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SX8723E083TDT

IC das press/temp sens 12mlpd

器件类别:模拟混合信号IC    转换器   

厂商名称:SEMTECH

厂商官网:http://www.semtech.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
SEMTECH
零件包装代码
SOIC
包装说明
HVSON, SOLCC12,.16,20
针数
12
Reach Compliance Code
unknown
ECCN代码
EAR99
最大模拟输入电压
2.42 V
最小模拟输入电压
-2.42 V
转换器类型
ADC, PROPRIETARY METHOD
JESD-30 代码
S-PDSO-N12
长度
4 mm
最大线性误差 (EL)
0.0023%
模拟输入通道数量
5
位数
16
功能数量
1
端子数量
12
最高工作温度
125 °C
最低工作温度
-40 °C
输出位码
2\'S COMPLEMENT BINARY
输出格式
SERIAL
封装主体材料
PLASTIC/EPOXY
封装代码
HVSON
封装等效代码
SOLCC12,.16,20
封装形状
SQUARE
封装形式
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
2.5/5 V
认证状态
Not Qualified
采样速率
0.000485 MHz
座面最大高度
0.8 mm
标称供电电压
5 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子形式
NO LEAD
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
4 mm
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SX8723
ZoomingADC™ for Pressure and Temperature Sensing
ADVANCED COMMUNICATIONS & SENSING
Description
The SX8723 is a data acquisition system based on
Semtech’s low power ZoomingADC™ technology. It
directly connects most types of miniature sensors
with a general purpose microcontroller.
With 2 differential inputs, it can adapt to multiple
sensor systems. Its digital outputs are used to bias
or reset the sensing elements.
Features
Up to 16-bit differential data acquisition
Programmable gain: (1/12 to 1000)
Sensor offset compensation up to 15 times
full scale of input signal
2 differential or 4 single-ended signal inputs
Programmable Resolution versus Speed
versus Supply current
2 digital outputs to bias Sensors
Internal or external voltage reference
Internal time base
Low-power (250 uA for 16b @ 500 S/s)
2-wire interface
Applications
Industrial pressure sensing
Industrial temperature sensing
Barometer
Compass
Ordering Information
Device
Package
Reel quantity
3000
1000
SX8723E083TRT
MLPD-W-12 4x4
SX8723E083TDT
MLPD-W-12 4x4
1) Available in tape and reel only
2) Lead free, WEEE and RoHS compliant.
Functional Block Diagram
V1.8 © 2009 Semtech Corp.
1
www.semtech.com
SX8723
ZoomingADC™ for Pressure and Temperature Sensing
ADVANCED COMMUNICATIONS & SENSING
Table of Contents
Description..............................................................................................................................................................1
Applications............................................................................................................................................................1
Features ..................................................................................................................................................................1
Ordering Information .............................................................................................................................................1
Functional Block Diagram.....................................................................................................................................1
Absolute Maximum Ratings ..................................................................................................................................4
Electrical Characteristics ......................................................................................................................................5
ZoomingADC Specifications.................................................................................................................................6
Timing Characteristics ..........................................................................................................................................8
2-WIRE Timing Waveforms ...................................................................................................................................8
Pin Configuration ...................................................................................................................................................9
Marking Information...............................................................................................................................................9
Pin Description .......................................................................................................................................................9
Circuit Description ...............................................................................................................................................10
General Description .............................................................................................................................................. 10
Block Diagram ....................................................................................................................................................... 10
VREF ..................................................................................................................................................................... 10
GPIO ..................................................................................................................................................................... 11
Charge Pump ........................................................................................................................................................ 12
RC Oscillator ......................................................................................................................................................... 13
2-WIRE.................................................................................................................................................................. 14
2-WIRE Communication Format ........................................................................................................................... 14
2-WIRE Address.................................................................................................................................................... 14
ZoomingADC ........................................................................................................................................................15
Features ................................................................................................................................................................ 15
Overview ............................................................................................................................................................... 15
ZADC Description.................................................................................................................................................. 15
Acquisition Chain................................................................................................................................................... 15
Registers ............................................................................................................................................................... 17
ZADC Detailed Functionality Description .............................................................................................................. 18
Continuous-Time vs. On-Request......................................................................................................................... 18
Input Multiplexers .................................................................................................................................................. 19
Programmable Gain Amplifiers ............................................................................................................................. 20
PGA & ADC Enabling............................................................................................................................................ 21
