描述 |
Audio Amplifiers 2X15W BTL CLASS D |
Audio Amplifiers 2X15W BTL CLASS D |
音频放大器 2X15W BTL CLASS D |
Source Url Status Check Date |
2013-06-14 00:00:00 |
- |
2013-06-14 00:00:00 |
Brand Name |
NXP Semiconductor |
- |
NXP Semiconductor |
零件包装代码 |
TSSOP |
- |
TSSOP |
包装说明 |
TSSOP, TSSOP32,.3 |
- |
HTSSOP, TSSOP32,.3 |
针数 |
32 |
- |
32 |
Reach Compliance Code |
unknown |
- |
unknown |
ECCN代码 |
EAR99 |
- |
EAR99 |
其他特性 |
IT CAN ALSO OPERATE WITH 10V TO 36V SINGLE SUPPLY |
- |
IT CAN ALSO OPERATE WITH 10V TO 36V SINGLE SUPPLY |
标称带宽 |
20 kHz |
- |
20 kHz |
商用集成电路类型 |
AUDIO AMPLIFIER |
- |
AUDIO AMPLIFIER |
增益 |
36 dB |
- |
36 dB |
JESD-30 代码 |
R-PDSO-G32 |
- |
R-PDSO-G32 |
JESD-609代码 |
e3 |
- |
e4 |
长度 |
11 mm |
- |
11 mm |
信道数量 |
2 |
- |
2 |
功能数量 |
1 |
- |
1 |
端子数量 |
32 |
- |
32 |
最高工作温度 |
85 °C |
- |
85 °C |
最低工作温度 |
-40 °C |
- |
-40 °C |
标称输出功率 |
55 W |
- |
55 W |
封装主体材料 |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
封装代码 |
TSSOP |
- |
HTSSOP |
封装等效代码 |
TSSOP32,.3 |
- |
TSSOP32,.3 |
封装形状 |
RECTANGULAR |
- |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
电源 |
22 V |
- |
22 V |
认证状态 |
Not Qualified |
- |
Not Qualified |
座面最大高度 |
1.1 mm |
- |
1.1 mm |
最大压摆率 |
50 mA |
- |
50 mA |
最大供电电压 (Vsup) |
18 V |
- |
18 V |
最小供电电压 (Vsup) |
5 V |
- |
5 V |
表面贴装 |
YES |
- |
YES |
温度等级 |
INDUSTRIAL |
- |
INDUSTRIAL |
端子面层 |
TIN |
- |
NICKEL PALLADIUM GOLD |
端子形式 |
GULL WING |
- |
GULL WING |
端子节距 |
0.65 mm |
- |
0.65 mm |
端子位置 |
DUAL |
- |
DUAL |
宽度 |
6.1 mm |
- |
6.1 mm |
Base Number Matches |
1 |
- |
1 |