INTEGRATED CIRCUITS
DATA SHEET
TDA8002C
IC card interface
Product specification
Supersedes data of 1999 Feb 24
File under Integrated Circuits, IC02
1999 Oct 12
Philips Semiconductors
Product specification
IC card interface
FEATURES
•
Single supply voltage interface (3.3 or 5 V environment)
•
Low-power sleep mode
•
Three specific protected half-duplex bidirectional
buffered I/O lines
•
V
CC
regulation 5 V
±5%
or 3 V
±5%,
I
CC
< 55 mA for
V
DD
= 3.0 to 6.5 V, with controlled rise and fall times
•
Thermal and short-circuit protections with current
limitations
•
Automatic ISO 7816 activation and deactivation
sequences
•
Enhanced ESD protections on card side (>6 kV)
•
Clock generation for the card up to 12 MHz with
synchronous frequency changes
•
Clock generation up to 20 MHz (external clock)
•
Synchronous and asynchronous cards (memory and
smart cards)
•
ISO 7816, GSM11.11 compatibility and EMV
(Europay, MasterCard® and Visa) compliant
•
Step-up converter for V
CC
generation
•
Supply supervisor for spikes elimination and emergency
deactivation
•
Chip select input for easy use of several TDA8002Cs in
parallel.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
MARKING
TDA8002CT/A/C1
TDA8002CT/B/C1
TDA8002CT/C/C1
TDA8002CG/C1
TDA8002CT/A
TDA8002CT/B
TDA8002CT/C
TDA8002C
LQFP32
plastic low profile quad flat package; 32 leads;
body 5
×
5
×
1.4 mm
NAME
SO28
DESCRIPTION
APPLICATIONS
IC card readers for:
•
GSM applications
•
Banking
•
Electronic payment
•
Identification
•
Pay TV
•
Road tolling.
GENERAL DESCRIPTION
TDA8002C
The TDA8002C is a complete low-power analog interface
for asynchronous and synchronous cards. It can be placed
between the card and the microcontroller. It performs all
supply, protection and control functions. It is directly
compatible with ISO 7816, GSM11.11 and EMV
specifications.
VERSION
SOT136-1
plastic small outline package; 28 leads; body width
7.5 mm
SOT401-1
1999 Oct 12
2
Philips Semiconductors
Product specification
IC card interface
QUICK REFERENCE DATA
SYMBOL
Supplies
V
DD
I
DD(lp)
I
DD(idle)
I
DD(active)
supply voltage
supply current
supply current
supply current
low-power
Idle mode; f
CLKOUT
= 10 MHz
active mode; V
CC(O)
= 5 V;
f
CLKOUT
= 10 MHz
f
CLK
= LOW; I
CC
= 100
µA
f
CLK
= 5 MHz; I
CC
= 10 mA
f
CLK
= 5 MHz; I
CC
= 55 mA
active mode; V
CC(O)
= 3 V;
f
CLKOUT
= 10 MHz
f
CLK
= LOW; I
CC
= 100
µA
f
CLK
= 5 MHz; I
CC
= 10 mA
f
CLK
= 5 MHz; I
CC
= 55 mA
Card supply
V
CC(O)
output voltage
active mode for V
CC
= 5 V
I
CC
< 55 mA; DC load
I
CC
= 40 nAs; AC load
active mode for V
CC
= 3 V
I
CC
< 55 mA; DC load
I
CC
= 40 nAs; AC load
General
f
CLK
t
de
P
tot
card clock frequency
deactivation sequence duration
continuous total power dissipation
TDA8002CT/x
TDA8002CG
T
amb
ambient temperature
T
amb
=
−25
to +85
°C
T
amb
=
−25
to +85
°C
−
−
−25
−
−
−
0
60
−
80
2.76
2.76
−
−
4.6
4.6
−
−
−
−
−
−
−
−
−
−
−
−
−
−
3.0
−
−
−
−
−
PARAMETER
CONDITIONS
MIN.
TDA8002C
TYP.
MAX.