PGA1 ..................................................................................................................................................................... 21
PGA2 ..................................................................................................................................................................... 21
PGA3 ..................................................................................................................................................................... 21
ADC Characteristics .............................................................................................................................................. 22
Conversion Sequence ........................................................................................................................................... 22
Over-Sampling Frequency .................................................................................................................................... 22
Over-Sampling Ratio ............................................................................................................................................. 23
Elementary Conversions ....................................................................................................................................... 23
Resolution ............................................................................................................................................................. 24
Conversion Time and Throughput......................................................................................................................... 25
Output Code Format ............................................................................................................................................. 26
Power Saving Modes ............................................................................................................................................ 27
Registers Map ....................................................................................................................................................... 28
Registers Descriptions .......................................................................................................................................... 28
RC Register........................................................................................................................................................... 28
GPIO Registers ..................................................................................................................................................... 29
ZADC Registers .................................................................................................................................................... 30
Mode Register ....................................................................................................................................................... 31
Optional Operating Modes: External Voltage Reference Option .......................................................................... 32
Application Hints..................................................................................................................................................33
Recommended Operation Mode and Registers Settings...................................................................................... 33
Operation Mode..................................................................................................................................................... 33
V1.8 © 2009 Semtech Corp.
www.semtech.com
2
SX8723
ZoomingADC™ for Pressure and Temperature Sensing
ADVANCED COMMUNICATIONS & SENSING
Registers Settings ................................................................................................................................................. 33
Schematic.............................................................................................................................................................. 34
Input Impedance.................................................................................................................................................... 35
Switched Capacitor Principle ................................................................................................................................ 36
PGA Settling or Input Channel Modifications ........................................................................................................ 37
PGA Gain & Offset, Linearity and Noise ............................................................................................................... 37
Frequency Response ............................................................................................................................................ 38
Power Reduction ................................................................................................................................................... 39
Recommended Design for Other 2-WIRE Devices Connection ........................................................................... 39
Typical Performance ............................................................................................................................................40
Linearity ................................................................................................................................................................. 40
Integral Non-Linearity............................................................................................................................................ 40
Differential Non-Linearity....................................................................................................................................... 43
Noise ..................................................................................................................................................................... 44
Gain Error and Offset Error ................................................................................................................................... 46
Power Consumption .............................................................................................................................................. 47
PCB Layout Considerations................................................................................................................................49
How to Evaluate....................................................................................................................................................49
Package Outline Drawing: MLPD-W-12 4x4.......................................................................................................50
Land Pattern Drawing: MLPD-W-12 4x4.............................................................................................................51
Tape and Reel Specification ...............................................................................................................................52
V1.8 © 2009 Semtech Corp.
3
www.semtech.com
SX8723
ZoomingADC™ for Pressure and Temperature Sensing
ADVANCED COMMUNICATIONS & SENSING
Absolute Maximum Ratings
Exceeding the specifications below may result in permanent damage to the device or device malfunction.
Operation outside the parameters specified in the Electrical Characteristics section is not implied.
Parameter
Power supply
Storage temperature
Temperature under bias
Max sensor common mode
Input voltage
Peak reflow temperature
T
PKG
Notes:
This device is ESD sensitive. Use of standard ESD handling precautions is required.
Symbol
V
BATT
T
STORE
T
BIAS
V
VR_P
V
VR_N
Comments / Conditions
Min
V
SS
- 0.3
-55
-40
V
SS
- 300
V
SS
- 300
Max
5.7
150
140
V
BATT
+ 300
V
BATT
+ 300
260
Unit
V
°
C
°
C
mV
mV
°
C
V1.8 © 2009 Semtech Corp.
