型号
- 型号
- 关键词
Power Supply Management Circuit, Adjustable, 7 Channel, CMOS, PBGA64, 6 X 6 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, TFBGA-64
厂商名称：ST-Ericsson
下载文档| 型号 | STW4511BH)T/HF | STW4511BH)/HF |
|---|---|---|
| 描述 | Power Supply Management Circuit, Adjustable, 7 Channel, CMOS, PBGA64, 6 X 6 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, TFBGA-64 | Power Supply Management Circuit, Adjustable, 7 Channel, CMOS, PBGA64, 6 X 6 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, TFBGA-64 |
| 零件包装代码 | BGA | BGA |
| 包装说明 | TFBGA, BGA64,10X10,20 | TFBGA, BGA64,10X10,20 |
| 针数 | 64 | 64 |
| Reach Compliance Code | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 |
| 可调阈值 | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PBGA-B64 | S-PBGA-B64 |
| 长度 | 6 mm | 6 mm |
| 信道数量 | 7 | 7 |
| 功能数量 | 1 | 1 |
| 端子数量 | 64 | 64 |
| 最高工作温度 | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA |
| 封装等效代码 | BGA64,10X10,20 | BGA64,10X10,20 |
| 封装形状 | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 电源 | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm |
| 最大供电电流 (Isup) | 0.043 mA | 0.043 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.6 V | 3.6 V |
| 表面贴装 | YES | YES |
| 技术 | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL |
| 端子节距 | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM |
| 宽度 | 6 mm | 6 mm |
| Base Number Matches | 1 | 1 |