UNIT
6.5
150
5
V
µA
mA
8
50
140
mA
mA
mA
8
50
140
mA
mA
mA
5.4
5.4
3.24
3.24
V
V
V
V
12
100
0.56
0.46
+85
MHz
µs
W
W
°C
1999 Oct 12
3
Philips Semiconductors
Product specification
IC card interface
BLOCK DIAGRAM
TDA8002C
handbook, full pagewidth
VDDD
100 nF
VDDA
100 nF
470 nF
S1
S2
12
28
SUPPLY
13
14
STEP-UP CONVERTER
ALARM
4
INTERNAL
REFERENCE
Vref
INTERNAL OSCILLATOR
2.5 MHz
11 AGND
VOLTAGE SENSE
3
EN1
CLKUP
15 VUP
470 nF
CS
OFF
26
ALARM
EN2
PVCC
VCC
GENERATOR
23
100
nF
22
RST
VCC
100
nF
RSTIN
CMDVCC
MODE
CV/TV
CLKDIV1
CLKDIV2
CLKSEL
STROBE
25
24
27
19
6
7
5
8
CLOCK
CIRCUITRY
LATCH
EN4
EN5
SEQUENCER
RST
BUFFER
CLOCK
BUFFER
21
18
CLK
PRES
CLKOUT
9
CLK
30
31
OSCILLATOR
EN3
THERMAL
PROTECTION
XTAL1
XTAL2
AUX1UC
1
I/O
TRANSCEIVER
20
AUX1
TDA8002CG
AUX2UC
2
I/O
TRANSCEIVER
17
AUX2
I/OUC
32
I/O
TRANSCEIVER
16
I/O
10
DGND1
29
DGND2
FCE246
Fig.1 Block diagram.
1999 Oct 12
4
Philips Semiconductors
Product specification
IC card interface
PINNING
PIN
SYMBOL
XTAL1
XTAL2
I/OUC
AUX1UC
AUX2UC
CS
TYPE
CT/A
1
2
3
4
5
−
TYPE
CT/B
1
2
3
4
−
5
TYPE
CT/C
1
2
3
4
−
5
TYPE
CG
30
31
32
1
2
3
I/O
I
O
I/O
I/O
I/O
I
DESCRIPTION
crystal connection or input for external clock
crystal connection
data I/O line to and from microcontroller
TDA8002C
auxiliary line 1 to and from microcontroller for synchronous
applications
auxiliary line 2 to and from microcontroller for synchronous
applications
chip select control input for enabling pins I/OUC, AUX1UC,
AUX2UC, CLKSEL, CLKDIV1, CLKDIV2, STROBE, CV/TV,
CMDVCC, RSTIN, OFF and MODE; note 1
open drain PMOS reset output for microcontroller (active
HIGH)
control input signal for CLK (LOW = XTAL oscillator;
HIGH = STROBE input)
control input with CLKDIV2 for choosing CLK frequency
control input with CLKDIV1 for choosing CLK frequency
external clock input for synchronous applications
clock output (see Table 1)
ALARM
CLKSEL
CLKDIV1
CLKDIV2
STROBE
CLKOUT
DGND1
AGND
S2
V
DDA
S1
VUP
I/O
AUX2
PRES
PRES
CV/TV
AUX1
CLK
RST
V
CC
CMDVCC
RSTIN
OFF
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
−
−
21
22
23
24
25
26
27
6
7
8
9
10
11
12
13
14
15
16
17
18
−
19
20
−
21
22
23
24
25
26
27
6
7
8
9
10
11
12
13
14
15
16
17
18
−
19
−
20
21
22
23
24
25
26
27
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
−
19
20
21
22
23
24
25
26
O
I
I
I
I
O
supply digital ground 1
supply analog ground
I/O
I/O
I/O
I/O
I/O
I
I
I
I/O
O
O
O
I
I
O
capacitance connection for voltage doubler
capacitance connection for voltage doubler
output of voltage doubler
data I/O line to and from card
auxiliary I/O line to and from card
card input presence contact (active LOW)
active HIGH card input presence contact
card voltage selection input line (high = 5 V, low = 3 V); note 1
auxiliary I/O line to and from card
clock to card output (C3I) (see Table 1)
card reset output (C2I)
supply for card (C1I)
start activation sequence input from microcontroller (active
LOW)
card reset input from microcontroller
open-drain NMOS interrupt output to microcontroller (active
LOW)
supply analog supply voltage
1999 Oct 12
5
嵌入式系统