4
www.semtech.com
SX8723
ZoomingADC™ for Pressure and Temperature Sensing
ADVANCED COMMUNICATIONS & SENSING
Electrical Characteristics
All values are valid within the operating conditions unless otherwise specified.
Parameter
Operating conditions
Power supply
Operating temperature
V
BATT
T
OP
2.4
-40
5.5
125
V
°C
Symbol
Comments / Conditions
Min
Typ
Max
Unit
Current consumption
Active current, @ 30 ° 5.5 V
C,
I
OP
16 b @ 250 Sample/s
ADC, f
s
= 125 kHz
16 b @ 1 kSample/s
PGA3 + ADC, f
s
= 500 kHz
16 b + gain 1000 @ 1 kSample/s
PGA3,2,1 + ADC, f
s
= 500kHz
Active current, @ 30 ° 3.3 V
C,
I
OP
16 b @ 250 Sample/s
PGA3 + ADC, f
s
= 125 kHz
16 b @ 1 kSample/s
PGA3 + ADC, f
s
= 500 kHz
16 b + gain 1000 @ 1 kSample/s
PGA3,2,1 + ADC, f
s
= 500kHz
Sleep current
I
sleep
@ 30 °
C
up to 85 °
C
@125 °
C
250
700
1000
150
300
850
75
100
150
200
nA
300
800
1200
µA
µA
Time base
Max ADC over-sampling frequency
Min ADC over-sampling frequency
F
Smax
F
Smin
@ 25 °
C
@ 25 °
C
450
56.25
500
62.5
550
68.75
kHz
kHz
Digital I/O
Input logic high
Input logic low
Output logic high
Output logic low
V
IH
V
IL
V
OH
V
OL
I
OH
< 4mA
I
OL
< 4mA
0.4
0.7
0.3
V
BATT
-0.4
V
BATT
V
BATT
V
V
VREF: Internal Bandgap Reference
Absolute output voltage
Variation over Temperature
Total Output Noise
V
BATT
> 3V
V
BATT
> 3V, ref to 25° C
V
BATT
> 3V, rms, broadband
1.19
-1
1.22
1.25
+1
1
V
%
mV
V1.8 © 2009 Semtech Corp.
5
www.semtech.com
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参数对比
与SX8723E083TDT相近的元器件有:SX8723E083TRT。描述及对比如下:
型号 SX8723E083TDT SX8723E083TRT
描述 IC das press/temp sens 12mlpd IC das pressure/temp sens 12mlpd
是否Rohs认证 符合 符合
厂商名称 SEMTECH SEMTECH
零件包装代码 SOIC SOIC
包装说明 HVSON, SOLCC12,.16,20 HVSON, SOLCC12,.16,20
针数 12 12
Reach Compliance Code unknown unknown
ECCN代码 EAR99 EAR99
最大模拟输入电压 2.42 V 2.42 V
最小模拟输入电压 -2.42 V -2.42 V
转换器类型 ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD
JESD-30 代码 S-PDSO-N12 S-PDSO-N12
长度 4 mm 4 mm
最大线性误差 (EL) 0.0023% 0.0023%
模拟输入通道数量 5 5
位数 16 16
功能数量 1 1
端子数量 12 12
最高工作温度 125 °C 125 °C
最低工作温度 -40 °C -40 °C
输出位码 2\'S COMPLEMENT BINARY 2\'S COMPLEMENT BINARY
输出格式 SERIAL SERIAL
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVSON HVSON
封装等效代码 SOLCC12,.16,20 SOLCC12,.16,20
封装形状 SQUARE SQUARE
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度) NOT SPECIFIED 260
电源 2.5/5 V 2.5/5 V
认证状态 Not Qualified Not Qualified
采样速率 0.000485 MHz 0.000485 MHz
座面最大高度 0.8 mm 0.8 mm
标称供电电压 5 V 5 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE
端子形式 NO LEAD NO LEAD
端子节距 0.5 mm 0.5 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 4 mm 4 mm
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