TDA1308
Class-AB stereo headphone driver
Rev. 5 — 14 March 2011
Product data sheet
1. General description
The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or
a TSSOP8 plastic package. The device is fabricated in a 1
μm
Complementary Metal
Oxide Semiconductor (CMOS) process and has been primarily developed for portable
digital audio applications.
2. Features and benefits
Wide temperature range
No switch ON/OFF clicks
Excellent power supply ripple rejection
Low power consumption
Short-circuit resistant
High performance
High signal-to-noise ratio
High slew rate
Low distortion
Large output voltage swing
3. Quick reference data
Table 1.
Quick reference data
V
DD
= 5 V; V
SS
= 0 V; T
amb
= 25
°
C; f
i
= 1 kHz; R
L
= 32
Ω
; unless otherwise specified.
Symbol
V
DD
V
SS
I
DD
P
tot
P
o
THD+N
Parameter
supply voltage
negative supply
voltage
supply current
total power
dissipation
output power
total harmonic
distortion-plus-noise
R
L
= 5 kΩ
S/N
signal-to-noise ratio
Conditions
single supply
dual supply
dual supply
no load
no load
maximum; THD+N < 0.1 %
[1]
[1]
[1]
Min
3.0
1.5
−1.5
-
-
-
-
-
-
100
Typ
5.0
2.5
−2.5
3
15
40
0.03
−70
−101
110
Max
7.0
3.5
−3.5
5
25
80
0.06
−65
-
-
Unit
V
V
V
mA
mW
mW
%
dB
dB
dB
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
Table 1.
Quick reference data
…continued
V
DD
= 5 V; V
SS
= 0 V; T
amb
= 25
°
C; f
i
= 1 kHz; R
L
= 32
Ω
; unless otherwise specified.
Symbol
α
cs
PSRR
T
amb
[1]
Parameter
channel separation
Conditions
R
L
= 5 kΩ
[1]
Min
-
-
-
−40
Typ
70
105
90
-
Max
-
-
-
+85
Unit
dB
dB
dB
°C
power supply ripple
rejection
ambient temperature
f
i
= 100 Hz;
V
ripple(p-p)
= 100 mV
V
DD
= 5 V; V
o(p-p)
= 3.5 V (at 0 dB).
4. Ordering information
Table 2.
Ordering information
Package
Name
TDA1308T
TDA1308TT
SO8
TSSOP8
Description
plastic small outline package; 8 leads; body width
3.9 mm
plastic thin shrink small outline package; 8 leads;
body width 3 mm
Version
SOT96-1
SOT505-1
Type number
5. Block diagram
OUTA
INA-
INA+
1
2
3
TDA1308
8
V
DD
7
6
5
mka779
OUTB
INB-
INB+
V
SS
4
Fig 1.
Block diagram
TDA1308
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
2 of 17
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
6. Pinning information
6.1 Pinning
TDA1308
OUTA
INA-
INA+
V
SS
1
2
3
4
001aaf782
8
7
6
5
V
DD
OUTB
INB-
INB+
Fig 2.
Pin configuration
6.2 Pin description
Table 3.
Symbol
OUTA
INA−
INA+
V
SS
INB+
INB−
OUTB
V
DD
Pin description
Pin
1
2
3
4
5
6
7
8
Description
output A
inverting input A
non-inverting input A
negative supply
non-inverting input B
inverting input B
output B
positive supply
7. Internal circuitry
V
DD
I
1
INA/B+
M1
M2
A1
M3
INA/B-
OUTA/B
Cm
M4
D1
D2
D3
D4
M5
A2
M6
V
SS
mka781
Fig 3.
TDA1308
Equivalent schematic diagram
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
3 of 17
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
V
DD
t
sc
T
stg
T
amb
V
ESD
supply voltage
short-circuit duration time
storage temperature
ambient temperature
electrostatic discharge
voltage
HBM
MM
[1]
[2]
Conditions
output; T
amb
= 25
°C;
P
tot
= 1 W
Min
0
20
−65
−40
−2
−200
Max
8.0
-
+150
+85
+2
+200
Unit
V
s
°C
°C
kV
V
[1]
[2]
Human body model (HBM): C = 100 pF; R = 1500
Ω;
3 pulses positive plus 3 pulses negative.
Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0
Ω;
3 pulses positive plus 3 pulses negative.
9. Thermal characteristics
Table 5.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction
to ambient
Conditions
SO8
TSSOP8
Typ
210
220
Unit
K/W
K/W
TDA1308
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
4 of 17
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
10. Characteristics
Table 6.
Characteristics
V
DD
= 5 V; V
SS
= 0 V; T
amb
= 25
°
C; f
i
= 1 kHz; R
L
= 32
Ω
; unless otherwise specified.
Symbol
Supplies
V
DD
V
SS
I
DD
P
tot
|V
I(offset)
|
I
IB
V
cm
G
v(ol)
I
O
R
o
ΔV
O
supply voltage
negative supply voltage
supply current
total power dissipation
input offset voltage
input bias current
common-mode voltage
open-loop voltage gain
output current
output resistance
output voltage variation
R
L
= 16
Ω
R
L
= 5 kΩ
α
cs
PSRR
C
L
THD+N
channel separation
R
L
= 5 kΩ
power supply ripple rejection f
i
= 100 Hz; V
ripple(p-p)
= 100 mV
load capacitance
total harmonic
distortion-plus-noise
R
L
= 5 kΩ
R
L
= 5 kΩ
S/N
f
1
P
o
C
i
SR
B
[1]
[2]
[2]
[2]
[2]
[2]
[1]
Parameter
Conditions
single supply
dual supply
dual supply
no load
no load
Min
3.0
1.5
−1.5
-
-
-
-
0
Typ
5.0
2.5
−2.5
3
15
10
10
-
70
60
0.25
-
-
-
70
105
90
-
0.03
−70
−101
0.0009
110
5.5
40
3
5
20
Max
7.0
3.5
−3.5
5
25
-
-
3.5
-
-
-
4.25
3.5
4.9
-
-
-
200
0.06
−65
-
-
-
-
80
-
-
-
Unit
V
V
V
mA
mW
mV
pA
pA
dB
mA
Ω
V
V
V
dB
dB
dB
pF
%
dB
dB
%
dB
MHz
mW
pF
V/μs
kHz
Static characteristics
R
L
= 5 kΩ
maximum
THD+N < 0.1 %
[1]
[1]
[1]
-
-
-
0.75
1.5
0.1
-
-
-
-
-
-
-
-
100
-
-
-
-
-
Dynamic characteristics
signal-to-noise ratio
unity gain frequency
output power
input capacitance
slew rate
bandwidth
unity gain inverting
unity gain inverting
open-loop; R
L
= 5 kΩ
maximum; THD+N < 0.1 %
Values are proportional to V
DD
; THD+N < 0.1 %.
V
DD
= 5 V; V
o(p-p)
= 3.5 V (at 0 dB).
TDA1308
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
5 of 17
