Table 51.

Table 52.

Table 53.

List of tables

ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . . 64

LQPF100 – 100-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . 65

LQFP64 – 64-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . 66

LQFP48 – 48-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . 67

Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

5/75

参数对比

与STM32F101T8U6AXX相近的元器件有：STM32F101CBT6AXX、STM32F101RBT6AXX、STM32F101C8T6AXX、STM32F101C6T6AXX、STM32F101R6T6AXX、STM32F101R8T6AXX、STM32F101V8T6AXX、STM32F101VBT6AXX。描述及对比如下：

型号	STM32F101T8U6AXX	STM32F101CBT6AXX	STM32F101RBT6AXX	STM32F101C8T6AXX	STM32F101C6T6AXX	STM32F101R6T6AXX	STM32F101R8T6AXX	STM32F101V8T6AXX	STM32F101VBT6AXX
描述	32-BIT, FLASH, 36MHz, RISC MICROCONTROLLER, QCC36, 6 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, VFQFPN-36	32-BIT, FLASH, 36MHz, RISC MICROCONTROLLER, PQFP48, 7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-48	32-BIT, FLASH, 36MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-64	32-BIT, FLASH, 36MHz, RISC MICROCONTROLLER, PQFP48, 7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-48	32-BIT, FLASH, 36MHz, RISC MICROCONTROLLER, PQFP48, 7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-48	32-BIT, FLASH, 36MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-64	32-BIT, FLASH, 36MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-64	32-BIT, FLASH, 36MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-100	32-BIT, FLASH, 36MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-100
厂商名称	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)
零件包装代码	QFN	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	HVQCCN,	LFQFP,	LFQFP,	LFQFP,	LFQFP, QFP48,.35SQ,20	LFQFP, QFP64,.47SQ,20	LFQFP,	LQFP,	LQFP,
针数	36	48	64	48	48	64	64	100	100
Reach Compliance Code	unknown	unknown	unknown	unknown	compliant	compliant	unknown	unknown	unknown
具有ADC	YES	YES	YES	YES	YES	YES	YES	YES	YES
位大小	32	32	32	32	32	32	32	32	32
最大时钟频率	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz
DAC 通道	NO	NO	NO	NO	NO	NO	NO	NO	NO
DMA 通道	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-XQCC-N36	S-PQFP-G48	S-PQFP-G64	S-PQFP-G48	S-PQFP-G48	S-PQFP-G64	S-PQFP-G64	S-PQFP-G100	S-PQFP-G100
长度	6 mm	7 mm	10 mm	7 mm	7 mm	10 mm	10 mm	14 mm	14 mm
I/O 线路数量	26	37	51	37	37	51	51	80	80
端子数量	36	48	64	48	48	64	64	100	100
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM 通道	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HVQCCN	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LQFP	LQFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM可编程性	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
座面最大高度	1 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
速度	36 MHz	36 MHz	36 MHz	36 MHz	36 MHz	36 MHz	36 MHz	36 MHz	36 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.8 mm	0.8 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
宽度	6 mm	7 mm	10 mm	7 mm	7 mm	10 mm	10 mm	14 mm	14 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC